JPS59114891A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPS59114891A JPS59114891A JP22379982A JP22379982A JPS59114891A JP S59114891 A JPS59114891 A JP S59114891A JP 22379982 A JP22379982 A JP 22379982A JP 22379982 A JP22379982 A JP 22379982A JP S59114891 A JPS59114891 A JP S59114891A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- printed board
- solder
- blowholes
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は電子部品のプリント板へのはんだ付は方法に係
シ、特にはんだ付けの前処理としてブローホール防止を
施こす方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method for soldering electronic components to a printed circuit board, and more particularly to a method for preventing blowholes as a pretreatment for soldering.
プリント板に電子部品をはんだ付けする方法としては、
溶融したはんだにプリント板を接触させ被はんだ付は部
に熱とはんだを供給するウエーブソルダー法、デツプソ
ルダー法等が一般に広く使用されている。How to solder electronic components to a printed board:
Generally, the wave soldering method, the depth soldering method, etc., in which a printed circuit board is brought into contact with molten solder and heat and solder are supplied to the soldered area, are widely used.
この様なはんだ付方法は、多数の接続点が高・速かつ大
量に接続できるが、一方はんだ付は後の欠陥の発生を防
止し、高品質のはんだ付けを行うことが重要な課題とな
っている。This type of soldering method can connect a large number of connection points at high speed and in large quantities, but on the other hand, it is important to prevent defects from occurring later and to perform high-quality soldering. ing.
はんだ付は欠陥の原因は、はんだ付は時の条′件に起因
するもの、電子部品、またはプリント・基板の欠陥に起
因するもの等種々の要因に区分することができる。The causes of soldering defects can be classified into various factors, such as those due to soldering conditions, and those due to defects in electronic components or printed circuit boards.
−このようなはんだ付は欠陥の１つとして、「ブローホ
ール」と呼ばれる不良現象がある。これは、第１図に断
面図で示すごとくプリント板５のスルーホール１等の継
手のけんだ２中にガス３が残った状態ではんだが固化し
たもので、これは継手の接続信頼性上大きな問題となる
ことが知られており、ブローホール発生を防止する必要
がある。この様なブローホールが発生する主な原因は、
プリント板５の有機材料中のガス成分がはんだ付は時の
熱で膨張してスルーホールメッキの欠陥部４よシ噴出し
、そのままはんだ中に残るためであシ、ガスの噴出する
欠陥部４のないスルーホールメッキをもつプリント板の
開発が必要であるとともに、この様なブローホールの原
因となるガス成分をプリント板５から除去するようなは
んだ付は方法が必要である。- One of the defects of this type of soldering is a phenomenon called a "blowhole." This is because the solder solidifies with gas 3 remaining in the solder joint 2 of the joint such as through hole 1 of the printed board 5, as shown in the cross-sectional view in Figure 1. Blowholes are known to be a major problem, and it is necessary to prevent blowholes from occurring. The main cause of such blowholes is
This is because the gas component in the organic material of the printed board 5 expands due to the heat during soldering and ejects from the defective part 4 of the through-hole plating, remaining in the solder as it is. It is necessary to develop a printed circuit board with through-hole plating free of blowholes, and a soldering method that removes gas components that cause such blowholes from the printed circuit board 5 is also required.
本発明の目的は、上記ブローホールの問題を解決するも
のであり、ブローホールの発生を抑止するはんだ付は方
法を提供することにある。An object of the present invention is to solve the above-mentioned problem of blowholes, and to provide a soldering method that suppresses the occurrence of blowholes.
本発明は、はんだ付けの前にプリント板をはんだの融点
以上の沸点をもつ液体の蒸気中に浸漬してプリント板内
部のガスを噴出させ除去した後、はんだ付けを行うはん
だ付は方法を特徴。The present invention is characterized by a soldering method in which, before soldering, the printed board is immersed in the vapor of a liquid having a boiling point higher than the melting point of the solder to blow out and remove the gas inside the printed board, and then soldering is performed. .
とする。shall be.
以下本発明の一実施例を図面を用いて説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第２図は本発明の一実施例で使用されるプリント板の脱
ガス装置の縦断面図である。本装置は、被加熱液体９を
加熱して非酸化性の蒸気を発生させその飽和蒸気６をと
じこめるための蒸気槽７、飽和蒸気６が槽外に消失する
ことを防止するための凝縮コイル８、被加熱液体９を蒸
気化するためのヒータ１０、プリント板５を飽和蒸気６
中に搬送し保持するだめのプリント板ギヤリア１１等に
より構成される。FIG. 2 is a longitudinal cross-sectional view of a printed board degassing device used in one embodiment of the present invention. This device includes a steam tank 7 for heating a heated liquid 9 to generate non-oxidizing steam and trapping the saturated steam 6, and a condensing coil 8 for preventing the saturated steam 6 from disappearing outside the tank. , a heater 10 for vaporizing the heated liquid 9, and a saturated vapor 6 for the printed board 5.
It is composed of a printed board gear rear 11 and the like for transporting and holding the printed board inside.
プリント板５は、プリント板キャリア（１１）によシ保
持されて飽和蒸気６中九一定時間浸漬される。このとき
飽和蒸気６がプリント板５表面□で液化し、放出される
凝縮熱によシブリント板５が加熱されて、同基板中に含
まれているガス成分がプリント板５のスルーホール１の
欠陥部４を通して蒸気中に噴出除去される。従ってごの
様な脱ガス処理を実施後にはんだ付けを行うことにより
、ブローホールの発生を防止できる。The printed board 5 is held by a printed board carrier (11) and immersed in saturated steam for a certain period of time. At this time, the saturated steam 6 is liquefied on the surface □ of the printed board 5, and the released condensation heat heats the syblint board 5, causing gas components contained in the board to be absorbed into the through holes 1 of the printed board 5. It is blown away through section 4 into steam. Therefore, by performing soldering after performing a degassing treatment such as that described above, blowholes can be prevented from occurring.
脱ガス処理で用いる飽和蒸気の温度は、使用するはんだ
の融点以上である必要があるが、この理由は次の通シで
ある。■はんだ付は時に発生するガスを除去するため、
はんだ付は時に力ｇ。The temperature of the saturated steam used in the degassing process needs to be higher than the melting point of the solder used, and the reason for this is as follows. ■To remove the gas that sometimes occurs during soldering,
Soldering sometimes requires a lot of force.
熱される温度に近い温度条件で加熱する必要がある。■
プリント板のスルーホール銅めっき上には通常はんだの
付きをよくする目的ではんだめっきが施されており、ス
ルーホールめっきの欠陥を通してガスを除去するために
は銅めっき上のはんだめっきを溶融する必要がある。■
さらにはんだめっき中に含まれる光沢剤等の有機物のガ
スをはんだを溶融することにょシ除去する０
まだ本発明のごとく加熱手段として飽和蒸気を使用する
ことに−よシ、基板の加熱温度が液体の沸点でコントロ
ールされるとともに、凝縮熱によシ短時間で加熱される
のでプリント板の耐熱限界内で処理でき、また非酸化性
のガスにょ。It is necessary to heat at a temperature close to the temperature at which it is heated. ■
Solder plating is usually applied on the through-hole copper plating of printed circuit boards to improve solder adhesion, and in order to remove gas through defects in the through-hole plating, it is necessary to melt the solder plating on the copper plating. There is. ■
Furthermore, organic gases such as brighteners contained in solder plating are removed by melting the solder. It is controlled by the boiling point of the gas, and is heated in a short time by the heat of condensation, so it can be processed within the heat resistance limits of printed boards, and it is a non-oxidizing gas.
シブリント板の被はんだ付は部表面の酸化が防５止され
るのではんだの付きを損うことがない。When soldering the shiblint plate, oxidation of the surface of the part is prevented, so the solder adhesion is not impaired.
飽和蒸気を生成するための液体としては、市販されてい
るフッ素系溶剤が有効である。Commercially available fluorinated solvents are effective as the liquid for generating saturated vapor.
市販品である７０リナートＦＣ−７１１（３Ｍ社製）を
使用した実験結果によれば、２１５°Ｃの飽和蒸気中に
約６０秒浸漬し脱ガス処理したプリント板を２４０’Ｃ
，５秒の浸漬はんだ付けを実施したところ、ブローホー
ル発生率を脱ガス処理しない製品の約１４゜に低減する
ことができた。According to the results of an experiment using a commercially available product, 70 Linato FC-711 (manufactured by 3M), a printed board that had been degassed by immersing it in saturated steam at 215°C for about 60 seconds was heated to 240°C.
When immersion soldering was carried out for 5 seconds, the blowhole generation rate was reduced to about 14 degrees compared to products without degassing treatment.
本発明は、以上説明したように脱ガス処理を実施後には
んだ付けを行う方法であネから、これによってブローボ
ールの発生しないはんだ付は方法を得ることができる。The present invention is a method in which soldering is performed after degassing as described above, and thus a soldering method that does not generate blow balls can be obtained.
第１図はブローホールの発生したプリント板の断面図、
第２図は本発明の一実施例で使用される脱ガス装置の縦
断面図である。
１・・・・・・スルーホール、 ２・・・・・・はん
だ、３・・・・・・ブローホール、 ４・・・・・欠
陥部、５・・・・・・プリント板、 ６・・・・・
・飽和蒸気、７・・・・・・蒸気槽、 ９・・
・・・・被加熱液体。Figure 1 is a cross-sectional view of a printed board where a blowhole has occurred.
FIG. 2 is a longitudinal sectional view of a degassing device used in one embodiment of the present invention. 1...Through hole, 2...Solder, 3...Blow hole, 4...Defect part, 5...Printed board, 6.・・・・・・
・Saturated steam, 7...Steam tank, 9...
...Liquid to be heated.
Claims (1)
において、前記はんだ付けの前に箭記プリント板を前記
はんだの融点以上の沸点をもつ液体の蒸気中に浸漬して
前記プリント板丙部のガスを噴出させ除去した後、前記
はんだ付けを行うことを特徴とするはんだ付は方法。In a method of mounting electronic components on a printed board by soldering, before the soldering, the printed board is immersed in the vapor of a liquid having a boiling point higher than the melting point of the solder to remove the gas in the second part of the printed board. A soldering method characterized in that said soldering is performed after ejecting and removing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22379982A JPS59114891A (en) | 1982-12-22 | 1982-12-22 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22379982A JPS59114891A (en) | 1982-12-22 | 1982-12-22 | Soldering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59114891A true JPS59114891A (en) | 1984-07-03 |
Family
ID=16803895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22379982A Pending JPS59114891A (en) | 1982-12-22 | 1982-12-22 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59114891A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5994165A (en) * | 1997-02-05 | 1999-11-30 | Nec Corporation | Method for mounting a semiconductor chip |
-
1982
- 1982-12-22 JP JP22379982A patent/JPS59114891A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5994165A (en) * | 1997-02-05 | 1999-11-30 | Nec Corporation | Method for mounting a semiconductor chip |
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