JPS59176150U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS59176150U
JPS59176150U JP1983070394U JP7039483U JPS59176150U JP S59176150 U JPS59176150 U JP S59176150U JP 1983070394 U JP1983070394 U JP 1983070394U JP 7039483 U JP7039483 U JP 7039483U JP S59176150 U JPS59176150 U JP S59176150U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
wiring board
hybrid integrated
stopper member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983070394U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311721Y2 (OSRAM
Inventor
史 伊藤
幸二 田中
園部　俊夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983070394U priority Critical patent/JPS59176150U/ja
Publication of JPS59176150U publication Critical patent/JPS59176150U/ja
Application granted granted Critical
Publication of JPS6311721Y2 publication Critical patent/JPS6311721Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1983070394U 1983-05-10 1983-05-10 混成集積回路装置 Granted JPS59176150U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983070394U JPS59176150U (ja) 1983-05-10 1983-05-10 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983070394U JPS59176150U (ja) 1983-05-10 1983-05-10 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS59176150U true JPS59176150U (ja) 1984-11-24
JPS6311721Y2 JPS6311721Y2 (OSRAM) 1988-04-05

Family

ID=30200543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983070394U Granted JPS59176150U (ja) 1983-05-10 1983-05-10 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS59176150U (OSRAM)

Also Published As

Publication number Publication date
JPS6311721Y2 (OSRAM) 1988-04-05

Similar Documents

Publication Publication Date Title
JPS5936268U (ja) 印刷配線板
JPS60133668U (ja) プリント回路基板
JPS5844871U (ja) 配線基板
JPS6054340U (ja) 集積回路
JPS5841980U (ja) 端子接続構造
JPS6011471U (ja) 混成集積回路装置
JPS6078172U (ja) フレキシブル基板の接続構造
JPS60124069U (ja) プリント基板
JPS58130272U (ja) プリント基板
JPS60103839U (ja) Ｃｍｏｓ集積回路用パツケ−ジ
JPS59192870U (ja) プリント基板装置
JPS59143070U (ja) 集積回路基板
JPS58131654U (ja) 厚膜電極構造
JPS6081674U (ja) セラミツク混成集積回路装置
JPS5872869U (ja) 電子回路装置
JPH05206625A (ja) 配線プリント基板
JPS59121859U (ja) 複合基板装置
JPS6090873U (ja) 混成集積回路装置
JPS58146372U (ja) プリント配線板
JPS6013772U (ja) チツプ化部品搭載用プリント基板
JPS58127675U (ja) プリント基板
JPS5939940U (ja) 混成集積回路装置
JPS59143050U (ja) 半導体装置
JPS59127268U (ja) 混成集積回路装置
JPS5952668U (ja) 混成集積回路