JPS59129460A - Semiconductor memory device - Google Patents

Semiconductor memory device

Info

Publication number
JPS59129460A
JPS59129460A JP58004326A JP432683A JPS59129460A JP S59129460 A JPS59129460 A JP S59129460A JP 58004326 A JP58004326 A JP 58004326A JP 432683 A JP432683 A JP 432683A JP S59129460 A JPS59129460 A JP S59129460A
Authority
JP
Japan
Prior art keywords
data lines
sense amplifiers
layout
memory device
amplifiers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58004326A
Other languages
Japanese (ja)
Inventor
Toshihiko Watanabe
利彦 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58004326A priority Critical patent/JPS59129460A/en
Publication of JPS59129460A publication Critical patent/JPS59129460A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Memories (AREA)

Abstract

PURPOSE:To enable a layout of high density by alternately arranging sense amplifiers at different end sections of data lines and disposing the data lines of adjacent sense amplifiers so as to be mutually held. CONSTITUTION:A plurality of data lines D5, D5', D6, D6' are arranged in parallel, and sense amplifiers SA5, SA6 are set up at every one pair (D5, D5'), (D6, D6') of two data lines. In the memory device, the amplifiers SA5, SA6 are arranged alternately at different end sections of the data lines D5, D5' and D6, D6', and data lines of adjacent sense amplifiers are disposed so as to be mutually held. Since such arrangement results in half sense amplifiers disposed in the same direction, pitches in a layout to the sense amplifiers can be increased up to approximately twice, thus allowing the layout of high density, then realizing the sense amplifiers under the optimum state without a limitation on the layout.

Description

【発明の詳細な説明】 本発明は、半導体記憶装置において電気的に平衡すべき
2本のデータ線のレイアウトに関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a layout of two data lines that should be electrically balanced in a semiconductor memory device.

第1図に従来の記憶装置のレイアウトの1例を示す。第
1図ではセンスアンプSAの2人力となる2本のデータ
線の組(Dl、D’工) 、 (D2 、D’2 )が
平行して配置され、センスアンプはデータ線に対し同一
端部側に配されている。この場合、上記センスアンプの
レイアウトピッチは上記データ線に接続されたメモリセ
ルMCのピッチによって決定されることになり大きな制
約を受ける。一般にメモリセルサイズは64に、256
に、1Mビットと次第に大容量になるにつれて縮小化の
傾向にある。
FIG. 1 shows an example of the layout of a conventional storage device. In Fig. 1, the two data line pairs (Dl, D'work) and (D2, D'2), which are the two-man power of the sense amplifier SA, are arranged in parallel, and the sense amplifier has the same end with respect to the data line. It is placed on the side of the department. In this case, the layout pitch of the sense amplifier is determined by the pitch of the memory cells MC connected to the data line, and is therefore subject to significant restrictions. Generally, the memory cell size is 64, 256
However, as the capacity gradually increases to 1M bits, there is a tendency for the size to decrease.

このことは当然メモリセルに連なるセンスアンプにも及
ぶことになり、メモリセルのピッチに上記センスアンプ
を収めることは甚だ困難となりむしろセルの縮小化とは
逆にセンスアンプは高感度化して回路技術上複雑化する
という傾向と全く相反するものであった。
This naturally extends to the sense amplifiers connected to the memory cells, and it is extremely difficult to fit the sense amplifiers into the memory cell pitch.In fact, contrary to the miniaturization of cells, the sense amplifiers have become more sensitive and circuit technology has increased. This was completely contrary to the trend of increasing complexity.

またメモリセルに連なる、トランジスタのワード線W1
.W2に対するコンタクトはメモリセル1bitjbた
り1個分の数だけ要する。このことは大容量のメモリに
なるとコンタクトのためのスペースが無視しえなくなり
、高密度化の大きな妨げとなっていた。そこで、ワード
線へのコンタクトをメモリセル2 btt分毎に共通に
することが考えられるが、それを第2図に示す。しかし
ながらかかるレイアウトではデータ線に対するトランジ
スタの方向が互いに逆となり、目合せずれによって同一
のセンスアンプに対して不平衡を生じ、高精度なデータ
の感知が困難なものであった。
In addition, the word line W1 of the transistor connected to the memory cell
.. The number of contacts for W2 is equal to one for each bitjb of the memory cell. This has become a major hindrance to higher density as the space for contacts becomes unignorable when the memory capacity becomes large. Therefore, it is conceivable to make the contact to the word line common for every 2 btt memory cells, which is shown in FIG. However, in such a layout, the directions of the transistors with respect to the data lines are opposite to each other, and the misalignment causes imbalance for the same sense amplifier, making it difficult to sense data with high precision.

本発明の目的は特性の優れた半導体記憶装置を提供する
ことにある。
An object of the present invention is to provide a semiconductor memory device with excellent characteristics.

本発明ではデータ線が平行して配置され、かつセンスア
ンプを上記データ線と異なる方向の端部に交互に配置し
、上記センスアンプに連なるデータ線をはさんで反対方
向の相隣るセンスアンプに連なるデータ線を配置するこ
とを特徴とする。
In the present invention, data lines are arranged in parallel, and sense amplifiers are arranged alternately at ends in a direction different from the data lines, and adjacent sense amplifiers in opposite directions sandwich the data lines connected to the sense amplifiers. It is characterized by arranging data lines connected to the .

本発明による半導体記憶装置を第3図に示す。A semiconductor memory device according to the present invention is shown in FIG.

本発明は、複数のデータ線Ds + D’s r D 
6 + D’6が並行に配列され、2本のデータ線1組
(D5゜D′5)、(D6.D′6)毎にセンスアンプ
SA5 、 SA6が設けられた記憶装置において、上
記センスアンプSA5 、 SA6をデータ線の異なる
端部に交互に配し隣り合うセンスアンプのデータ線は互
いにはさみ合うように配置したことを特徴とする。
The present invention provides a plurality of data lines Ds + D's r D
6 + D'6 are arranged in parallel and sense amplifiers SA5 and SA6 are provided for each set of two data lines (D5°D'5) and (D6.D'6). The present invention is characterized in that the amplifiers SA5 and SA6 are arranged alternately at different ends of the data lines, and the data lines of adjacent sense amplifiers are arranged so as to be sandwiched between them.

本発明によれば、同一方向に配されるセンスアンプは、
従来の1/2になるのでセンスアンプに対するレイアウ
トピッチを約2倍程度にできるため高密度なレイアウト
ができるとともにセンスアンプをレイアウト上の制約な
く最適な状態で実現できる。またメモリセルに連なるト
ランジスタを2bit分毎に共通にしてワード線とのコ
ンタクトの数を半減させることができる。また、データ
線に対するメモリセルの相対位置方向を、センスアンプ
を同じとするデータ線について同じにできる。
According to the present invention, the sense amplifiers arranged in the same direction are
Since it is 1/2 that of the conventional one, the layout pitch for the sense amplifier can be approximately doubled, so a high-density layout can be achieved, and the sense amplifier can be realized in an optimal state without layout constraints. Further, the number of contacts with the word line can be halved by making the transistors connected to the memory cells common for every 2 bits. Further, the relative position direction of the memory cells with respect to the data lines can be made the same for data lines having the same sense amplifier.

よってメモリセルとデータ線の間のトランジスタのチャ
ンネル方向も、同一にできる。このことは、ダミーメモ
リセルについても同様に実現できる。
Therefore, the channel directions of the transistors between the memory cell and the data line can also be made the same. This can be similarly achieved for dummy memory cells.

したがって、マスクの目合せずれがあっても2本のデー
タ線の電気的特性が平衡するような半導体記憶装置を実
現できる。
Therefore, it is possible to realize a semiconductor memory device in which the electrical characteristics of the two data lines are balanced even if there is misalignment of the masks.

第4図には、第3図に示した本発明を実施するメモリセ
ル部の配置の1例を示す。
FIG. 4 shows an example of the arrangement of the memory cell section implementing the present invention shown in FIG. 3.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のメモリを示すブロック図、第2図は他の
従来のメモリヲ示すブロック図、第3図は本発明の実施
例を示すブロック図、第4図はメモリセル部のレイアウ
トを示す平面図である。 W1〜w、。−−−−−−ワード線、D I + D’
l  + ”・D8+D’8データ線、SA1.・・・
、SA8・・・・・・センスアンプ。  5− 茅10 D /      Dt ’      D2    
  D2’をづ 旧 口 市1ボ・ルリ ロ  1茅2ボ1ルリ 國 ア7ぼ 脳  フ〉クク■
FIG. 1 is a block diagram showing a conventional memory, FIG. 2 is a block diagram showing another conventional memory, FIG. 3 is a block diagram showing an embodiment of the present invention, and FIG. 4 is a layout of a memory cell section. FIG. W1~w,. -------- Word line, D I + D'
l + ”・D8+D'8 data line, SA1...
, SA8... sense amplifier. 5- Kaya 10 D/Dt' D2
D2' Old Exit City 1 Bo Ruriro 1 Mo2 Bo 1 Ruri Country A7 Bo Brain F〉Kuku■

Claims (1)

【特許請求の範囲】[Claims] データ線が平行して配置され、かつセンスアンプを上記
データ線と異なる方向の端部に交互に配置し、上記セン
スアンプに連なるデータ線をはさんで反対方向の相隣る
センスアップに連なるデータ線を配置することを特徴と
する半導体記憶装置。
Data lines are arranged in parallel, and sense amplifiers are arranged alternately at ends in a direction different from the data lines, and data connected to adjacent sense up lines in the opposite direction across the data lines connected to the sense amplifiers. A semiconductor memory device characterized by arranging lines.
JP58004326A 1983-01-14 1983-01-14 Semiconductor memory device Pending JPS59129460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58004326A JPS59129460A (en) 1983-01-14 1983-01-14 Semiconductor memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58004326A JPS59129460A (en) 1983-01-14 1983-01-14 Semiconductor memory device

Publications (1)

Publication Number Publication Date
JPS59129460A true JPS59129460A (en) 1984-07-25

Family

ID=11581323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58004326A Pending JPS59129460A (en) 1983-01-14 1983-01-14 Semiconductor memory device

Country Status (1)

Country Link
JP (1) JPS59129460A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0195763U (en) * 1987-12-18 1989-06-26
JPH01286196A (en) * 1988-05-12 1989-11-17 Mitsubishi Electric Corp Dynamic semiconductor memory device
US4903344A (en) * 1987-07-07 1990-02-20 Oki Electric Industry Co., Ltd. Semiconductor memory device with staggered sense amplifiers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4903344A (en) * 1987-07-07 1990-02-20 Oki Electric Industry Co., Ltd. Semiconductor memory device with staggered sense amplifiers
JPH0195763U (en) * 1987-12-18 1989-06-26
JPH01286196A (en) * 1988-05-12 1989-11-17 Mitsubishi Electric Corp Dynamic semiconductor memory device

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