JPS59122007A - Manufacture of chip-shaped piezoelectric resonator - Google Patents

Abstract

PURPOSE:To improve the leading-out precision of electrodes and to form numbers of external electrodes of a chip-shaped piezoelectric resonator by adhering insulating plate base material to a piezoelectric substrate base material, and then carrying out a plating treatment and forming plating films at adhesion parts. CONSTITUTION:The insulating plate base materials 55 and 57 are adhered to main surfaces 51a and 51b of the piezoelectric substrate base material 51 with adhesives respectively. Then, the piezoelectric substrate base material and insulating plate base materials 55 and 57 are cut along lines l1, l1- running in the centers of circular holes 53, 53- among plating resist films 54, 54- to form thin long-sized units 58. This long-sized unit 58 is provided with a plating layer (not shown in a figure) by carrying out electroless plating after a pretreatment such as etching, and performing a plating treatment in a charge plating vessel. The unit 58 is cut along lines l2, l2- which run in the centers of said circular holes 53, 53- and cross those plating resist films 54, 54- almost at right angles and dipped in solder to obtain chip-shaped filters.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a method for manufacturing a chip-shaped piezoelectric resonator formed by bonding an insulating plate to the main surface of a piezoelectric substrate. 1. A filter chip having a circuit configuration 1 in which two sets of energy-keyed double-mode ceramic filters 5 and 5 are connected in cascade through a coupling capacitor C between the input terminal 1゜2 and the output terminals 3 and 11. In recent years, not only capacitors and resistors, but also coil parts and mechanical parts have been made into chips, and there has been an increasing demand for piezoelectric resonant parts made into chips. was.

Purpose of the Invention The present invention has been made based on the above-mentioned background, and its purpose is to improve the reliability of electrode extraction and to form external electrodes of a large number of chip-shaped piezoelectric resonators. That's true.

SUMMARY OF THE INVENTION The present invention provides a structure in which a plurality of consecutive rows of resonator electrode patterns are formed on the main surface, and a lead-out type (a piezoelectric substrate base material formed with such a pattern), which is compatible with these lead-out electrodes. Prepare an insulating plate having holes at the respective positions and apply a Metsukiresist film between the holes, place the Metsukiresist film on the outside, and apply the insulation board on each side. After bonding the entire vibration space of the resonator to both the upper and lower principal surfaces of the piezoelectric scattering plate matrix, the long unit was cut at 1171 points on both sides with the continuous overprint pattern in between, and the long unit was placed in a metal plating bath. After plating with ?if l~, the long unit is cut into chips along the gland passing through the extraction electrode of the resonator in a direction (almost perpendicular to the mesh resist) and separated into chips. There is.

Before entering into the description of the examples, a single chip-shaped filter obtained by the manufacturing method of the example will first be described in order to facilitate understanding.

That is, as shown in FIG. 2, the chip-shaped filter according to the present invention has a common electrode 12 of a three-terminal type energy storage type dual mode filter 5.6 on one main surface 11a.
,13. One electrode 14 of the coupled capacitor → f C, and the extraction electrode 15.16 of this electrode 14 and these electrodes 1
It is useful to connect the terminals as appropriate, and a band-shaped electrode 31.
32, as shown in FIG. The other electrode 21 of the capacitor C and the drawer type 1i 22 ,
a piezoelectric substrate 11 on which electrodes 23 and appropriately connecting these electrodes are formed, and an insulating plate 27 having externally attached electrodes 24, 25 and 26 separated from each other, as shown in FIG. ) 4'' externally mounted electrodes 28 and 29 separated from each other; and one insulating plate 30. The main surfaces 11a and 11bK of the 1F substrate J1 are attached with an adhesive to the insulating plates 27 and 30, respectively, leaving slight movement spaces at the 3-terminal filters 5 and 6.

To enable face bonding,
Piezoelectric reading (end face 11C of plate 11 and insulating plate 2 below the knee)
7. A double-sided bridge electrode (1?) is provided on the end face of the piezoelectric plate 11, and the end face lid side of the piezoelectric plate 11 is similarly treated, and half BB plating is applied to the entire electrode on the outer surface. With such a structure and manufacturing method, the insulating plate 270 electrode 26 is electrically connected to the extraction electrode 15.16 via the notch 33.34.The electrode 24 is electrically connected to the extraction type (to 22). - Convex electric conduction 1 issue 23.

EXAMPLE Hereinafter, an example in which a chip-shaped filter having the circuit configuration shown in FIG. 1 was obtained using the present invention will be described.

In this embodiment, first, as shown in FIG. 5, the piezoelectric 8 shown in FIG. 2 (electrode patterns 52, 52, . While forming by a method such as printing or vapor deposition, electrode nozzles 52, 52 are also formed on the other main surface 51b.
, . . , a piezoelectric substrate base material 51 is prepared in which the piezoelectric plate 1 (see FIG. 3) of FIG. 3 has an electrode pattern formed in the same manner as described above.

The above electrode pattern of the piezoelectric substrate matrix 51 is 52°52
, . . . each lead-out electrode 15.16 and mold edge 31.3.
2, circular holes 53°53,...
In addition, between the rows formed by these circular holes 53, 53, . . .
,54. An insulating plate 1]4g'55 made of glass epoxy, ceramic, etc. is prepared. At the same time, circular holes 56, 56, . . . are provided, and between the rows of circular holes 55, 56, . . .
Another insulating board base material to form a mesh resist with a constant width) llji%54' (-as an example, the width of two metsuki resists + electric (with a width of 26), 54',... Prepare 57.

The piezoelectric substrate has main surfaces 51a and 5]b of the material 51,
Common electrodes 12, 13, divided polarization 1 in Figures 2 and 3
7, 18 and 19, and spaces (not shown) at the top and bottom of 201D to allow vibration of those parts.

), considering the adhesive application area and thickness, so that
The above-mentioned insulating plate base materials 55 and 57 are bonded with adhesive, respectively.

Thereafter, -1- plating resist film 54.54. ...
Circular holes 53, 53. Line β1. dt, . . . along the piezoelectric substrate mother 4J'51. The insulating substrates 55 and 57 are cut to form a long and narrow unit 58 as shown in FIG.

After pretreatment such as etching or activation, this long unit 58 is subjected to electroless plating (barrel plating method) and, if necessary, plated in an electrolytic plating bath to increase the film thickness. forming a layer (not shown).

Next, as shown in FIG. 6, circular holes 53, 53, .・・・
If the elongated unit 58 is cut and soldered along lines 12, 12, . A chip filter 59 having exactly the same configuration as in FIG. 4 is obtained.

The Menki resist &54, 547 may be removed or may be left.

In the chip-shaped filter 59, the electrodes 24, 25, 26, 28 and 29 are formed by plating after bonding the piezoelectric scattering plate art material 51 and the insulating plate base materials 55 and 57 with adhesive.
are formed, the electrode 24 is connected to the electrode 31, the electrode 25 is connected to the electrode 32, the electrode 26 is connected to the lead-out electrode 15, etc., the electrode 28 is connected to the electrode 22, and the electrode 29 is connected to the electrode 23. Further, the electrode 31 and the drawer mold 1122, and the senior minister 32 and the drawer electrode 23 are electrically connected to each other through the plating layer formed during the plating process.

If you do the above, plating process 1? Round holes in the insulating plate base materials 55 and 57 in Fig. 6 in jJ! 53.53. ...and 56.56. ...Even if there is adhesive seeping inside,
Before plating the long unit 58, by selecting all the etching agents and activators used in plating pre-treatments such as etching and activation, the plating treatment can be completed, and the conductivity described above can be achieved. can be made complete.

In the above embodiment, the plating layer formed by plating is made of nickel (Ni
) and copper (Cu), etc., is preferable.

- Furthermore, in the above embodiment, the insulating plate base material 57 may be the same as the insulating base material 56.

The present invention provides a piezoelectric resonator such as a similar two-terminal +1< or three-terminal oscillator, a resonator for an FM discriminator, etc. It can be widely applied to wave-utilizing parts.

Effects of the Invention As is clear from the detailed explanation, the present invention has the following effects:
In a method for manufacturing a chip-shaped piezoelectric resonator in which insulating plates are bonded to both main surfaces of a piezoelectric substrate, the insulating plate base material is bonded to the piezoelectric substrate matrix and then plated, so that the adhesive portion A plating film is formed on the piezoelectric resonators, which not only greatly improves the reliability of electrode extraction, but also enables the formation of external electrodes on a large number of piezoelectric resonators in a single plating process, which reduces the Tatsuko's bank eco-cost can be reduced by a large amount. In addition, since the boundary between the piezoelectric substrate and the insulating plate is completely sealed with a plating layer, adhesive peeling is reduced.
In addition, moisture, gas, etc. are completely prevented from entering the piezoelectric resonator.

[Brief explanation of drawings]

Figure 1 is a circuit diagram of a filter in which three-terminal filters are connected in cascade using a coupling capacitor, and Figures 2 and 3 are electrical patterns formed on both main surfaces of the piezoelectric substrate of the filter in Figure 1. 4 is an exploded perspective view of a chip-shaped filter using a piezoelectric substrate having the electrode pattern of FIGS. 2 and 3, and FIGS. 5, 6, and 7 are according to the present invention, respectively. It is an explanatory diagram of an example of a method of manufacturing a chip-shaped filter to which a method of manufacturing a chip-shaped piezoelectric resonator is applied. 51 --- Piezoelectric substrate IBjFA' (51a, 51b=
main surface), 52... electrode pattern, 53... circular hole, 5
4... Metsuki resist film, 55... Insulating plate base material, 5
6...Circular hole, 57...Insulating plate base material. Figure 1 Figure 2 Figure 1 Figure 4 7 Figure 7

Claims (1)

[Claims] (A piezoelectric substrate base material in which a plurality of consecutive rows of resonator patterns are formed on the main surface and extraction electrodes thereof are formed, and positions corresponding to these extraction electrodes. An insulating material having holes in each of the holes and a plating plate resist coated between the holes is prepared, and the insulating plate matrix is applied to both the upper and lower main surfaces of the piezoelectric substrate base material with the △ metal resist film on the outside. Vibration of the resonator ω] After gluing with a space in between, cut both sides of the continuous pattern in between to separate it into a long unit, and immerse this long unit in a metal plating bath. A chip-shaped piezoelectric resonator characterized in that the elongated unit is separated into chips by cutting the elongated unit in a direction substantially orthogonal to the plating resist I along the gland passing through the extraction electrode of the resonator and then plating the resonator. manufacturing method.