JPS59175751A - Resin seal type semiconductor device - Google Patents

Abstract

PURPOSE:To increase the adhesive strength of ink, and to prevent the disappearance of marks for displaying quality by forming a smooth surface and a crape surface to the outer surface of a resin and shaping these marks on the smooth surface when the marks are put on the resin seal surface of a semiconductor element by a laser-marking method or a bar code. CONSTITUTION:When a large number of leads 3 for external connection are sealed by using a resin 1 while being projected to the outside, a die for a resin seal, sections thereof corresponding to the upper surface and side end surfaces of the resin 1 are formed to a crape shape through electrical discharge machining and a lower surface thereof is formed to a specular shape through grinding machining, is used. Printed marks 2 are formed on the crape surface of the upper surface obtained by the die, and bar codes 5 are marked to the specular surface 4 of the lower surface through a laser-marking method. Accordingly, beams perform irregular reflection only at the code sections 5 when beams are irradiated to the specular surface 4, and informations are read positively. That is, a process in which the specular surface is generated at the same time as the resin sealing and the process for forming specular surface again is omitted.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a resin-sealed semiconductor device, and particularly to an improvement in the display method of the type of the surface of the sealing resin.

[Prior art]

FIG. 1 shows the outline of an example of a conventionally widely used resin-sealed semiconductor device, and FIG. 1(a) is a plan view thereof;
FIG. 1(b) is a side view, and FIG. 1(C) is a bottom view.

In the figure, (1) is a sealing resin, the entire surface of which has a satin finish corresponding to a mold for resin sealing, which is made into a satin finish by electric discharge machining or the like. (2) is this sealing resin (1
) is printed on the surface □ with marking ink, and indicates the product name, lot number, etc. of the resin-sealed semiconductor device.

(3) is a lead for external connection.

Figure 1 (In the resin-sealed semiconductor device shown here, the entire surface is a matte surface, so the resin encapsulation mold for molding it has a mirror-like (smooth surface) resin encapsulation on the entire surface. In order to obtain a shaped semiconductor device, the manufacturing cost of the mold is lower than that of a resin-sealed mold whose entire surface is polished to a mirror-like finish, and furthermore, the adhesion strength of the ink to the resin surface is greater, and the mark (2) is obtained. Although it has the advantage of being difficult to erase, it does have the following problems. Namely, the marking process of printing the mark (2) on the surface of the sealing resin (1) is usually used for resin sealing. Since it is installed at the end of the semiconductor device assembly process, after the resin encapsulation process is completed and before the marking process, the resin encapsulation type semi-41 unit is not known based on its appearance.

I can't tell if it's a lot number or not. Therefore, in order to automate the assembly process, it is essential to imprint a mark with information such as the product name and lot number on the resin-encapsulated semiconductor device as a line management mark, and to automatically read the mark. However, in the resin-sealed semiconductor device with a matte surface, -[because of the diffuse reflection of the illumination light that occurs on the matte surface,
It has been difficult to automatically read the engraved marks using optical images.

[Summary of the Invention] This invention was made to solve the above-mentioned problems, and by providing a mirror surface part on a part of the surface of the restraining resin and fully imprinting the above marks on this part, the resin sealing The present invention provides a resin-sealed semiconductor device having an automatically readable mark for automating the assembly process of the semiconductor device.

[Embodiments of the invention]

FIG. 2 shows the outline of an embodiment of the present invention, and FIG.
) is its plan view, Figure 2 ('b) is its side view, Figure 2 (C
) is a bottom view. In this example, the upper surface and side end surfaces of the sealing resin +11 have a satin finish corresponding to the resin sealing mold, which is made into a satin finish by electrical discharge machining, but the bottom surface (
Only 4) has a mirror surface that corresponds to a resin sealing mold that has been made into a mirror surface by polishing. In this embodiment, a bar code (5) is engraved on this mirror-like lower surface (4) by a laser marking method.

The reason for this structure is that the mirror surface of the lower surface (4) and the engraved barcode (5) have significantly different surface conditions, which causes diffuse reflection when light is irradiated onto the lower surface (4). Since it is only the bar 2-bird (5) that needs to be done,
The information on the barcode (5) can be easily read. Therefore, the barcode (5) is the variety name.

If used as a manufacturing line management mark such as a lot number, information essential for automating the assembly process of resin-sealed semiconductor devices can be provided in an automatically readable form. In addition, since the surface of the sealing resin has a matte finish except for a part, the manufacturing cost of the soil mold can be reduced even when the entire surface is mirror-finished, and the mark (2) disappears. It is possible to maintain the advantage that it is difficult.

〔Effect of the invention〕

As explained above, in the resin-sealed semiconductor device according to the present invention, a part of the surface of the encapsulating resin is mirror-finished, and the other part is satin-finished, and the mirror-finished part is marked, for example, with a laser marking method. I engraved a barcode showing the required information with
This barcode can be automatically read and used to automate the assembly process of resin-sealed semiconductor devices.

[Brief explanation of drawings]

Figure 1 shows the outline of an example of a conventional resin-sealed semiconductor device, with Figure 1 (a) being a top view, Figure 1 (b) a side view, and Figure 1 (c) a bottom view. be. FIG. 2 shows the outline of an embodiment of the present invention, FIG. 2(a) is a plan view thereof, and FIG.
Figure (b) is a side view, and Figure 2<c) is a bottom view. In the figure, (1) is a sealing resin, (2) is a printed mark,
(3) is a lead for external connection, (4) is the −F side of the sealing resin, and (6) is an engraved bar code. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Makoto Kuzuno - (1 other person) \N Commissioner of the Japan Patent Office 1, Indication of the case: Japanese Patent Application No. 58-50844 2, Title of the invention: Resin-encapsulated semiconductor device 3, Person making the amendment 5, Amendment Column 6 of the detailed description of the invention in the subject specification, the description of the contents of the amendment, is amended as follows.

Claims (3)

[Claims] (1) A part of the outer surface of the encapsulating resin is smooth and the other part is a satin surface, and the smooth part of the outer surface of the encapsulating resin is also marked with the product name and manufacturing lot number of the semiconductor device. A resin-sealed semiconductor device whose q'+ mark is engraved with a mark indicating information. (2) Claim 1, characterized in that the mark is engraved by a laser marking method.
The resin-sealed semiconductor device described in Section 1. (3) The resin-sealed semiconductor device according to claim 1 or 2, wherein the mark is engraved in the form of a bar code.