JPS6334258Y2 - - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to a multilayer ceramic capacitor.

The object of the invention is to obtain a capacitor that is smaller and can be manufactured at lower cost.

The present invention will be described with reference to its embodiments.

Figure 1 shows a ceramic capacitor element 1 according to the present invention.
FIG. 2 is a sectional view taken along the - line in FIG. 1. 2 is a porcelain thin plate, and a fitting hole 3 is formed in the center of this thin plate 2.

Annular protrusions 4 and 5 are provided on the outer circumferential edge of the front side of the thin plate 2 and the circumferential edge of the fitting hole on the back side, respectively, and the end faces of the protrusions 4 and 5 are formed horizontally.

Reference numeral 6 indicates a conductive thin film attached to the surface of the thin ceramic plate 2, and reference numeral 7 indicates a conductive thin film attached to the back surface of the ceramic thin plate 2.
No adhesive is formed on the end face of No. 5.

Therefore, both sides of the porcelain thin plate 2 are provided with protrusions 4 and 5.
All but the end faces are covered with a conductive thin film.

FIG. 3 is a longitudinal sectional view of a multilayer ceramic capacitor according to the present invention, which is constructed by stacking the above-mentioned ceramic capacitor elements 1. Each ceramic capacitor element 1 is fitted and stacked on a terminal pin 8 whose diameter expands and contracts elastically through its split groove, with its front surface and back surface facing each other, and the protrusion 4 on the front surface side. 4 contact and the protrusion 5 on the back side thereof
and 5, the respective ceramic capacitor elements 1 are held at a predetermined distance from each other. A cylindrical shield case 9 is fitted on the outside of the laminate of the magnetic capacitor element 1. The conductor thin film 6 on the surface side of each ceramic capacitor element 1 is electrically connected to a terminal pin 8 by soldering 11, respectively.
Further, the conductor thin film 7 on the back side of each ceramic capacitor element 1 is electrically connected to the shield case 9 by soldering 12. A pair of mounting feet 10 are provided protruding from the lower edge of the shield case 9. The terminal pin 8 is composed of a cylindrical main body 8a and an upper end portion 8b. As shown in FIG. 5, this upper end portion 8b is formed in a U-shape, and the opposing wall surfaces 8c,
Notch grooves 8e and 8f are formed in 8d, respectively, and lead wires can pass through the notch grooves 8e and 8f. Note that 13 in the figure is a printed circuit board.

In the embodiment described above, the shield case 9 is fitted around the outer periphery of the laminate of the ceramic capacitor element 1, but if there is no particular need to block radio waves, the shield case 9 may not be used and other appropriate means may be used. Accordingly, the conductor thin film 7 on the back side of each ceramic capacitor element 1 may be electrically connected to the lead wire connection terminal.

As is clear from the above description, according to the present invention, since the conductive thin film serving as the power storage portion is arranged in a bellows shape, it is possible to obtain a capacitor that is smaller in size than its capacitance.

In addition, by changing the number of laminated layers of the ceramic capacitor element, the capacitance can be changed.
It is very convenient to produce capacitors with various capacitances. Furthermore, when changing the number of laminated layers of the ceramic capacitor element, the spacing between the mounting legs of the manufactured capacitor does not change at all, which is very convenient for assembling electrical circuits in which capacitors with various capacitances are assembled. Furthermore,
By preparing the same ceramic capacitor element, capacitors having various capacitances can be manufactured, thereby reducing the manufacturing cost.

[Brief explanation of the drawing]

Fig. 1 is a top view of a ceramic capacitor element according to the present invention, Fig. 2 is a sectional view taken along the - line in Fig. 1, and Fig.
The figure is a longitudinal sectional view of a multilayer ceramic capacitor according to the present invention, FIG. 4 is a bottom view of the same, and FIG. 5 is a top view of a terminal pin. 1... Porcelain capacitor element, 2... Perforated porcelain thin plate, 4, 5... Annular protrusion, 6, 7... Conductor thin film, 8... Terminal pin, 9... Shield case.

Claims (1)

[Scope of utility model registration request] Both sides of a thin porcelain plate with a fitting hole formed in the center and annular protrusions formed on the outer peripheral edge of the front side and the circumferential edge of the fitting hole on the back side, excluding the end faces of each of the annular protrusions. A plurality of ceramic capacitor elements of the same shape and size covered with a conductive thin film are fitted and stacked on the terminal pin so that the front surface and the back surface face each other, and a terminal cylindrical body is placed on the outside of the laminate. is fitted,
The conductive thin film on the surface of each ceramic capacitor element is electrically connected to the terminal pin by soldering etc., and the conductive thin film on the back side of each ceramic capacitor element is electrically connected to the terminal cylinder by soldering etc. A multilayer porcelain capacitor characterized by: