JPS5914918B2 - Manufacturing method of printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a reprinted wiring board using a die stamping method.

The die stamping method is a method for manufacturing printed wiring boards using a blade, and conventional methods are broadly divided into one-step stamping methods and two-step stamping methods.

In the one-step stamping method, as shown in Figure 1, the inner moat 1
1 and the outer moat part 12 are used, and the board 2 is
A conductor foil 3 is stamped with an adhesive layer 4 interposed thereon. In this case, the blade mold 1 is heated to a temperature slightly higher than the temperature at which the adhesive layer 4 flows (suddenly softens). In the two-step stamping method, as shown in FIG. The adhesive layer 4 is partially flowed to fix the conductor foil 3 in this area, and then, as shown in FIG. Stamping is performed with or without steps). In both of the above two methods, two methods can be applied: one in which the adhesive layer is formed in advance on the conductor foil 3 side, and one in which it is formed in advance on the substrate 2 side.

Usually, from the viewpoint of work efficiency, the adhesive layer 4 is formed in advance on the conductor foil 3 side, and the reprinted wiring board is often manufactured by the one-step stamping method described above. However, the one-step stamping method described above requires a step on the blade, which increases the cost required for the blade and has the disadvantage that it is quite difficult to manufacture fine patterns.

In addition, with the two-step stamping method, it is possible to produce fairly fine patterns of 5 degrees by using a blade with no steps, but since it is a two-step process, running costs are high, and feeding accuracy between the two steps is a problem. Become. It is an object of the present invention to provide a method for manufacturing printed wiring boards using a die stamping method, which solves the above-mentioned problems, lowers the cost of the blade and the running cost, and is improved so as to be able to manufacture even fine patterns. shall be.

An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 3, a flexible film 6 having good thermal conductivity such as polyvinyl chloride, polyester, polyimide, etc. is used as a substrate, and a thermoplastic resin of a material corresponding to the material of the film 6 is coated on the surface side of the flexible film 6. Adhesive layer 8
A conductive foil T made of steel or the like is laminated 30 on this adhesive layer 8. Then, the surface side of this film 6 (conductor foil 7
Stamping is performed with the blade portion 9 from the side where the film 6 is placed, and at the same time, a flat mold 20 is pressed against the back side of the film 6. That is, the film 6 is
Stamping is performed by sandwiching the stamp 35 between the flat die 20 and the blade 9. Then, the blade part 9 is kept at room temperature, and the flat type 20
is heated by the heater 21 to a temperature at which the thermoplastic resin adhesive layer 8 flows. Then, since the film 6 has good thermal conductivity, the adhesive layer 8 is heated and flows only in the portion where the flat mold 20 is pressed, and the conductor foil 7 is partially adhered.

Of course, the shape of the flat mold 20 corresponds to the conductor pattern to be formed, so if stripping (peeling) is performed after the stamping is completed, adhesive layers 81 and 82 as shown in FIG. 4 are formed. As a result, conductive patterns 71 and 72 that are adhesively held on the film 6 can be formed. As described above with respect to the embodiments, according to the present invention, the blade mold used may be one without a step, so the cost of the blade mold is low. Furthermore, since stamping is performed in one process, running costs are low and there are no problems with feeding accuracy. Furthermore, since the blade shape does not need to have any steps, it is also possible to manufacture fine patterns.

[Brief explanation of drawings]

1} and FIGS. 2A and 2B are sectional views for explaining a conventional manufacturing method, respectively, and FIGS. 3 and 4 are sectional views for explaining a manufacturing method according to an embodiment of the present invention. FIG. 3 is a cross-sectional view showing each step. 1, 9... Blade type, 2... Substrate, 3, 7
... Conductor foil, 8 ... Adhesive layer, 5, 2
0... Flat type, 21... Heater.

Claims (1)

[Claims] 1 Laminate conductive foil on the surface of a substrate with good thermal conductivity via an adhesive layer, and stamp with a blade from the front side of the substrate while pressing a heated flat mold from the back side of the substrate. A method for manufacturing a printed wiring board, the method comprising: