JPS59143047U - 回路部品 - Google Patents

回路部品

Info

Publication number
JPS59143047U
JPS59143047U JP1983036398U JP3639883U JPS59143047U JP S59143047 U JPS59143047 U JP S59143047U JP 1983036398 U JP1983036398 U JP 1983036398U JP 3639883 U JP3639883 U JP 3639883U JP S59143047 U JPS59143047 U JP S59143047U
Authority
JP
Japan
Prior art keywords
pad
gui
firing
outer periphery
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983036398U
Other languages
English (en)
Inventor
和宏 山口
功 橋本
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP1983036398U priority Critical patent/JPS59143047U/ja
Publication of JPS59143047U publication Critical patent/JPS59143047U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
１ｇ　１　図ａ〜Ｃは従来のグイパッドにおけるチップ
部品の実装方法を示す図である。第２図ａ、　　ｂはこ
の考案の一実施例を示す図であり、１はチップ部品、２
は導電性接着剤、３はグイパッド、４は回路導体、５は
回路基板、６は絶縁体等のガイド部である。なお、図中
、同一あるいは相当部分には同一符号を付して示しであ
る。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板上に導体ペーストの印刷及び焼成によって形成
    され、その上に接着剤によって素子が実装されるグイパ
    ッドと、このグイパッドの外周に沿って設けられ、かつ
    このグイパッドの外形寸法と同一か、もしくは若干太き
    目に印刷及び焼成によって帯状に形成するとともに、上
    記素子の取付゛け時には位置決め用のガイドとなり得る
    絶縁部とから構成され、上記のグイパッド上に素子を取
    付ける場合に用いられる接着剤のグイパッド外周への流
    出を上記の絶縁体部によって防ぐようにしであることを
    特徴とする回路部品。
JP1983036398U 1983-03-14 1983-03-14 回路部品 Pending JPS59143047U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983036398U JPS59143047U (ja) 1983-03-14 1983-03-14 回路部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983036398U JPS59143047U (ja) 1983-03-14 1983-03-14 回路部品

Publications (1)

Publication Number Publication Date
JPS59143047U true JPS59143047U (ja) 1984-09-25

Family

ID=30167072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983036398U Pending JPS59143047U (ja) 1983-03-14 1983-03-14 回路部品

Country Status (1)

Country Link
JP (1) JPS59143047U (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244648A (ja) * 1987-03-30 1988-10-12 Mitsubishi Electric Corp 半導体装置の製造方法
JPH01205032A (ja) * 1988-02-09 1989-08-17 Nippon Steel Corp 自動車用高強度電縫鋼管の製造方法
JPH02310213A (ja) * 1989-05-25 1990-12-26 Matsushita Electric Works Ltd 平板瓦の梱包体の段積み方法
JPH0897533A (ja) * 1994-09-22 1996-04-12 Ibiden Co Ltd 電子部品搭載装置
JPH08181166A (ja) * 1994-12-22 1996-07-12 Ibiden Co Ltd プリント配線板
JPH09293744A (ja) * 1996-02-29 1997-11-11 Denso Corp 電子部品の実装方法
JP2018032684A (ja) * 2016-08-23 2018-03-01 ローム株式会社 半導体装置、パワーモジュール及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244648A (ja) * 1987-03-30 1988-10-12 Mitsubishi Electric Corp 半導体装置の製造方法
JPH01205032A (ja) * 1988-02-09 1989-08-17 Nippon Steel Corp 自動車用高強度電縫鋼管の製造方法
JPH02310213A (ja) * 1989-05-25 1990-12-26 Matsushita Electric Works Ltd 平板瓦の梱包体の段積み方法
JPH0897533A (ja) * 1994-09-22 1996-04-12 Ibiden Co Ltd 電子部品搭載装置
JPH08181166A (ja) * 1994-12-22 1996-07-12 Ibiden Co Ltd プリント配線板
JPH09293744A (ja) * 1996-02-29 1997-11-11 Denso Corp 電子部品の実装方法
JP2018032684A (ja) * 2016-08-23 2018-03-01 ローム株式会社 半導体装置、パワーモジュール及びその製造方法

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