JPS6062453A - Surface scraping method of wire rod and device thereof - Google Patents

Abstract

PURPOSE:To aim at improvements in a yield rate and stabilization in size and form, by repeatedly reciprocating a cylindrical rotary grinding wheel with its inner surface upon receiving each signal of depth, length and positions of flaw in the wire rod detected by a flaw detector, while grinding the wire rod as being rotated in the circumferential direction. CONSTITUTION:After peeling an oxidized film or the like from the surface, a wire rod 2 is subjected to a primary wire stretching after moiste activation treatment through a die front dry type moiste activator tank, then surface flaw detection for the wire rod takes place in succession by a surface flaw detector 6-1, while on the basis of surface flaw detection, only such a portion as being flawed in its surface is mended with an inner surface of a cylindrical rotary grinding wheel through an internal wheel automatic grinding attachment 7 which grinds the flawed part in a selective manner, and the mended wire rod is rolled on a takeup roller 8 in series. Thus, since a specific circumferential part alone of the wire rod is selectively mendable, mending can be done in a favorable yield rate as compared with a whole circumference cutting method and, what is more, mending warks left behind on the surface are smooth enough in comparison with the case of using a cutting tool or a scalping die, while variations in size and form of the wire rod after mending are little, besides less influence to the next stage of work.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for removing surface defects on a wire rod in a wire drawing line.

In the case of high-grade cold forging wire rods such as carbon steel, stainless steel, and bearing steel, it is required that there be no surface flaws. As a method for removing surface flaws to meet this requirement, the surface of the wire has traditionally been scraped over its entire length using a beering method, a briding method, or the like. However, in such a method, since healthy parts other than flawed parts are also removed, a decrease in yield is inevitable, leading to a rise in manufacturing costs.

In addition, as another conventional method, there is a method in which surface flaws in the wire are detected using a flaw detector, and only the portion where the flaw exists is cut and removed. In this method, a flaw detector detects surface flaws on the wire, and the signal is transmitted as a cutting command to the partial eaves removal device.
In this method, a rotating cutting tool moves in the radial direction to remove the flaw. However, although this cleaning method using a partial eaves removal device has a higher yield than the full-length skinning method described above, it cannot be said to be sufficient as a measure to improve yield because it cuts the entire circumference of the area where surface flaws exist. It has a score of 5-1, which means that the cutting effect remains as a dimensional change when the wire rod is pulled out after the treatment.

Furthermore, as a method of cutting and removing only the part where the flaw is present,
A method has been proposed in which the entire outer periphery of the wire is removed at a depth below the flaw detection depth limit of the flaw detector, and then further removed using a peeling die, but this method does not remove all surface flaws. Even if this is possible, a decrease in yield cannot be avoided.

The present invention was made in view of the above-mentioned conventional problems, with the aim of further improving the yield and stabilizing the dimensions and shape.

This invention basically uses an internal grindstone grinding method to remove surface flaws, and its gist is to continuously detect surface flaws on the wire using a flaw detector behind the wire drawing wire. In response to signals of the depth and length of the flaw and the paper position in the circumferential and longitudinal directions, a cylindrical rotary grindstone with a wire passing through its center hole is brought into contact with the flaw, and the grindstone This method is characterized in that the cylindrical rotary grindstone is repeatedly moved back and forth in the axial direction of the wire rod to remove the grinding portion only on the inner surface of the wire rod, and the cylindrical rotary grindstone is There is a method for removing surface flaws on a wire material, characterized in that the surface flaws are removed by grinding while rotating in the circumferential direction.

Hereinafter, one embodiment of the present invention will be described based on the drawings.

In Figure 1, the T-co wire (2) fed out from the payoff stand (1) passes through a straightening machine (3), and then a descaling device (4) removes the oxide film etc. from the wire surface and removes E. After that, the dies are arranged in series in the wire drawing direction, and each die is lubricated through the dry lubricant tank (5) in front of the dies. Internal grindstone automatic grinding that continuously detects surface flaws on the wire rod using the machine (6), and selectively removes only the portion of the inner surface of the cylindrical rotary grindstone where surface flaws exist based on the surface flaw information. The device (7) takes care of the flaws, and the wire rod after the care is wound up as is or after being drawn and sequentially wound up in the winding machine (8).

Here, the principle of the internal grindstone grinding method in this invention will be explained.

The internal grindstone grinding method uses the inner surface of a rotating cylindrical grindstone to run or i! This is a method of selectively polishing and removing specific areas where surface flaws exist by pressing a part on a constant circumference of 4"J with a constant load. According to this method, Since it is possible to selectively clean only a specific circumferential area, it is much more advanced than the conventional method using a cotton grinder part flaw removal device that uses the entire circumference cutting or grinding method.
'i It can be well maintained. Moreover, compared to cutting tools and peeling dies, the surface scratches are smoother, there is less variation in the dimensions and shape of the wire rod after cleaning, and the cleaning marks are less likely to affect the next process.

Figure 2 shows the principle configuration of the automatic maintenance 'j/j, 14, where (6-1) is an eddy current flaw detector, (6-2) is a wire rod length measurement d1, (7) using a pulse generator, etc. ) is an internal grindstone automatic grinding device that can selectively remove only a specific circumferential portion of a wire rod in conjunction with a flaw detector; (2)
To calculate the circumferential and longitudinal position of the flaw, the flaw length, and the flaw depth using the flaw detector and the wire rod d (from the length 31 to the f5),
The result is transmitted as a grinding command to the internal grindstone grinding device (7), and a signal to change the line speed is transmitted to the wire drawing machine M! fj! + Shows the first arithmetic and control unit that commands the device.

The internal grindstone automatic grinding device (7) according to the present invention has a mechanism in which a cylindrical rotary grindstone (9) swings in a direction perpendicular to the wire rod (2), and can be placed at any position in the circumferential direction and length direction. Partial grinding can be carried out by pressing with arbitrary pressure in the direction, and this partial grinding can be repeated in the length direction, and further, partial grinding can be repeated in the length direction by changing the grinding position in the circumferential direction. It is equipped with a function that allows

FIG. 3 shows a device t according to an embodiment of the present invention. An outer cylinder θ shaft that is rotationally driven in the circumferential direction is installed horizontally via a bearing (16), and its base end is supported by a spherical bearing (I6), and can swing freely in the diametrical direction around this part. Inner cylinder (I8) that is rotationally driven in the circumferential direction by a motor 07)
is provided inside the outer cylinder (14+), and a cylindrical grindstone (9), which is integrated or can be divided into multiple pieces, is attached to the tip of this inner cylinder (14+). ) has a larger inner diameter than the outer diameter.

The outer cylinder 04) is equipped with a cylinder (for example, a hydraulic servo cylinder) (+9+
are arranged at several places around the circumference, and the structure of these few phrases is as follows.
The wire rod (2 cylinders for pressing multiple cylinders) is attached to the 4 cylinder stand (3) protruding from the tip side of the outer cylinder (14).
), and is attached to a plurality of support punches (21) protruding from the cylinder support stand (4), and is rotatably mounted in the radial direction around a fulcrum (22). ?: +1 is connected to the rod ♀4j of the cylinder for each press, and the mechanism is such that the arm (23) operates in the radial direction for pressing in the cylinder for press (09), and each press is connected to the rod ♀4j of the cylinder (231).
The rotating roller (25j) installed at the bottom of the cylindrical grindstone (9
) is rotatably attached to the outer circumference of the tip of the inner cylinder (18) via a bearing (to).
! ? + and is a mechanism that presses the inner cylinder (18) in the radial direction.

In other words, cylindrical grindstones (9) that are rotated together with the inner cylinder are arranged at several locations around the outer circumference (1 cylinder), and the grinding process is carried out by pressing them with a cylinder (10). At the same time, rotate the outer cylinder (14), position the sill ring (19) to press it at the circumferential position of the flaw, and press the whetstone (9) with a predetermined pressure depending on the depth and length of the flaw. is configured to be pressed against the wire rod (2).

Note that the wire rod (2) is configured to move linearly in the direction of arrow A via an entrance guide (not shown) and an exit guide (not shown). (29) is a winding motor.

Next, to explain the method for removing surface flaws on a wire rod using the device of this invention described above, first, the method for removing surface flaws from a wire rod is performed by
The rS machine (6-1) continuously detects surface flaws on the wire (2), and based on the signals, the arithmetic and control unit (to) determines the depth, length, and circumferential position of the flaw (for example, the circumferential position). is divided into 36 equal parts), and the longitudinal position is calculated. The longitudinal position can be found by measuring the distance traveled by the probe of the flaw detector with a length measuring needle (for example, a pulse generator).

For example, in the case of the flaw shown in Figure 4a, the position of this flaw (3@) is shown in the map (1) in the figure,
The bridge remembers this.

When a surface flaw is detected in this way, the automatic grinding device advances the wire (2) to a position where it can be easily cleaned, and the winding motor 9) is stopped. When the wire (2) is stopped at a predetermined position, the position and depth of the arithmetic and control unit (surface flaws 00 due to 2 barrels) are memorized, so based on this information,
The arithmetic and control unit 4 instructs the internal grindstone grinding device (7) to start the grindstone drive motor θη and the circumferential positioning motor (
13> control, drive control of the longitudinal traveling motor α,
For pressing, a special grinding pressure control command is issued, and partial grinding is performed as shown in the map shown in Figure 4 above.

If the depth of the surface flaw (aO) is deep, the machine base (Il)
By repeatedly reciprocating in the length direction, it is possible to grind to the required depth. FIG. 5 shows an example of this, where G shows the grinding marks on the outward pass and (33) shows the grinding marks on the return pass. Further, as shown in FIG. 6, by gradually rotating and moving the grinding position in the circumferential direction every reciprocation, it is possible to perform partial maintenance over a wide range. bi is the grinding mark of the first round trip, (30 is the grinding mark of the second round trip, (3G) is 3
Shows the grinding marks on the back and forth. In addition, if two or more surface flaws (30) and (8) exist simultaneously on the same circumference, as shown in Fig. 7, the reciprocating grinding shown in Fig. 5 above is performed for each surface flaw. All you have to do is implement it. In addition, the machine (1
1) by controlling the grinding pressure on the two axes (X-Y axes) and sequentially moving the contact area between the wire rod (2) and the inner surface of the cylindrical grindstone (9) in the circumferential direction. As shown in the figure, it is possible to grind the entire circumference in a spiral manner.

As explained above, in this invention, since the automatic care machine is movable in the lengthwise direction of the wire, even if the flaw is long in the lengthwise direction of the wire, only the part where the flaw exists can be removed by polishing. In addition, by reciprocating the automatic care machine and repeatedly grinding as shown in Figure 5, the grinding depth can be deep, the grinding marks are smooth, and the machining heat increase in the grinding part of the wire can be reduced. (There are also fewer abnormal structures such as martensite and bainite on the surface layer.As shown in Figure 6, a wide range can be ground, so there are almost no surface flaws left behind.Furthermore, As shown in Fig. 7, it is possible to grind multiple surface flaws with a high yield, and as shown in Fig. 8, it is also possible to grind the entire circumference in a spiral shape, so even many flaws on the surface of the wire can be continuously ground. Therefore, according to the present invention, any surface flaws can be efficiently removed by polishing, and a drawn wire material of high quality can be stably obtained.

Next, embodiments of the invention will be described.

〔Example〕

With the equipment configuration shown in Figure 3, the grindstone has an inner diameter of 50 gates and an outer diameter of 10.
01φ, width 50 mm, grinding wheel circumferential speed i 0 o o m/1n
Ins 4 hydraulic servo cylinders (cylinders for pressing the grindstone), grinding depth MΔx 0.2m shoulder internal grindstone grinding device, rotating probe type eddy current detector f↓15 (flaw detection frequency 64KHz), material 545C, 14 , A of 0 gate φ
Depth 03M, length 100mm pre-attached to the surface of S roll material
Surface flaws as shown in FIG. 9 of FIG. 9 were removed by polishing.

At that time, the grinding pressure (hydraulic pressure) was 40 kqf, the grinding motor current was 14 A, and the running speed of the grinding device was 20 m/mix.

When the polishing was carried out under the above conditions, the surface flaws could be completely removed by two reciprocating grinding operations. In addition, the grinding marks were very smooth, the increase in machining heat at the ground part of the wire was small, and almost no abnormal structures such as martensite or bainite were observed on the surface layer.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing a wire surface flaw removal line according to the present invention, FIG. 2 is an explanatory diagram showing an automatic paper removal method according to the above, and FIG. FIG. 4 is an explanatory diagram showing a method for detecting the position of a surface flaw in the same as above, and FIGS. 5 to 8 are explanatory diagrams showing an example of a method for removing surface flaws in the same as above. 2... Wire rod, 6-1... Flaw detector, 6-2... Length measuring meter, 7... Internal grindstone automatic grinding device, 8... Winding machine,
9... Cylindrical grindstone, 11... Machine stand, 12... Traveling motor, 13... Outer tube drive motor, 14... Outer tube, 16... Spherical bearing, 17... Inner cylinder drive motor, 1
8...Inner cylinder, 19...Cylinder for pressing, 23.
・・Push (Jke arm-27・Rotating ring, 28・・
・Arithmetic control device. Applicant: Sumitomo Metal Industries, Ltd.

Claims (1)

[Claims] 1. A flaw detector continuously detects surface flaws on the wire material behind the wire drawing die, and receives signals indicating the depth and length of the flaws and the position of the paper in the circumferential direction and length direction. In this method, a cylindrical rotary grindstone, through which the wire passes through its center hole, is brought into contact with the flaw toward the flaw, and only that portion is ground away using the inner surface of the whetstone, and the cylindrical rotary grindstone is rotated in the axial direction of the wire rod. A method for removing surface flaws from a wire material, which comprises repeatedly moving the wire material back and forth to remove it by polishing. 2 A flaw detector continuously detects surface flaws on the wire behind the wire drawing die, and receives signals of the depth and length of the flaw and the position of the paper in the circumferential and longitudinal directions. A method in which a cylindrical rotary whetstone passing through a center hole is brought into contact with the flaw, and only that portion is ground away using the inner surface of the whetstone, and the cylindrical rotary whetstone is repeatedly reciprocated in the axial direction of the wire. A method for removing surface flaws on a wire rod, characterized in that the cylindrical rotary grindstone is rotated and removed in the circumferential direction during each reciprocation. 3. A traveling machine that can reciprocate in the axial direction of the wire by a drive device such as a motor or a cylinder is provided with an outer cylinder horizontally driven to rotate in the circumferential direction by a motor, an inner cylinder that is freely swingable in the diametrical direction and that is rotationally driven by a motor separately from the outer cylinder is disposed concentrically with the outer cylinder;
The tip of the inner cylinder has an inner diameter larger than the diameter of the drawn wire material,
The outer cylinder is equipped with a cylindrical grindstone through which the wire drawing material passes through its center hole, and the inner cylinder is pressed diametrically through a free rotary ring that is rotatably fitted to the tip of the cylinder. Each drive motor for the cylinder and outer cylinder is arranged at several points around the circumference of the cylinder, and is detected by a surface flaw detector. Wire rod surface eaves protection device equipped with a control device that controls the inner cylinder pusher (J cylinder and machine running drive device)
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