JPS59168691A - Method of forming through hole of metal base both-side copper-lined laminated board - Google Patents
Method of forming through hole of metal base both-side copper-lined laminated boardInfo
- Publication number
- JPS59168691A JPS59168691A JP4336083A JP4336083A JPS59168691A JP S59168691 A JPS59168691 A JP S59168691A JP 4336083 A JP4336083 A JP 4336083A JP 4336083 A JP4336083 A JP 4336083A JP S59168691 A JPS59168691 A JP S59168691A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- base plate
- layer
- copper
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野］
本発明は金、属のベース板をベースとする銅張積層板に
スルホールを加工する方法に関するものである。。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for forming through holes in a copper-clad laminate based on a metal base plate. .
一般に絶縁体にて形成せる基板の両面に銅箔層を積層し
た両面銅張積層板にあってｔま、両面に貫通するスルホ
ールを穿孔し、このスルホール内面にスルホールメツ十
を施しているが、金属をベースとする両面銅張積層板に
あっては、ベースに導電性があるためスルホールをあけ
てメツ＋するとベースに導通するためスルホール加工が
できないのが現状であった。In general, double-sided copper-clad laminates are made by laminating copper foil layers on both sides of a substrate made of an insulator.Through holes are drilled through both sides, and through holes are applied to the inner surfaces of these through holes. In the case of double-sided copper-clad laminates based on , the base is electrically conductive, so if you open a through hole and connect it, conduction will occur to the base, so at present it is not possible to process through holes.
「発明の目的」
本発明は叙述の点に鑑みてなされたものであって、金属
をベースとする両面銅張積層板であってもベースに導通
させずにスルホール加工でき、しかも絶縁するためのセ
ラミック層を強固に固定できる金属ベース両面銅張積層
板のスルホール加工方法を提供するにある。``Object of the Invention'' The present invention has been made in view of the points stated above, and it is possible to process through-holes in a double-sided copper-clad laminate based on metal without making it conductive to the base, and to provide insulation. To provide a through-hole processing method for a metal-based double-sided copper-clad laminate that can firmly fix a ceramic layer.
〔発明の開示］
本発明金属ベース両面銅張積層板のスルホール加工方法
は金属のベース板（１）の両面に絶縁層（２）を介して
銅箔層（３）を積層した両面銅張積層板（８）にスルホ
ール（４）を形成し、スルホール（４）内においてベー
ス板（１）孔縁を浸食させて周方向に亘って凹所（８）
を形成し、次いでこの凹所（８）にセラミック層（５）
を充填被覆し、このセラミック層（５）上からスルホー
ル（４）内面全面に樹脂層（６）を被覆し、樹脂層（６
）に導電物質（７）を被覆して両面の銅箔層（３月同志
を導通させることを特徴とする−ものであって、と記の
ように構成することにより従来例の欠点を解決したもの
である。つまりスルホール（４）のセラミック層（５）
及び樹脂層（６）を被覆することによりベース板（１）
が金属であってもベース板（１）に導通しないようにス
ルホール加工できるようにし、さらにスルホール（４）
内においてベース板（１）孔縁を浸食させて凹所（８）
を形成し、セラミック層（５）を強固に固着するように
したものである。[Disclosure of the Invention] The through-hole processing method for a metal-based double-sided copper-clad laminate of the present invention is a double-sided copper-clad laminate in which copper foil layers (3) are laminated on both sides of a metal base plate (1) via an insulating layer (2). A through hole (4) is formed in the plate (8), and the hole edge of the base plate (1) is eroded in the through hole (4) to form a recess (8) in the circumferential direction.
and then a ceramic layer (5) in this recess (8).
A resin layer (6) is applied to the entire inner surface of the through hole (4) from above the ceramic layer (5).
) is coated with a conductive material (7) to make the copper foil layers on both sides conductive (characterized in that they are electrically conductive), and the drawbacks of the conventional example are solved by configuring it as shown in the following. That is, the ceramic layer (5) of the through hole (4)
and the base plate (1) by coating with the resin layer (6).
Even if the base plate (1) is made of metal, through-holes can be processed to prevent electrical conduction to the base plate (1), and through-holes (4)
Inside the base plate (1), the hole edge is eroded to form a recess (8).
is formed to firmly fix the ceramic layer (5).
以下本発明を実施例により詳述する。（Ａ）は両面銅張
積層板であって、第１図に示すようにアルミニウム、鉄
、珪素鋼、銅、黄銅等にて形成された劾
金属のベース泌１）Ｋ絶縁層２）を介して銅箔層（３）
を積層して形成されている。かか不両面銅張積層板囚は
、例えば銅箔層（３）は厚さが０．０３８鱈で、絶縁層
（２）は厚さがＯ，１ｍでエボ＋シ樹カ旨合浸カラス布
で、ベース板（１）は厚さが１．０ ｔｍである。この
両面銅張積層板（８）に先ずプレスにて第２図に示すよ
うにスルホール（４）を形成する。次いで酸やアルカリ
にてスルホール（４）内のベース板（１）孔縁を浸食し
て第３図に示すように周方向に凹所（８）を形成する。The present invention will be explained in detail below with reference to Examples. (A) is a double-sided copper-clad laminate, and as shown in Fig. 1, a metal base made of aluminum, iron, silicon steel, copper, brass, etc. Copper foil layer (3)
It is formed by laminating layers. For example, the copper foil layer (3) has a thickness of 0.038 mm, and the insulating layer (2) has a thickness of 0.1 m, and is a double-sided copper clad laminate with evo + wood fibers and a laminate. The base plate (1) is made of cloth and has a thickness of 1.0 tm. First, through holes (4) are formed in this double-sided copper-clad laminate (8) using a press as shown in FIG. Next, the hole edge of the base plate (1) inside the through hole (4) is eroded with acid or alkali to form a recess (8) in the circumferential direction as shown in FIG.
つまりベース板（１）がアルミニウムの場合アルカリで
浸食させ、鉄の場合は酸で浸食させる。次いで第４図に
示すようにセラミックをプラズマ溶射法にて凹所（８）
に充填してベース板（１）と絶縁するように充填被覆す
る。かかる溶射するセラミックとしてｔまアルミナ、ジ
ルコニア、チタニア等がある。次いで第５図に示すよう
にセラミック層（５）玉に樹脂層（６）を被覆する。か
かる樹刀旨層（６）の樹月旨七してはエボ＋シ樹月旨、
フェノール樹月旨、不飽和ポリエステル樹月旨、エボ士
シーフェノ−Ｊレーづチラール樹脂、ポリブタジェン樹
脂、ポリイミド樹脂、ボリア三トイ三ド樹脂、ポリウレ
タン樹月旨等がある。That is, if the base plate (1) is made of aluminum, it is eroded with alkali, and if it is made of iron, it is eroded with acid. Next, as shown in Figure 4, ceramic is applied to the recesses (8) using plasma spraying.
The base plate (1) is filled and coated so as to be insulated from the base plate (1). Ceramics that can be thermally sprayed include alumina, zirconia, titania, and the like. Next, as shown in FIG. 5, the ceramic layer (5) beads are coated with a resin layer (6). Such Jutsuma layer (6) Jugetsuji 7 is Evo + Shijutsuji,
There are phenol resins, unsaturated polyester resins, Eboshi Seaphenol resin, polybutadiene resins, polyimide resins, boria resins, polyurethane resins, and the like.
樹脂層（６）は固形分が１〜８０％の樹脂中に浸漬して
行なう。樹脂ｊ麟（６）を形成した後、第６図に示すよ
うにｍ脂層（６）に導′疏物質（７）を被覆して両面の
銅箔層（２）同志を４通させる。かかる導電物質（７）
は銅メツ＋により被覆したり導電ペーストを充填したり
して行なう。The resin layer (6) is formed by immersing it in a resin having a solid content of 1 to 80%. After forming the resin layer (6), as shown in FIG. 6, the resin layer (6) is coated with a conductive material (7) and the copper foil layers (2) on both sides are passed through four times. Such conductive material (7)
This is done by covering with copper metal or filling with conductive paste.
［発明の効果］
本発明−は叙述の如くスルホールの内面のベース板孔縁
をセラミック層にて被覆しているので、セラミック層に
てベース板のスルホール部での絶縁ができてスルホール
を介して導電物質にて両面の銅箔層を導電させるように
してもベース板とは完全に絶縁できて金属をベースとす
る両面銅張積層板でもスルホール加工できるものであり
、しかもしう三ツク層に樹脂層を被覆して樹脂層に導電
物質を′４１．覆しているのでセラミック層だけより耐
湿性が付与されてスルホール内の絶縁性が一層向ヒする
ものであり、さらにスルホール内においてベース板孔縁
を浸食させて周方向に亘って凹所を形成し、この凹所に
セラ三ツク層を充填被覆しているので、セラミック層が
強固に収着され、セラミック層が脱落しにくくて一層絶
縁性が安定するという利点がある。[Effects of the Invention] As described above, in the present invention, the edge of the base plate hole on the inner surface of the through hole is covered with a ceramic layer, so the ceramic layer can insulate the through hole part of the base plate. Even if the copper foil layers on both sides are made conductive with a conductive material, they can be completely insulated from the base plate, and even double-sided copper-clad laminates made of metal can be processed through holes. Cover the resin layer and apply a conductive material to the resin layer '41. Since the ceramic layer is covered, it is more moisture resistant than the ceramic layer alone, and the insulation inside the through hole is further improved.Furthermore, the base plate hole edge is eroded inside the through hole to form a recess in the circumferential direction. Since this recess is filled and coated with a ceramic layer, the ceramic layer is firmly adsorbed, making it difficult for the ceramic layer to fall off, resulting in more stable insulation.
第１図乃至第６図は本発明の実施助工程を示す断面図で
あって、（１）ｔよベース板、（２）は絶縁層、（３）
け銅箔層、（４）はスルホール、（５）はセラミック層
、（６） ？ｉ樹脂層、（７）は導電物質、（８）は凹
所、囚は両面銅張積層板である。
代理人 弁理士 石 １）長 七FIGS. 1 to 6 are cross-sectional views showing the implementation process of the present invention, in which (1) t base plate, (2) insulating layer, (3)
copper foil layer, (4) through hole, (5) ceramic layer, (6) ? (i) is a resin layer, (7) is a conductive material, (8) is a recess, and (8) is a double-sided copper-clad laminate. Agent Patent Attorney Ishi 1) Choshichi
Claims (1)
箔層を積層した両面銅張積層板にスルホールを形成し、
スルホール内においてベース板孔縁を浸食させて周方向
に亘って凹所を形成し、次いでこの凹所にセラミック層
を充填被覆し、このセラミック層上から・スルホール内
面全面に樹脂層を被覆し、樹脂層に導゛嘔物質を被覆し
て両面の銅箔層同志を４通させることを特徴とする金属
ベース両面銅張積層板のスルホール加工方法。(1) Through holes are formed in a double-sided copper-clad laminate in which copper foil layers are laminated on both sides of a metal base plate via an insulating layer,
Forming a recess in the circumferential direction by eroding the base plate hole edge within the through hole, then filling and coating the recess with a ceramic layer, and coating the entire inner surface of the through hole with a resin layer from above the ceramic layer, A through-hole processing method for a metal-based double-sided copper-clad laminate, characterized in that the resin layer is coated with a pollutant and the copper foil layers on both sides are passed through four times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4336083A JPS59168691A (en) | 1983-03-15 | 1983-03-15 | Method of forming through hole of metal base both-side copper-lined laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4336083A JPS59168691A (en) | 1983-03-15 | 1983-03-15 | Method of forming through hole of metal base both-side copper-lined laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59168691A true JPS59168691A (en) | 1984-09-22 |
Family
ID=12661683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4336083A Pending JPS59168691A (en) | 1983-03-15 | 1983-03-15 | Method of forming through hole of metal base both-side copper-lined laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59168691A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258319A (en) * | 2009-04-28 | 2010-11-11 | Kyocera Corp | Wiring board and method of manufacturing the same |
| JP5364838B1 (en) * | 2012-11-30 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | Copper foil with carrier |
-
1983
- 1983-03-15 JP JP4336083A patent/JPS59168691A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258319A (en) * | 2009-04-28 | 2010-11-11 | Kyocera Corp | Wiring board and method of manufacturing the same |
| JP5364838B1 (en) * | 2012-11-30 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | Copper foil with carrier |
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