JPS59143607A - Dicing device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dicing device for cutting and separating a semiconductor wafer into a plurality of pellets. are each cut into 9 parts to form minute rectangular element pellets. A custom dicing machine is used for this cutting, and while adhesive tape is pasted on one side of the semiconductor wafer and fixed to a table, a diamond blade (dicing saw) rotating at high speed is placed on the surface of the semiconductor wafer. X direction, Y
By moving in the direction, the semiconductor wafer is cut into squares to form rectangular element pellets.

By the way, in this dicing method, since the semiconductor wafer is cut regardless of the crystal direction, it is possible to obtain a smoother cut surface than in diamond scribing, which takes advantage of the strength of the crystal. Since it is rotated at a high speed of 10'00 (5 to 70,000 rpm), it is impossible to prevent some defects from occurring on the cut surface due to the cutting impact.As shown in Fig. 1, this defect 2 is due to the fine cutting of the pellet 1. Defects 2a and 2b occur over almost the entire area of surface 1a, but especially when defects 2a and 2b occur on the upper and lower edges of the pellet, cracks are likely to occur in the pellet starting from these defects, resulting in pellet failure.

Therefore, it is an object of the present invention to provide a dicing apparatus that does not cause defects on the finely cut surfaces of the pellets, thereby preventing the occurrence of cracks in the pellets and improving reliability.

In order to achieve this object, the present invention comprises a dicing saw with two or more blades arranged in series, with the leading blade used for cutting and the rear blade used for polishing. It is.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

FIG. 2 shows an embodiment of the device of the present invention, and in the figure, 10
is a semiconductor wafer that is cut into a plurality of pellets, on the surface of which elements with a predetermined circuit pattern are arranged in a grid pattern 7, and supported in a holster 12 by an adhesive tube 11. .

This holder 12 is positioned and integrally fixed on a dicing table 13, and moves the wafer 10 together with the table 13 in the X direction intermittently, that is, at a pitch equal to the size of the pellet to be cut and formed.

On the other hand, 14 is a dicing saw, which consists of two diamond blades 15 and 16 arranged in series on a straight line in the Y direction (in the horizontal direction in the figure). These diamond blades 15 and 16 are respectively supported on rotary shafts 18 and 19 protruding from a support 17 that reciprocates in the Y direction.
The blades are reciprocated together with the blade 7 in the Y direction, and both blades are rotated at high speed either together or independently. Among the blades 15 and 16, the leading blade 1 on the left side in the figure
Reference numeral 5 is the same as a conventional blade with diamond abrasive grains, and is configured for cutting semiconductor wafers, while the blade 16 on the rear side on the right side in the figure is configured with fine diamond abrasive grains for polishing.

In addition, the leading blade 15 is as shown in FIG.
Its width t1 is slightly smaller than the width t2 of the rear blade 16.

According to the above configuration, if the table 13 is moved intermittently in the X direction and the support body 17 is intermittently moved back and forth in the Y direction, the diamond blades 15 and 16 will move over the semiconductor wafer 10 in the Y direction. The wafer 10 is cut in the Y direction, and by repeating this process, the wafer 10 is divided into pieces in the X direction. Therefore, next time, if the wafer 10 on the table 13 is changed in direction by 90 degrees and reset, the wafer can be cut into squares and divided into a plurality of pellets by the same operation.

At this time, when cutting the wafer 10 in the Y direction, immediately after cutting the wafer 10 in the same way as in the past with the leading blade 15, the cut surface is polished with the rear blade 16 that moves together with the leading blade 15. Become.

The difference in the width dimensions of both blades 15 and 16 results in their polishing. Therefore, even if the leading blade 15 causes a defect similar to the conventional one, the cutting surface can be polished by the rear blade 16 to remove the defect and create a defect-free cut surface. .

As a result, cracks in the pellet can be reliably prevented without causing defects such as the upper edge and the lower edge of the finely cut surface of the pellet to be formed. In addition, since polishing further improves the smoothness of the cut surface, it is effective in automating post-processes such as pellet bonding.

Here, although the above embodiment shows an example in which two diamond blades are arranged in series at the front and rear, the number of cutting or polishing blades may be increased to provide a configuration with three or more blades. Moreover, although each blade is integrally supported on one support stand, each blade may be supported separately so that it can move independently. Furthermore, a configuration may be adopted in which one of the blade and the wafer is fixed while dicing is performed while the other is moved in the X direction and the Y direction.

As described above, according to the dicing apparatus of the present invention, the dicing saw is configured with a plurality of blades, and each blade is configured for cutting and polishing. Up.

It is possible to prevent defects from occurring on the lower edge, thereby preventing the occurrence of pellet cranks and improving the reliability of the pellet. It also has effects such as improving the appearance of the pellet and being effective in automating post-processing. play.

[Brief explanation of the drawing]

FIG. 1 is a partial perspective view of a pellet for explaining the conventional problems, FIG. 2 is a schematic perspective view of the device of the present invention, and FIG. 3 is a plan view of the blade. 1... Pellet, 2.2a, 2b... Defect, 10.
... Semiconductor wafer, 13... Dicing table,
14...Dicing saw, 15...Diamond blade (front), 16...Diamond blade (rear side), 17...Support, 1. , 12...Blade width dimension.

Claims (1)

[Claims] 1. In a dicing device that is equipped with a dicing saw that rotates at high speed and cuts a semiconductor wafer with the dicing saw, the dicing saw is connected to a plurality of blades arranged in series in the cutting direction. What is claimed is: 1. A dicing device comprising at least a leading blade for cutting and a rear blade for polishing 1. 2. The dicing apparatus according to claim 1, wherein the polishing blade is made of abrasive micro-abrasive grains. 3. The ticing device according to Patent No. 11-1-2, wherein the width of the cutting blade is slightly smaller than that of the polishing blade.