JPS59154705A - Insulated wire - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an insulated wire with excellent heat resistance, mechanical properties and chemical properties.

In recent years, the development of extrusion technology for 1G and IF coatings has been remarkable, and for example, it has become possible to manufacture 1G and IF coatings with thin layers such as windings, which were previously considered impossible, by extrusion. . Manufacturing using this extrusion method is attracting a lot of attention because it has the advantages of resource saving, no pollution, and high productivity compared to the conventional manufacturing method that involves applying and baking paint. The wires were inferior in heat resistance, mechanical properties, and chemical properties compared to insulated wires produced by the baking method.

This drawback is due to the fact that in the case of winding wires, the insulation and FPL covering layer is a thin layer, so the resin that forms the insulation breakdown layer cannot exhibit its properties compared to insulated wires made using the normal extrusion method. it is conceivable that. On the other hand, in the case of a baked-on type winding, the resin of the insulating coating layer is highly cross-linked during the baking process, so it is thought that the above-mentioned characteristics are maintained through cross-linking.

Therefore, in order to impart the properties required for winding to thin-walled insulated wires produced by extrusion, a resin material having an effect that can replace that of a frame is required.

The inventors of the present invention have conducted extensive research on thermoplastic resins that can fully exhibit the above-mentioned characteristics, and have found that a resin with a melting point of at least 240°C that can provide characteristics comparable to those of baked-on windings.
It has been found that a crystalline layer having a temperature of 270° C. or higher is suitable.

Examples of thermoplastic resins having such characteristics are J and Po.
lymer Set, 10. Part A-115
47 (1972) etc. Cyaminophenylmethane,
Polyamide resins obtained from Sepacin 1 or azelaic acid are known. However, these id4 fats have drawbacks such as embrittlement and low elongation due to their high crystallinity.
This is not a desirable coating material for winding wires that require flexibility.

In view of this point, the inventors conducted intensive studies and found that a dicarboxylic acid component selected from the group of sebacic acid, azelaic acid, and dicarboxylic acid derivatives thereof, and diaminodiphenylmethane 68-9. A crystalline copolymer amide having an intrinsic viscosity of 0.4 dt/9 or more obtained by reacting with a cyamino component coated with 32 to 3 parts of m-xylylene diamine and 32 to 3 parts of m-xylylenediamine is placed on a conductor. The present invention has been achieved by using extrusion coating to obtain an insulated wire for winding that has properties comparable to conventional baked-on insulated wires.

In the cyamino component for obtaining the crystalline copolymer amide in the present invention, the blending ratio of noaminosophenylmethane and m-xylylenenoamine is 68 to 97 parts by weight = 32 to 3
The reason for limiting it to parts by weight is that the ratio of both is 97/3.
If the resin exceeds this, the resulting resin will not be able to suppress embrittlement due to crystallization, and therefore, the insulated wire obtained using such resin will have poor flexibility and will not meet the deterioration resistance specified in JISC3003. This is because it becomes inferior. In addition, if the above ratio is less than 68/32, the resulting copolymer resin will have a lower melting point or will be inferior, and will meet the JISC30
This is because as the softening temperature is lowered by the ml softening measurement method specified in 03, the chemical resistance is also lowered. Further, the preferable range of the two-layer ratio is 97/3 to 85/i5.

The method for synthesizing the copolymer used in the present invention is not particularly limited, and can be easily synthesized by bath melt polycondensation of the noamino component having the above composition and azelaic acid or sebacic acid. In this case, it is desirable to add a phenolic anti-aging agent to suppress thermal decomposition of the resin during synthesis.

In addition, the intrinsic viscosity of the copolymer resin referred to in the present invention refers to the [η] or I, V value measured in sulfuric acid at 35°C, and the value is 0.4 dt/g. The reason for the above limitation is that it is impossible to obtain a flexible insulated wire with fd less than 1.0.4 dt/jj.Also, in the acid component of the copolymer resin, dicarboxylic acid derivatives and refers to dicarboxylic acid halides, lower alkyl esters, etc.

Next, examples of the present invention will be described.

Examples (1) to (4) and Comparative Examples (1) to (2)A Synthesis of copolymerized amide resin The raw materials shown in Table 1 were placed in a reactor equipped with a reflux condenser, a stirring device, and a nitrogen introduction pipe. After replacing the air in the reactor with nitrogen, it was heated while flowing nitrogen until the internal temperature reached 12
Stirring is started when the temperature reaches 0°C. Internal temperature is 150
℃, switch the far-flow cooler to the distillation piping, raise the temperature to the temperature shown in Table 1, and pour a small amount of room music for 10 T.
After reducing the pressure to
After reducing the pressure to rr and distilling off the produced water, stop stirring and pressurize the inside to extrude the obtained resin into a string shape, cool it with water,
After cutting into pellets, dry at 90℃ in a vacuum dryer.
It was vacuum dried for 12 hours.

The intrinsic viscosity and melting point of the copolymer resin thus obtained are shown in Table 1.

B Manufacture of insulated wire To Chroma, the copolymer shown in Table 1 was added to the outer periphery of the annealed copper wire with the wire diameter shown in Table 1 by several extrusions.
The wires were extruded and coated under the extrusion conditions shown in the table, and after cooling with water, the adhering moisture was removed by air blowing and wound around a bobbin to obtain an insulated rW wire of the present invention and an insulated wire of a comparative example.

Various properties of the insulated wire thus obtained were measured.

The results are shown in Table 2.

Claims (1)

[Claims] A dicarboxylic acid component selected from the group of sepacic acid, azelaic acid, or nocarzenic acid derivatives thereof, 68 to 97 parts by weight of diaminonophenylmethane, and m-
Intrinsic viscosity Q, 4 dt obtained by reacting a diamino component composed of 32 to 3 parts by weight of xylylene diamine
1. An insulated wire characterized by being extruded and covered with a crystalline copolymerized amide resin having a molecular weight of /g or more.