JPS59144153A - 集積回路パツケ−ジ冷却構造 - Google Patents

集積回路パツケ−ジ冷却構造

Info

Publication number
JPS59144153A
JPS59144153A JP1835183A JP1835183A JPS59144153A JP S59144153 A JPS59144153 A JP S59144153A JP 1835183 A JP1835183 A JP 1835183A JP 1835183 A JP1835183 A JP 1835183A JP S59144153 A JPS59144153 A JP S59144153A
Authority
JP
Japan
Prior art keywords
heat sink
cooling
plate
substrate
conductive plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1835183A
Other languages
English (en)
Japanese (ja)
Other versions
JPS644670B2 (enrdf_load_stackoverflow
Inventor
Yoichi Matsuo
洋一 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1835183A priority Critical patent/JPS59144153A/ja
Publication of JPS59144153A publication Critical patent/JPS59144153A/ja
Publication of JPS644670B2 publication Critical patent/JPS644670B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1835183A 1983-02-07 1983-02-07 集積回路パツケ−ジ冷却構造 Granted JPS59144153A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1835183A JPS59144153A (ja) 1983-02-07 1983-02-07 集積回路パツケ−ジ冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1835183A JPS59144153A (ja) 1983-02-07 1983-02-07 集積回路パツケ−ジ冷却構造

Publications (2)

Publication Number Publication Date
JPS59144153A true JPS59144153A (ja) 1984-08-18
JPS644670B2 JPS644670B2 (enrdf_load_stackoverflow) 1989-01-26

Family

ID=11969248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1835183A Granted JPS59144153A (ja) 1983-02-07 1983-02-07 集積回路パツケ−ジ冷却構造

Country Status (1)

Country Link
JP (1) JPS59144153A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5133403A (en) * 1988-10-19 1992-07-28 Hitachi, Ltd. Cooling arrangement for semiconductor devices and method of making the same
CN109121337A (zh) * 2018-09-29 2019-01-01 江苏汇鑫新能源汽车科技有限公司 一种电动车控制器散热外壳

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253547A (en) * 1975-10-28 1977-04-30 Ibm Gas enclosed type cooling apparatus
JPS57103337A (en) * 1980-12-19 1982-06-26 Hitachi Ltd Heat transfer connecting device and manufacture thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253547A (en) * 1975-10-28 1977-04-30 Ibm Gas enclosed type cooling apparatus
JPS57103337A (en) * 1980-12-19 1982-06-26 Hitachi Ltd Heat transfer connecting device and manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5133403A (en) * 1988-10-19 1992-07-28 Hitachi, Ltd. Cooling arrangement for semiconductor devices and method of making the same
CN109121337A (zh) * 2018-09-29 2019-01-01 江苏汇鑫新能源汽车科技有限公司 一种电动车控制器散热外壳

Also Published As

Publication number Publication date
JPS644670B2 (enrdf_load_stackoverflow) 1989-01-26

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