JPS59100855U - Continuous sputtering device - Google Patents
Continuous sputtering deviceInfo
- Publication number
- JPS59100855U JPS59100855U JP19663982U JP19663982U JPS59100855U JP S59100855 U JPS59100855 U JP S59100855U JP 19663982 U JP19663982 U JP 19663982U JP 19663982 U JP19663982 U JP 19663982U JP S59100855 U JPS59100855 U JP S59100855U
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- continuous sputtering
- gas introduction
- main gas
- piping system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図C1本考案の一実施例を示す正面図である。
、A・・・スパッタ装置、1・・・入口室、2・・・ス
パッタ室、3・・・出口室、4a、 4b、 4C,
4’d−・・仕切弁、5・・・主ガス導入管系、6・・
・バイパス管系、7・・・排・気管系。Figure C1 is a front view showing an embodiment of the present invention. , A... Sputtering apparatus, 1... Inlet chamber, 2... Sputtering chamber, 3... Outlet chamber, 4a, 4b, 4C,
4'd-...Gate valve, 5...Main gas introduction pipe system, 6...
・Bypass pipe system, 7... Exhaust/tracheal system.
Claims (1)
て直列に接続され、前記スパッタ室に主”ガス導入管系
が接続された連続スパッタ装置において、前記主ガス導
入管系に対しバイパス管系が接続され、該バイパス管系
のガス流量は前記主ガス導入管系のそれよりも大きく定
められたことを特徴とする連続スパッタ装置。In a continuous sputtering apparatus in which an inlet chamber, a sputtering chamber, and an outlet chamber are connected to each other in series via a gate valve, and a main gas introduction piping system is connected to the sputtering chamber, a bypass piping system is connected to the main gas introduction piping system. A continuous sputtering apparatus characterized in that a gas flow rate of the bypass pipe system is set to be larger than that of the main gas introduction pipe system.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19663982U JPS59100855U (en) | 1982-12-24 | 1982-12-24 | Continuous sputtering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19663982U JPS59100855U (en) | 1982-12-24 | 1982-12-24 | Continuous sputtering device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59100855U true JPS59100855U (en) | 1984-07-07 |
JPS6321573Y2 JPS6321573Y2 (en) | 1988-06-14 |
Family
ID=30421766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19663982U Granted JPS59100855U (en) | 1982-12-24 | 1982-12-24 | Continuous sputtering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59100855U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4933155U (en) * | 1972-06-27 | 1974-03-23 | ||
JPS56130470A (en) * | 1980-03-14 | 1981-10-13 | Hitachi Ltd | Sputtering apparatus |
-
1982
- 1982-12-24 JP JP19663982U patent/JPS59100855U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4933155U (en) * | 1972-06-27 | 1974-03-23 | ||
JPS56130470A (en) * | 1980-03-14 | 1981-10-13 | Hitachi Ltd | Sputtering apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6321573Y2 (en) | 1988-06-14 |
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