JPS59109145U - Semiconductor device manufacturing equipment - Google Patents

Semiconductor device manufacturing equipment

Info

Publication number
JPS59109145U
JPS59109145U JP188383U JP188383U JPS59109145U JP S59109145 U JPS59109145 U JP S59109145U JP 188383 U JP188383 U JP 188383U JP 188383 U JP188383 U JP 188383U JP S59109145 U JPS59109145 U JP S59109145U
Authority
JP
Japan
Prior art keywords
manufacturing equipment
opening
cover
semiconductor device
device manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP188383U
Other languages
Japanese (ja)
Inventor
野瀬　勲
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP188383U priority Critical patent/JPS59109145U/en
Publication of JPS59109145U publication Critical patent/JPS59109145U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は原案の一実施例を示す側断面図、第２図は要部
平面図である。 図中、１は加熱体、２はリードフレーム、５１〜５６は
リード、７は半導体素子、８はカバー、９は第１の開口
部、１０は第２の開口部、１１は回転体、１２は切削部
、１４はボンディングツール、１５は金属細線である。FIG. 1 is a side sectional view showing an embodiment of the original draft, and FIG. 2 is a plan view of the main part. In the figure, 1 is a heating element, 2 is a lead frame, 51 to 56 are leads, 7 is a semiconductor element, 8 is a cover, 9 is a first opening, 10 is a second opening, 11 is a rotating body, and 12 14 is a cutting part, 14 is a bonding tool, and 15 is a thin metal wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームを加熱する加熱体の上面を、上部に第１
及び第２の開口部を有するカバーにて覆うと共に、カバ
ー内を主として不活性ガス雰囲気にし、第１の開口部に
下端面に切削部を有する筒状の回転体を　第２の開口部
にボンディングツールをそれぞれ上下動自在に配置して
なり、上記リードフレーム手の半導体素子とリードとに
金属細線をボンディングするに先立って、リードにおけ
る金属細線のボンディング予定部分を回転体にて切削す
ることを特徴とする半導体装置の製造装置。Place the top surface of the heating element that heats the lead frame on top of the first
and cover with a cover having a second opening, the inside of the cover is mainly made into an inert gas atmosphere, and a cylindrical rotating body having a cut portion on the lower end surface is bonded to the first opening to the second opening. The tool is arranged such that it can move up and down, and before bonding the thin metal wire to the semiconductor element of the lead frame and the lead, the portion of the lead where the thin metal wire is to be bonded is cut by a rotating body. Manufacturing equipment for semiconductor devices.
JP188383U 1983-01-10 1983-01-10 Semiconductor device manufacturing equipment Pending JPS59109145U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP188383U JPS59109145U (en) 1983-01-10 1983-01-10 Semiconductor device manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP188383U JPS59109145U (en) 1983-01-10 1983-01-10 Semiconductor device manufacturing equipment

Publications (1)

Publication Number Publication Date
JPS59109145U true JPS59109145U (en) 1984-07-23

Family

ID=30133589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP188383U Pending JPS59109145U (en) 1983-01-10 1983-01-10 Semiconductor device manufacturing equipment

Country Status (1)

Country Link
JP (1) JPS59109145U (en)

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