JPS59168690A - Method of forming through hole of metal base both-side copper-lined laminated board - Google Patents
Method of forming through hole of metal base both-side copper-lined laminated boardInfo
- Publication number
- JPS59168690A JPS59168690A JP4335883A JP4335883A JPS59168690A JP S59168690 A JPS59168690 A JP S59168690A JP 4335883 A JP4335883 A JP 4335883A JP 4335883 A JP4335883 A JP 4335883A JP S59168690 A JPS59168690 A JP S59168690A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- forming
- metal
- base plate
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、金属ベース板をベースとする銅張積層板にス
ルホールを加工する方法に関するものである０
〔背景技術〕
一般に絶縁体にて形成せる基板の両面に銅箔層を積した
両面鋼張積層板にあっては、両面に貫通するスルホール
を穿孔し、このスルホール内面にスルホールメツ士を施
して絶縁体の基板の両面の銅箔層を電気的に導通させて
いたが、曲げ加工などが容易な金属板をベースとする両
面銅張積層板にあっては、ベースに導電性があるためス
ルホールをあけてメツ士するとベースに導通するためス
ルホール加工ができないのが現状であった。[Detailed Description of the Invention] [Technical Field] The present invention relates to a method for forming through holes in a copper-clad laminate having a metal base plate as a base. In the case of double-sided steel-clad laminates with copper foil layers laminated on both sides, through holes are drilled through both sides, and a through hole is applied to the inner surface of the through holes to electrically connect the copper foil layers on both sides of the insulating substrate. However, in the case of double-sided copper-clad laminates based on metal plates that are easy to bend, the base is conductive, so if a through hole is drilled and the metal plate is drilled, conduction will occur in the base, so through-hole processing is not possible. The current situation was that this was not possible.
本発明は叙述の点に鑑みてなされたものであって、金属
をベースとする両面銅張積層板であってもベースに導通
させずにスルホール加工できる金属ベース両面銅張積層
板のスルホール加工方法を提供するにある。The present invention has been made in view of the above-mentioned points, and is a through-hole processing method for a metal-based double-sided copper-clad laminate, which enables through-hole processing in a metal-based double-sided copper-clad laminate without electrical conduction to the base. is to provide.
本発明は・金属のベース板ｆｉｌの両面に絶縁層＋２１
＋２１を介して銅箔層＋３１ ｆＢ）を積層した両面
銅張積層板囚にスルホール（４）を形成し、スルホール
（４）の内面のベース板（１）のみを浸蝕材にて浸蝕さ
せてスルホール（４）面よりも後退する後退凹所（５）
を形成し、この後退凹所（５）にセラ三ｔリク層（６）
を設け、℃う三ツク層（６）に導電物質（７）を被覆す
るとともにこの導電物質（７）にて両面の銅箔層＋３＋
＋３１同士を導通させることを特徴とする金属ベース
両面銅張積層板のスルホール加工方法に係るものであり
、このような構成により、上記目的が達成できるに至っ
た。The present invention includes an insulating layer +21 on both sides of the metal base plate fil.
Through-holes (4) are formed in a double-sided copper-clad laminate with a copper foil layer (+31 fB) laminated via +21, and only the base plate (1) on the inner surface of the through-holes (4) is eroded with an erodible material to form the through-holes. (4) Recessed recess that recedes from the surface (5)
, and in this retreating depression (5) there is a Seratriku layer (6).
The third layer (6) is covered with a conductive material (7), and this conductive material (7) is used to coat the copper foil layer (6) on both sides.
The present invention relates to a through-hole processing method for a metal-based double-sided copper-clad laminate, which is characterized in that the +31 terminals are electrically connected to each other, and with such a configuration, the above object has been achieved.
以下本発明を実施例により詳述する。The present invention will be explained in detail below with reference to Examples.
（３）は両面銅張積層板であって、図に示すようにアル
ミニウム、鉄、珪素鋼、銅、黄銅等の金属板にて形成さ
れた金属のベース板＋１）に絶縁層（２）を介して銅箔
層（３）を積層して形成されている。ベース板ｔ１＋に
使用するアルミニウム板は例えば１．０期厚で、銅箔層
（３）は０．０３８ｍである。そして絶縁層（２）とし
てエボ牛シ樹月旨を含浸させたガラス布の厚さは０．１
ｍとしである。この両面鋼張積層板（５）に先ずプレ
スにてスルホール（４）を形成する。次いでベース板（
１）カアルミニウム製である場合には強アルカリ性の浸
蝕材で、そしてベース板ｆ１）が鉄である場合には強酸
性の浸蝕材でスルホール（４）内のベース板（１）のみ
を浸蝕させてスルホール（４）面よりも後退する後退凹
所（５）を形成する。次いでこの後退凹所（５）にセラ
ミックをプラズマ溶射法にてセラミック層（６）を被覆
する。かかる溶射するセラミックと〔発明の効果〕
以上要するに本発明は、スルホールの内面全面にセラミ
ック層を形成しているのでｔう三ツク層にてベース板の
スルホール部での絶縁ができてスルホールを介して導電
物質にて両面の銅箔層を導電させるようにしてもベース
板とけ完全に絶縁できて金属ベースとする両面銅張積層
板でもスルホール加工できるものである。そのうえセラ
ミック層はベース板の後退凹所に充填するので、接着性
の乏しいセラ三ツク層の呆持性が高くなり、結果として
高い絶縁性を得ることができるという利点がある。(3) is a double-sided copper-clad laminate, and as shown in the figure, an insulating layer (2) is formed on a metal base plate + 1) made of metal plates such as aluminum, iron, silicon steel, copper, and brass. It is formed by laminating a copper foil layer (3) therebetween. The aluminum plate used for the base plate t1+ has, for example, a thickness of 1.0, and the copper foil layer (3) has a thickness of 0.038 m. The thickness of the glass cloth impregnated with Ebogyushi Jugetsuji as the insulating layer (2) is 0.1.
It is m. First, through holes (4) are formed in this double-sided steel-clad laminate (5) using a press. Next, the base plate (
1) If the base plate f1) is made of carbon aluminum, use a strong alkaline corrosive agent, or if the base plate f1) is made of iron, use a strong acid corrosive agent to corrode only the base plate (1) inside the through hole (4). A recessed recess (5) is formed which is recessed from the surface of the through hole (4). Next, the recessed recess (5) is coated with a ceramic layer (6) using a plasma spraying method. [Effects of the Invention] In short, in the present invention, since a ceramic layer is formed on the entire inner surface of the through-hole, insulation can be achieved at the through-hole portion of the base plate with the three layers. Even if the copper foil layers on both sides are made conductive using a conductive material, the base plate can be completely insulated, and even a double-sided copper-clad laminate with a metal base can be processed through holes. Furthermore, since the ceramic layer is filled in the recessed recess of the base plate, the ceramic layer, which has poor adhesiveness, has a high durability, and as a result, there is an advantage that high insulation properties can be obtained.
図面は本発明の実施の工程を示す断面図であって、ｉ＋
１はベース材、（２）は絶縁層、（３）は銅箔層、（４
）はスルホール、（５）は後退凹所、（６）はセラミッ
ク層、（７）は導電物質、（３）は両面銅張積層板であ
る。
代理人 弁理士 石 １）長 七The drawings are cross-sectional views showing the steps of implementing the present invention,
1 is the base material, (2) is the insulating layer, (3) is the copper foil layer, (4
) is a through hole, (5) is a recess, (6) is a ceramic layer, (7) is a conductive material, and (3) is a double-sided copper-clad laminate. Agent Patent Attorney Ishi 1) Choshichi
Claims (1)
箔層を積層した両面銅張積層板にスルホールを形成し、
スルホールの内面のベース板のみを浸蝕材にて浸蝕させ
てスルホール面よりも後退する後退凹所を形成し、この
後退凹所にｔう三ツク層を設け、セラミック層に導電物
質を被覆するとともにこの導電物質にて両面の銅箔層同
士を導通させることを特徴とする金属ベース両面鋼張積
層板のスルホール加工方法。+1) Through holes are formed in a double-sided copper-clad laminate in which copper foil layers are laminated on both sides of a metal Q-base board via an insulating layer,
Only the base plate on the inner surface of the through hole is eroded with an erodible material to form a recessed recess that recedes from the surface of the through hole, three layers are provided in this recessed recess, and the ceramic layer is coated with a conductive material. A method for forming through-holes in a metal-based double-sided steel-clad laminate, which is characterized in that copper foil layers on both sides are electrically connected to each other using this conductive substance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4335883A JPS59168690A (en) | 1983-03-15 | 1983-03-15 | Method of forming through hole of metal base both-side copper-lined laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4335883A JPS59168690A (en) | 1983-03-15 | 1983-03-15 | Method of forming through hole of metal base both-side copper-lined laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59168690A true JPS59168690A (en) | 1984-09-22 |
Family
ID=12661625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4335883A Pending JPS59168690A (en) | 1983-03-15 | 1983-03-15 | Method of forming through hole of metal base both-side copper-lined laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59168690A (en) |
-
1983
- 1983-03-15 JP JP4335883A patent/JPS59168690A/en active Pending
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