JPS59101458U - Terminal structure of thick film wiring board - Google Patents

Terminal structure of thick film wiring board

Info

Publication number
JPS59101458U
JPS59101458U JP20178882U JP20178882U JPS59101458U JP S59101458 U JPS59101458 U JP S59101458U JP 20178882 U JP20178882 U JP 20178882U JP 20178882 U JP20178882 U JP 20178882U JP S59101458 U JPS59101458 U JP S59101458U
Authority
JP
Japan
Prior art keywords
wiring board
thick film
film wiring
terminal structure
slits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20178882U
Other languages
Japanese (ja)
Inventor
棚橋 万起
八段 英明
純夫 堀池
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP20178882U priority Critical patent/JPS59101458U/en
Publication of JPS59101458U publication Critical patent/JPS59101458U/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図A、 Bは従来の端子部の平面図、A−A断面図
を示す。第2図A、 Bはこの考案に襟る端子部を構成
する場合のセラミック基板の平面図、B 、B断面図を
示す。また、第3図はこの考案に係る端子部の断面図を
示す。 1・・・セラミック基板、2・・・接続用端子、3・・
・スリット。
FIGS. 1A and 1B show a plan view and a sectional view taken along line A-A of a conventional terminal portion. FIGS. 2A and 2B show a plan view, and FIGS. 2A and 2B show a sectional view of a ceramic substrate used to form a terminal portion according to this invention. Moreover, FIG. 3 shows a sectional view of the terminal portion according to this invention. 1... Ceramic board, 2... Connection terminal, 3...
·slit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 接続用端子の形成される基板位置に複数のスリットを設
け、このスリット上に導電体ペーストを印刷、焼成して
導体パターン端子部を形成したことを特徴とする厚膜配
線基板の端子部構造。
1. A terminal part structure for a thick film wiring board, characterized in that a plurality of slits are provided at positions on the board where connection terminals are formed, and a conductive pattern terminal part is formed by printing and baking a conductive paste on the slits.
JP20178882U 1982-12-24 1982-12-24 Terminal structure of thick film wiring board Pending JPS59101458U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20178882U JPS59101458U (en) 1982-12-24 1982-12-24 Terminal structure of thick film wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20178882U JPS59101458U (en) 1982-12-24 1982-12-24 Terminal structure of thick film wiring board

Publications (1)

Publication Number Publication Date
JPS59101458U true JPS59101458U (en) 1984-07-09

Family

ID=30427276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20178882U Pending JPS59101458U (en) 1982-12-24 1982-12-24 Terminal structure of thick film wiring board

Country Status (1)

Country Link
JP (1) JPS59101458U (en)

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