JPH0358453A - Resin sealed type semiconductor integrated circuit device - Google Patents

Resin sealed type semiconductor integrated circuit device

Info

Publication number
JPH0358453A
JPH0358453A JP19501389A JP19501389A JPH0358453A JP H0358453 A JPH0358453 A JP H0358453A JP 19501389 A JP19501389 A JP 19501389A JP 19501389 A JP19501389 A JP 19501389A JP H0358453 A JPH0358453 A JP H0358453A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
resin
sealing
sealing resin
integrated circuit
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19501389A
Inventor
Mitsuhiro Takahashi
Original Assignee
Nec Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To improve a resin sealed type semiconductor integrated circuit device in coloring property and moisture resistance and make it colored and low in stress by a method wherein it is sealed up with a transfer resin sealing structure which is composed of two or more layers formed of, at least, two types of sealing resin.
CONSTITUTION: A semiconductor chip 2 is mounted on the island of a lead frame 1, and the electrode terminal of the semiconductor chip 2 is connected to the lead of the lead frame 1 with a bonding wire 3. The lead frame 1, on which the semiconductor chip 2 is mounted, is covered with a highly adherent sealing resin 6, and then the adherent sealing resin 6 is covered with a low stress sealing resin 5. Furthermore, the low stress sealing resin 5 is covered with a laser marking coloring sealing resin 4, and then marking and the formation of leads are done through laser marking. As mentioned above, a sealing structure in which two or more layers are laminated is employed and sealing resins of different characteristics are used, whereby a resin sealed type semiconductor integrated circuit can be improved in coloring and moisture resistance and made colored and low in stress.
COPYRIGHT: (C)1991,JPO&Japio
JP19501389A 1989-07-26 1989-07-26 Resin sealed type semiconductor integrated circuit device Pending JPH0358453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19501389A JPH0358453A (en) 1989-07-26 1989-07-26 Resin sealed type semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19501389A JPH0358453A (en) 1989-07-26 1989-07-26 Resin sealed type semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPH0358453A true true JPH0358453A (en) 1991-03-13

Family

ID=16334083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19501389A Pending JPH0358453A (en) 1989-07-26 1989-07-26 Resin sealed type semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPH0358453A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5886400A (en) * 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
US6818968B1 (en) * 2000-10-12 2004-11-16 Altera Corporation Integrated circuit package and process for forming the same
JP2008227348A (en) * 2007-03-15 2008-09-25 Sanyo Electric Co Ltd Semiconductor device and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5886400A (en) * 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
US6818968B1 (en) * 2000-10-12 2004-11-16 Altera Corporation Integrated circuit package and process for forming the same
JP2008227348A (en) * 2007-03-15 2008-09-25 Sanyo Electric Co Ltd Semiconductor device and its manufacturing method

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