JPS59112943U - Semiconductor heat treatment jig - Google Patents
Semiconductor heat treatment jigInfo
- Publication number
- JPS59112943U JPS59112943U JP720283U JP720283U JPS59112943U JP S59112943 U JPS59112943 U JP S59112943U JP 720283 U JP720283 U JP 720283U JP 720283 U JP720283 U JP 720283U JP S59112943 U JPS59112943 U JP S59112943U
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- treatment jig
- semiconductor heat
- semiconductor substrate
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図イ１口は従来の熱処理治具の例を示す斜−親図で
、イ図は半導体基板が小口径の場合、０図は同じく大口
径の場合を示す。第２図イ１ロ、ハは本考案治具の実施
例を示す図で、イ図は並べた状態を示す斜視図、０図は
横断面図、へ図は１個を示す斜視図である。第３図、第
４図は従来および本考案治具により熱処理されたＧａＡ
ｓ半導体基板の基板面内の活性層の深さ分布を示す図で
、第３図は従来例、第４図は本考案によるものを示す。
１．１１・・・熱処理治具、２・・・半導体基板、３・
・・半導体基板をのせる台、４．１４・・・支持枠、５
゜１５・・・支柱、６・・・石英管、１３・・・網目。Figure 1A1 is a diagonal diagram showing an example of a conventional heat treatment jig, where Figure A shows the case where the semiconductor substrate has a small diameter, and Figure 0 shows the case where the semiconductor substrate has a large diameter. Figures 2A, 2B, and 2C are diagrams showing an embodiment of the jig of the present invention; Figure A is a perspective view showing the jig arranged side by side, Figure 0 is a cross-sectional view, and Figure 2 is a perspective view showing one jig. . Figures 3 and 4 show GaA heat-treated using conventional and inventive jigs.
FIG. 3 is a diagram showing the depth distribution of the active layer in the plane of the semiconductor substrate, FIG. 3 shows the conventional example, and FIG. 4 shows the one according to the present invention. 1.11...Heat treatment jig, 2...Semiconductor substrate, 3.
...Semiconductor substrate mounting stand, 4.14...Support frame, 5
゜15... Strut, 6... Quartz tube, 13... Mesh.
Claims (2)
前記基板の周辺より内側の直下に配置したことを特徴と
する半導体熱処理治具。(1) A semiconductor heat treatment jig characterized in that a plurality of pillars supporting a table on which a semiconductor substrate is placed are arranged directly below the periphery of the substrate.
新案登録請求の範囲第１項記載の半導体熱処理治具。(2) The semiconductor heat treatment jig according to claim 1, wherein the table on which the semiconductor substrate is placed is a mesh or a flat plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP720283U JPS59112943U (en) | 1983-01-20 | 1983-01-20 | Semiconductor heat treatment jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP720283U JPS59112943U (en) | 1983-01-20 | 1983-01-20 | Semiconductor heat treatment jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59112943U true JPS59112943U (en) | 1984-07-30 |
Family
ID=30138733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP720283U Pending JPS59112943U (en) | 1983-01-20 | 1983-01-20 | Semiconductor heat treatment jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59112943U (en) |
-
1983
- 1983-01-20 JP JP720283U patent/JPS59112943U/en active Pending
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