JPS59172225A - Manufacture of thin film magnetic material - Google Patents

Abstract

PURPOSE:To enhance the sputtering rate, and at the same time, to enable to manufacture a thin film manetic material having a superior soft magnetic characteristic by a method wherein a magnet is put between a substrate holder and a target as to make the N pole and the S pole to face mutually interposing the prescribed distance between them, the direction of magnetic flux thereof is made to be nearly in parallel with the directions of the surface of the target and the surface of the substrate, and moreover the magnet thereof is rotated during sputtering. CONSTITUTION:The supporting base 13 of a magnet 12 is made as to be enabled to perform a low-speed rotation on a supporting base 15 provided thereunder and having bearings 14 according to a driving mechanism 16. Magnetic flux of the magnet 12 comes out from the N pole, a part thereof enters in a target 17, a part although a little enters in a magnetic material on a sputtered substrate 11, and go together toward the S pole. At this time, because the magnet 12 is rotated according to the driving mechanism 16, a rotating magnetic field is applied to the magnetic material on the sputtered substrate 1, and induction of magnetic anisotropy in the magnetic material film surface is checked to contribute to enhancement of the soft magnetic characteristic of the magnetic material. While, according to the rotation of the magnet 12, in addition to the fact that the target 17 surface is sputtered uniformly, concentration of plasma is enhanced according to the mgnetic flux when discharge is generated, and the sputtering rate is enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for producing a thin magnetic film, particularly a method that enables the production of a magnetic alloy film with excellent soft magnetic properties at a high sputter rate. It is related to.

Conventional Structure and Problems Conventionally, a magnetron sputtering method as shown in FIG. 1(a) has been used as a high-speed sputtering method.

In the figure, 1 is a substrate, 2 is a target, 3d is a magnet,
4 is a non-magnetic material. Although this method has the advantage of a high sputter rate, it is not effective when using a thick magnetic target because the magnetic flux of the magnet does not leak.

In such a case, as shown in FIG. 1(b), a narrow groove is formed in the target 2 to leak the magnetic flux of the magnet and improve the sputtering rate. However, such a method is extremely troublesome to implement and is not effective, especially when the target has poor workability. Conventionally, permalloy, amorphous magnetic alloys, etc. did not have very good soft magnetic properties immediately after sputtering, and required heat treatment to improve their properties. However, it is necessary to provide a resist film that is sensitive to heat, and when these soft magnetic alloy films are used in devices, it is difficult to improve the characteristics by heat treatment! 1), the characteristics of the film could be fully utilized, and the actual situation was that the color was orange.

OBJECTS OF THE INVENTION It is an object of the present invention to provide a method that solves these two problems at once and makes it possible to sputter an alloy film exhibiting excellent soft magnetic properties at high speed.

Structure of the Invention The present invention provides a method for producing a magnetic alloy thin film using a sputtering apparatus in which a substrate holder and a target face each other, with an N pole and a S pole separated by a certain distance between the substrate holder and the target. The sputter rate is improved by placing magnets facing each other so that the direction of the magnetic flux is almost parallel to the in-plane direction of the target and the substrate, and by rotating the magnets during sputtering. At the same time, it has made it possible to produce a thin film magnetic material with excellent soft magnetic properties.

DESCRIPTION OF EMBODIMENTS An embodiment of the method of the present invention will be described with reference to FIG. FIG. 4(a) is a plan view of the main part of the device, and FIG. 1(b) is a side sectional view.

In the figure, 11 is a two-board substrate, 12 is a magnet with N and S poles facing each other, 13 is a support stand for the magnet 12, and a support stand 15 with a bearing 14 provided below. can be rotated at low speed by a drive mechanism 16. 17 is a target, and 18 is a target electrode. As shown in the figure (b), the magnetic flux of the magnet 12 exits from the N pole, a portion of which enters the target 17, and a small amount of which enters the magnetic body on the sputtered substrate 11 and S.
Head towards the pole. At this time, the magnet 2 is rotated by the drive mechanism 6, so a rotating magnetic field is applied to the sputtered magnetic material on the substrate 1, thereby preventing magnetic anisotropy from being induced in the plane of the magnetic material film. This contributes to improving the soft magnetic properties of magnetic materials. On the other hand, as the magnet 12 rotates, the surface of the target 17 is uniformly sputtered, and the magnetic flux emitted from the magnet 12 increases the plasma concentration during discharge and improves the sputtering rate by -1. If you want to prevent magnetic flux from entering the target 17 and further increase the sputtering rate, place a magnet like magnet 3 in Figure 1(a) at part 18 in Figure 1(b). , it is more effective if the target 17 is magnetically saturated1.
, Hereinafter, the effects of the present invention will be illustrated by specific examples.

Example 1 After evacuating the inside of a vacuum container at 2 x 10 Torr-4, an amorphous alloy with a composition of C0B5 Fe2 Nb13 was deposited on a sufficiently water-cooled glass substrate at an Ar gas pressure of 2 x 1 o-2 Torr (Fig. 2). It was manufactured using a sputtering device as shown in . At this time, for comparison, magnet 2
Experiments were also conducted in which the magnet 2 was fixed without rotating, and in which the magnet 2 was not used. The film thickness after sputtering for 1 hour and the initial magnetic permeability l11 of the alloy film at 100 KHz were measured.

The results are shown in Table 1.

As shown in the above table, it was found that the method of the present invention can significantly improve the sputter rate and provide high magnetic permeability even immediately after fabrication. On the other hand, when the magnet is fixed, the sputtering rate improves, but the film thickness distribution deteriorates to some extent, and the easy axis and the difficult axis directions occur in the surface of the obtained alloy film, and the μi in the easy axis direction is extremely low. It has the disadvantage of becoming.

Example 2 A permalloy sputter film was formed in the same manner as in Example 1 on a substrate heated to about 300'C1c using a Fe--Ni alloy (permalloy) as a target. The results are shown in Table 2.

Table 2 Also, when experiments were conducted using a magnetron type sputtering apparatus as shown in FIG. 1(a) which is commonly available on the market, the same results as in the case without a magnet as shown in the above table were obtained.

Effects of the Invention As is clear from the above explanation, the method of the present invention enables high-speed sputtering of magnetic materials, which has been difficult in the past, and also enables the production of magnetic films exhibiting excellent soft magnetism without heat treatment. This is an extremely effective method.

[Brief explanation of drawings]

FIG. 1(a) is a side view showing the conceptual configuration of a conventional magnetron type sputtering device, FIG. 1(b) is a side view of the main parts,
FIG. 2(a) is a plan view of a main part of an apparatus for carrying out an embodiment of the method of the present invention, and FIG. 2(b) is a side sectional view thereof. 11...Substrate, 12...Magnet, 13.
...Support stand, 14...Bearing, 16...
...Support stand, 16...Drive mechanism, 17...
...Target, 18...Target electrode. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure (a) (b) 2 Figure (and Ln

Claims (2)

[Claims] (1) When producing a magnetic alloy thin film using a sputtering device in which a substrate holder and a target face each other, the N and S poles are separated by a certain distance between the substrate holder and the target. Place the magnets so that they face each other so that the direction of the magnetic flux is approximately parallel to the in-plane direction of the target and the in-plane direction of the substrate attached to the substrate holder,
A method for producing a thin film magnetic material, characterized in that the magnet is rotated during sputtering. (2) The method for producing a thin film magnetic material according to claim 1, wherein the magnetic alloy film is amorphous.