JPS59142054A - Removing method and device of surface flaw on wire rod - Google Patents

Abstract

PURPOSE:To improve the yield rate of a wire rod and form the wire rod in a stable size and shape, by receiving a signal of depth, length and position of a flaw from a flaw detector so as to selectively remove a flaw part by the internal surface of a cylindrical rotary wheel continuously in an extended wire line. CONSTITUTION:A surface flaw on a wire rod 2 is detected by an eddy current flaw detector 6-1, and its signal allows an arithmetic control device 28 to calculate depth, length and position in the peripheral direction of the flaw and instruct the setting position in the peripheral direction, pressing force and pressing timing of a hydraulic servo cylinder for an internal grinding wheel device 7. On the basis of this instruction, turning an outer cylinder, if the hydraulic servo cylinder operates corresponding to a position in the peripheral direction of the flaw, an inner cylinder, being pressed in the diametric direction at a prescribed pressure, grinds only the instructed surface flaw to be removed by a cylindrical wheel 9, and if completed, the inner cylinder is released from being pressed, and an internal surface of the wheel 9 is detached from the wire rod. In such way, the surface flaw on the wire rod is surely ground automatically, thus enabling the wire rod to be repaired at a good yield rate.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for removing surface defects on a wire during drawing-in of the wire. - In the case of high-grade cold forging wire rods such as carbon steel, stainless steel, and bearing steel, it is required to have no surface flaws. As a method for removing surface flaws in response to this requirement, the surface of the wire has traditionally been scraped over its entire length using a beering method, a grinding method, or the like. However, in this method, since healthy parts outside the flaw area are also removed, a decrease in yield is inevitable, leading to a rise in manufacturing costs.

In addition, as another conventional method, there is a method in which surface flaws in the wire are detected using a flaw detector, and only the portion where the flaw exists is cut and removed. In this method, a flaw detector detects surface flaws on the wire, and the signal is transmitted as a cutting command to the partial eaves removal device.
In this method, a rotating cutting tool moves in the radial direction to remove the flaw. However, although this cleaning method using a partial eaves removal device has a higher yield than the full-length skinning method described above, it is not sufficient as a measure to improve yield because it cuts the entire circumference of the area where surface flaws exist. Moreover, when the wire rod is pulled out after being treated, the influence of the cutting remains as a dimensional change, which is a disadvantage.

Furthermore, as a method to remove only the part where the flaw exists, after cutting off the entire outer periphery of the wire at a depth exceeding the flaw detection depth limit of the flaw detector, the wire is further removed using a peeling die. has been proposed, but even if all surface defects can be removed, a decrease in yield cannot be avoided.

The present invention was made in view of the above-mentioned conventional problems, with the aim of further improving the yield and stabilizing the dimensions and shape.

This invention basically uses an internal grindstone grinding method to remove surface flaws. This is a method that is carried out continuously during kneading, in which a flaw detector is used to continuously detect surface flaws on the wire rod behind the wire drawing die, and detect the depth, length, direction, and length of the flaws. receiving a signal of the bottom position in the horizontal direction, displacing a cylindrical rotary grindstone whose inner diameter is larger than the outer diameter of the wire toward the flaw;
A method for removing surface flaws from a wire rod, characterized by selectively removing only that portion of the inner surface of the grindstone.

Hereinafter, one embodiment of the present invention will be described based on the drawings.

In Fig. 1, a wire rod (2) fed out from a payoff stand (1) passes through a straightening machine (3) and is removed by a descaling device (4) to remove oxide films and the like from the surface of the wire rod. After lubrication through one or more pre-dry lubricant baths (5) arranged in series in the wire drawing direction 1
Next, the wire is drawn, and then the surface flaw detector (6) continuously detects surface flaws on the wire, and based on the surface flaw information, only the portions where surface flaws exist on the inner surface of the cylindrical grindstone are detected. The wire rods are picked by an automatic internal grinding device (7) that selectively removes the wire rods, and the wire rods after the wire rods are wound up as they are or after being drawn into a winder (8).

Here, the principle of the internal grindstone grinding method in this invention will be explained.

The internal grindstone grinding method uses the inner surface of a rotating cylindrical grindstone to press against a part of a running wire rod on a specific circumference with a constant load. This is a method of selectively abrasive and removing. According to this method, only a specific circumferential portion of the wire can be selectively cleaned, so cleaning can be done with much higher yield than conventional methods of cutting or grinding the entire circumference or methods using a wire partial shielding device. can. Furthermore, compared to a cutting tool or a peeling die, it has the advantage that the surface flaws are smoother, there is less variation in the dimensions and shape of the wire rod during the care, and the effect of the care marks on the next process is small.

Figure 2 shows the basic configuration of the automatic care device.
(6-1) is an eddy current flaw detector, (6-2) is a wire distance meter using a pulse generator, etc., and (7) is a wire rod distance meter that works in conjunction with the flaw detector to selectively remove only a specific circumferential portion of the wire. Internal grinding wheel automatic grinding device, (to) flaw detector,
The circumferential and longitudinal position of the flaw, the flaw length, and the flaw depth are determined by the signal from the wire length measuring needle! This figure shows an arithmetic and control device that performs arithmetic operations and transmits the results as a grinding command to the internal grindstone grinding device (7), as well as instructing the wire drawing machine drive device to send a signal to change the line speed.

The internal grindstone automatic grinding device (7) according to the present invention has a mechanism in which a cylindrical rotary grindstone (9) swings in a direction perpendicular to the wire rod (2). It has the function of being pressed with pressure. FIG. 8 shows an example.

That is, in FIG. 8, (9) is a cylindrical rotary grindstone, and it is possible to use a one-piece grindstone or one that can be divided into a plurality of pieces for easy removal. This grindstone has an inner diameter larger than the outer diameter of the wire (2) that is made to advance and pass linearly in the direction of the arrow through an entrance guide (not shown) and an exit guide (not shown), It is attached to the tip of an inner cylinder 0υ whose base end is supported by a spherical bearing Q13 and can swing freely in the diametrical direction around this part. It is designed to be rotationally driven by a motor (not shown) via (2), and α→ is a belt for transmitting the rotation.

On the outside of the inner cylinder (B), an outer cylinder α→ which is rotatably driven separately from the inner cylinder is arranged concentrically with the inner cylinder, and this outer periphery has an inner diameter larger than the outer diameter of the inner periphery (B). When the housing Q is fixed to the base (to), it is rotatably supported via a bearing (to), and the gear (Gl) (Gl ) (G3), and a spherical bearing 0Q that supports the proximal end of the inner cylinder α is attached to the housing α peak that supports this outer cylinder.

On the outer periphery Q4, cylinders (for example, hydraulic servo cylinders) (E) that press the inner cylinder α force in the diametrical direction are arranged at several places around the circumference, and the structure of their installation is the tip of the outer cylinder α→ The hydraulic servo cylinder (E) is mounted on the side outer periphery so that it is parallel to the wire rod, and the cylinder is fixed to the base 12 with a bolt (A). The presser arm (C) is attached to the hydraulic servo cylinder (E), which is rotatable in the radial direction around the center.
It is attached so that it is operated by the arm (
The rotary lobe (to) installed at the lower end of the rotary whetstone (9)
) The inner cylinder (B) is pressed against a rotary ring (5) which is freely rotatably attached to the outer periphery of the tip of the inner cylinder (B) via a bearing.

That is, the above-mentioned device has a mechanism in which a cylindrical grindstone (9), which is rotationally driven integrally with the inner cylinder αη, is pressed by hydraulic servo cylinders (1) arranged at several points around the outer circumference α4 for grinding. , and by rotating the outer cylinder α◆ and positioning the hydraulic servo cylinder at the circumferential position of the flaw, the grindstone (9) is pressed against the wire rod (2) with a predetermined pressure depending on the depth and length of the flaw. It is configured as follows.

Now, a surface flaw in the wire (2) is detected by the eddy current flaw detector (6-1), and based on the signal, the arithmetic and control unit (to) detects the depth, length, and circumferential position of the flaw (for example, the circumference is 86 mm, etc.). ) is calculated, and the setting position in the circumferential direction of the hydraulic servo cylinder (E) with respect to the internal grinding wheel grinding device (7), the pressing is the pressure,
The timing of pressing is specified. Based on this instruction,
When the outer cylinder Q4 rotates and the hydraulic servo cylinder (E) is aligned with the circumferential position of the flaw, and the corresponding hydraulic servo cylinder (1) is operated, pressing is performed with a predetermined pressure via the arm (C). The inner cylinder Qη is pressed in the radial direction, and the cylindrical grindstone (9) is used to grind away only the indicated surface flaws, and when the grinding is completed, the servo cylinder is reversely operated to release the pressure. Separate the inner surface of the cylindrical grindstone (9) from the wire circumferential surface.In this way, for any surface flaw located anywhere on the wire (2), the location number where the surface flaw exists is automatically determined. A cylindrical grindstone is pressed against the surface, and automatic grinding of only the flawed portion can be reliably performed.

In addition, if there are many surface flaws on the same circumference, operate the hydraulic servo cylinder and move the motor α1 iron outer cylinder α→ while keeping the cylindrical grindstone (9) in contact with the wire rod (2). It can be removed by grinding the entire circumference of the wire by rotating it continuously.

Figure 4 shows the grinding wheel using this invention device, grinding wheel inner diameter 50 order - 1 outer diameter toomφ, width 5 Q II, peripheral grinding speed 1000 m.
/mln shows the relationship between fin speed and grinding depth when grinding the surface of 18MIIφ, 545C material. The grinding depth needs to be changed according to the depth of the flaw, and this can be changed by changing the grinding pressure (load) and also by changing the line speed.

For example, when a flaw of Q and 1 m is detected during wire drawing at 15 m/m1n, the grinding condition A is selected, and when a flaw of Q and 15 mm is detected, the grinding condition B is selected. Surface flaw 0.3 *s
In the case of depth, condition A is selected with line speed g m/mln.

The above example is a case of 18Ialφ wire drawing material,
Grinding conditions for each size are recorded in the controller and
Pressure and line speed will be automatically commanded.

As the original line speed is immediately restored after grinding, efficiency can be improved.

As explained above, according to the present invention, a high yield can be achieved because only the areas where surface flaws are present can be removed by grinding, and since the grinding is removed using the inner surface of the cylindrical grindstone, the cleaning marks are smooth. And there is little variation in shape and dimensions. In addition, if there are many surface flaws on the same circumference and it is difficult to remove them by polishing by partial cleaning, it is possible to continuously change the suppression position of the cylindrical grindstone while it is in contact with the wire rod. All surface defects can be removed. Therefore, according to the present invention, any surface flaws can be efficiently removed by polishing even at °C, and a drawn wire material of high quality can be stably obtained.

[Brief explanation of the drawing]

Fig. 1 is a schematic diagram showing a surface eaves line of a wire showing an embodiment of the present invention, Fig. 2 is an explanatory diagram of an automatic reading method in the same, and Fig. 8 is an example of an internal grindstone automatic grinding device in the same. FIG. 4, which is a vertical sectional side view of the main part, is a chart showing the relationship between line speed and grinding depth in an embodiment of the present invention. 2... Wire rod, 6... Flaw detector, 6-1... Eddy current flaw detector, 6-2... Length measuring needle, 7'-... Internal grindstone automatic grinding device, 9... Same cylindrical shape Grinding wheel, lO...spherical bearing, 11
...Inner cylinder, 14...Outer cylinder, 16...Housing,
19... Outer cylinder drive motor, 20... Hydraulic servo cylinder, 24... Pressing arm, 27... Rotating ring. 05101520 Reinsheed v (m/m1n) 0 Inventor Noriyuki Tomiyo Aza 6-nowari 19 12-2 Toyota-cho, Minami-ku, Nagoya ■Applicant Noritake Co., Ltd. 3-1-36 Noritake Shinmachi, Nishi-ku, Nagoya

Claims (1)

[Scope of Claims] 1. A method of continuously detecting and reading surface flaws on the wire in a wire drawing line when drawing the wire, the method continuously detecting and reading surface flaws on the wire using a flaw detector behind the wire drawing die. After detecting surface flaws on the wire rod and receiving signals indicating the depth and length of the flaw, and the position of the flaw in the circumferential direction and length direction, the cylindrical rotary grindstone, through which the wire rod passes through its center hole, is moved to detect the flaw. A method for removing surface flaws on a wire rod, characterized by bringing the wire rod into contact with the inner surface of the wire rod, and polishing only that portion with the inner surface of the whetstone. 2 A method in which surface flaws on the wire are continuously detected and read in the wire drawing line during the +C drawing process of the wire, and the surface flaws on the wire are continuously detected by a flaw detector behind the wire drawing die. After detecting the flaw, receiving signals of the depth and length of the flaw, and the flaw position in the circumferential direction and length direction, a cylindrical rotary grindstone, in which the wire passes through the center hole, is brought into contact with the flaw. A method for removing surface flaws on a wire rod, the method comprising: grinding away a large number of flaws existing on the same circumference on the inner surface of the grindstone while continuously moving the abutting position in the circumferential direction. 8. A cylindrical grindstone having an inner diameter larger than the diameter of the wire rod and through which the wire rod passes through its center hole is attached to an inner cylinder that is swingable in the diameter direction around the base end and is rotationally driven by a motor. An outer cylinder is attached to the tip, has an inner diameter larger than the outer diameter of the inner cylinder, and is rotatably driven separately from the inner cylinder, and is arranged concentrically with the inner cylinder. A cylinder is installed that presses the inner periphery in the diametrical direction via a free rotating ring that is rotatably fitted onto the tip of the inner cylinder, and the depth, length, circumferential direction, and length of wire surface flaws are determined. 1. A surface eaves removal device for a wire rod, which is configured to press a cylindrical grindstone against the wire rod at a predetermined pressure depending on the position in the horizontal direction, and rotate the outer cylinder while being pressed.