JPS59145558A - 半導体整流装置用積層スタツク - Google Patents

半導体整流装置用積層スタツク

Info

Publication number
JPS59145558A
JPS59145558A JP58018799A JP1879983A JPS59145558A JP S59145558 A JPS59145558 A JP S59145558A JP 58018799 A JP58018799 A JP 58018799A JP 1879983 A JP1879983 A JP 1879983A JP S59145558 A JPS59145558 A JP S59145558A
Authority
JP
Japan
Prior art keywords
press plate
pressure
bolt
spring guide
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58018799A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0320902B2 (enExample
Inventor
Mitsuo Yamamoto
山本　三男
Shigeo Azuma
我妻　繁雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58018799A priority Critical patent/JPS59145558A/ja
Publication of JPS59145558A publication Critical patent/JPS59145558A/ja
Publication of JPH0320902B2 publication Critical patent/JPH0320902B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
JP58018799A 1983-02-09 1983-02-09 半導体整流装置用積層スタツク Granted JPS59145558A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58018799A JPS59145558A (ja) 1983-02-09 1983-02-09 半導体整流装置用積層スタツク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58018799A JPS59145558A (ja) 1983-02-09 1983-02-09 半導体整流装置用積層スタツク

Publications (2)

Publication Number Publication Date
JPS59145558A true JPS59145558A (ja) 1984-08-21
JPH0320902B2 JPH0320902B2 (enExample) 1991-03-20

Family

ID=11981632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58018799A Granted JPS59145558A (ja) 1983-02-09 1983-02-09 半導体整流装置用積層スタツク

Country Status (1)

Country Link
JP (1) JPS59145558A (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512931A (ja) * 1974-06-28 1976-01-12 Hitachi Ltd Seiryusochi
JPS56108265U (enExample) * 1980-01-21 1981-08-22
JPS5712748U (enExample) * 1980-06-27 1982-01-22
JPS596851U (ja) * 1982-07-05 1984-01-17 日本電気株式会社 平形半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512931A (ja) * 1974-06-28 1976-01-12 Hitachi Ltd Seiryusochi
JPS56108265U (enExample) * 1980-01-21 1981-08-22
JPS5712748U (enExample) * 1980-06-27 1982-01-22
JPS596851U (ja) * 1982-07-05 1984-01-17 日本電気株式会社 平形半導体装置

Also Published As

Publication number Publication date
JPH0320902B2 (enExample) 1991-03-20

Similar Documents

Publication Publication Date Title
US2289164A (en) Clamping device for porcelain shells
US3204463A (en) Force operated instrument
US4023402A (en) Unit type strain gauge
EP0407397A1 (de) Druckgeber zur druckerfassung im brennraum von brennkraftmaschinen.
WO2018223853A1 (zh) 压电陶瓷堆叠结构及压电式传感器
EP0179611B1 (en) Cylinder pressure transmitter for an internal combustion engine
US4646131A (en) Rectifier device
JPS6410299B2 (enExample)
US4381518A (en) Semiconductor component with several semiconductor elements
JPH0320902B2 (enExample)
DE2603813C2 (de) Spannvorrichtung für ein thermisch und elektrisch druckkontaktiertes Halbleiterbauelement in Scheibenzellenbauweise
US4263607A (en) Snap fit support housing for a semiconductor power wafer
JPS59124721A (ja) プレ−ト支持方法
JPS594032A (ja) 圧接型半導体装置
JPS6116688Y2 (enExample)
JPS626701Y2 (enExample)
JPS6335951B2 (enExample)
JPH0113422Y2 (enExample)
JPS5828364Y2 (ja) 整流スタツク
JPH0120065Y2 (enExample)
NO126155B (enExample)
JPH0215320Y2 (enExample)
JPS595924Y2 (ja) 避雷器の特性要素圧接装置
JPS6240448Y2 (enExample)
JPS6334344Y2 (enExample)