JPS5915066Y2 - Feedthrough capacitor - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improvement of a feedthrough capacitor with good high frequency characteristics.

Conventionally, feed-through capacitors have been widely used in various devices such as oscillators and computers because of their good high-frequency characteristics. A structure is adopted in which electrode layers are formed on a large ceramic disc as a base.

However, in this structure, the large ceramic disk serving as the base is easily subjected to stress during manufacturing or use, and combined with the lack of mechanical and thermal strength, the base often cracks and cracks. It is difficult to construct a feedthrough capacitor with a desired capacity, and there are disadvantages in that reliability and durability in use are poor.

SUMMARY OF THE INVENTION In order to eliminate such drawbacks, the present invention aims to provide a feedthrough capacitor that can maintain a constant capacitance without being affected by cracks or fractures that occur in the ceramic plate.

That is, the feedthrough capacitor according to the present invention is constructed by using a printed board or a ceramic board as a support plate, and having a plurality of stacked chip type capacitors connected in parallel on the plane thereof aligned and mounted.

In the feedthrough capacitor constructed in this way, a large capacitance can be maintained and specified by the sum of chip capacitors each having a fixed capacitance for each unit.

This will be explained below based on the illustrated embodiments.

The illustrated capacitor has a through-type structure in which a plurality of chip capacitors 2, 2, etc. are mounted on the surface of a support plate 1, and these capacitors are connected in parallel. .

As the support plate 1, either a printed board or a ceramic plate can be used, and the plate material is shaped to have a circular planar shape.

For this support plate 1, chip type containers 2, 2...
. . . are arranged in radial alignment to facilitate connection between the respective capacitors.

Each chip type capacitor is constructed by placing electrodes 2a, 2b at the left and right ends in the longitudinal direction, and by electrically connecting the terminals, each chip capacitor 2, 2
... are connected in parallel.

The connection is made using copper patterns 3a, 3 on the surface of the support plate 1.
This can be done by pasting b.

The copper patterns 3a and 3b are separately attached to the center and outer bands of the support plate 1, respectively, and the inner and outer electrodes 2a and 2b of the chip capacitor are placed between these copper patterns. Each capacitor is installed.

In this configuration, each chip capacitor is placed between the inner and outer patterns, and the electrodes 2a, 2b are placed between the respective copper patterns 3a,
Since it can be assembled by joining 3b with solder 4,
Assembly work can be made extremely simple.

The rated capacity of this feedthrough capacitor is determined by the number of chip capacitors 2, 2, etc. mounted on the support plate 1. It can be installed on both sides.

Therefore, even when a large capacity feedthrough capacitor is constructed by mounting a large number of chip capacitors, there is no need to make the support plate even larger.

In addition, in this penetrating type container, the main body can be mounted and fixed by a support shaft 5 planted at the center of the support plate, and the peripheral side thereof is covered with a moisture-proof insulating coating 6 and a metal film 7. can do.

In the feedthrough capacitor configured in this way, its good high-frequency characteristics are ensured by arranging a plurality of multilayer chip capacitors on the support plate 1, and furthermore, by connecting the chip capacitors in parallel, the high frequency characteristics are ensured. The capacitance is specified by the sum of the number of chip capacitors.

Its rated capacity is based on the fact that multiple chip capacitors are installed and function as a capacitor by themselves.
Since the printed board or ceramic board is not a component that affects the capacitor function, it is not affected by cracks or breaks.

As described above, according to the feedthrough capacitor according to the present invention,
A highly reliable capacitor with good high frequency characteristics, large capacity, and high reliability can be obtained.

Furthermore, since chip capacitors are highly mass-producible and can be constructed at low cost, it is also possible to significantly reduce costs as feedthrough capacitors.

[Brief explanation of the drawing]

Fig. 1 is a side sectional view of a feedthrough capacitor which is an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a side sectional view of a feedthrough capacitor which is another embodiment of the present invention, and Fig. 4 is a side sectional view of a feedthrough capacitor which is an embodiment of the present invention. FIG. 3 is an overall side sectional view of the first and second illustrated capacitors. 1: Support plate, 2, 2...: Multilayer chip capacitor, 3a, 3b: Copper pattern connecting between chip capacitors.

Claims (3)

[Scope of utility model registration request] (1) A feed-through capacitor characterized in that it is constructed by using a printed board or ceramic board as a support plate, mounting a plurality of multilayer chip capacitors in alignment on the plane of the board, and further connecting each capacitor in parallel. . (2) The feedthrough capacitor according to claim 1, wherein the multilayer chip capacitors are arranged radially on the plane of the plate. (3) The multilayer chip capacitors connected in parallel are
Between the feedthrough capacitors according to claim 1 of the utility model registration, which are installed on both sides of the support plate.