JPS59100591A - Gear pump for waxing processor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a gear pump for a wax processing device that sprays molten wax onto a printed circuit board to which electronic components to be soldered are mounted to temporarily fix the electronic components thereon.

Figure 1 is a block diagram showing an example of a conventional soldering device. 1 is a soldering device that rejects the entire device, 2 is a processing device for preliminary soldering, 3 is a canting device, and 4 is a final soldering device. is a processing device. In these devices, 5.9 is a Franks processor, 6.10 is a preheater, 7 is a dip type solder bath, 8.12 is a cooler, and 11 is a jet type solder bath.

FIG. 2 is a partial side cross-sectional view showing a mode in which electronic components are layered on a printed circuit board, 13 is a printed circuit board, 14 is an electronic component such as a resistor or a capacitor, and 15 is a lead wire of the electronic component 14. (or lead terminal), 16 is a through hole through which the lead wire (or lead terminal) 15 is inserted.

In this way, with conventional soldering equipment, the printed circuit board 13 is heated twice to adhere molten solder, once for preliminary soldering and once for final soldering, resulting in a large amount of solder consumption. and electronic components 14
In addition, when finishing soldering is performed after inserting the lead terminal 15 of the IC component into the through hole 16 of the printed circuit board 13, the IC component is lifted by the force of the solder jet. There were drawbacks such as:

In addition, the processing equipment 2 for pre-soldering has the same equipment as the processing equipment 4 for finishing soldering, so the entire equipment h1 for soldering becomes large, and when installing equipment 1 for soldering, a large space is required. It had the disadvantage of being expensive because it required

This invention was developed in view of the above points, and includes a wax processing section that sprays molten wax onto the top surface of a printed circuit board, cools it, covers the electronic components with wax, and temporarily fixes them to the printed circuit board. The present invention provides a gear pump that can be assembled and disassembled in a single operation for pressurizing and delivering molten wax to the wax tank body of the wax processing section. The present invention will be explained below based on the drawings.

FIG. 3 is a schematic configuration diagram showing an embodiment of the present invention.
1 shows the entire carrier-less soldering device. 2
2A is a transfer chain on the fixed side, 22B is a transfer chain on the movable side, 23 is a processing device with wax, 24 is a wax processing section, and 25 is molten wax that has become a liquid fluid by heating. Further, the same reference numerals as in FIGS. 1 and 2 indicate the same parts.

Next, the operation shown in FIG. 3 will be explained.

Mount the electronic component 14 on the printed circuit board 13 and connect the lead wire 1
5 protrudes downward.

Next, melted wax 25 is sprayed onto the upper surface of the printed circuit board 13 in the wax processing section 24, and then the sprayed melted wax 25 is solidified in the cooler 8, so that the electronic components 14 are solidified on the printed circuit board 13. covered with wax and hardened.

In the case of IC parts, the molten wax 25 also penetrates between the lead terminals 15 and the through holes 16 to fix them.

Next, the lead wire 15 is cut by the cut ink device 3, and
Finish soldering is done using processing device 4 and 7lux processing device 9. Preheater 10. Solder bath11. The cooler 12 is soldered through various processing steps.

Figures 4(a) and 4(b) show the wax processing section 24 in Figure 3.
4(a) is a partially cutaway perspective view, FIG. 4(b) is an enlarged side sectional view taken along x-xi of FIG. 4(a),
Further, FIG. 5 is an exploded perspective view of the one-car pump 2T. In these figures, the same reference numerals as in FIG. 3 indicate the same parts, 26 is a wax tank main body for storing the molten wax 25, and 27 is provided below the wax tank main body 26 to pressurize and send out the molten wax 25. A gear pump 28 is a motor driving the gear pump 2T.
9 is a control valve that adjusts the flow rate and pressure of the molten wax 25; 30 is a passage for the molten wax 250; 31 is a filter that removes dust mixed in the molten wax 25;
32 is the molten wax 25 filtered through the filter 31;
33 is a plurality of pipes branched from the passage 32 and connected in parallel; 34 is a flexible tape heater wrapped around the outer circumference of the pipe 33;
The molten wax 25 passing through is heated so as not to solidify. 35 is a heat insulating material that covers the outer periphery of the tape heater 34; 36 is a spraying device that sprays the molten wax 25; one piece is attached to each of the plurality of pipes 33 via a connecting fitting 37; In the figure, a plurality of solders are disposed in a direction perpendicular to the running direction of the printed circuit board 130 conveyed by the conveyance chees 722A and 22B of the apparatus 21. A thermostat 38 detects the temperature of the molten wax 25 within the wax chamber body 26. In addition, 39 is a prefectural tax for removing dust etc. from the filter 31, and 6.40 of the capacity is a control panel.
It is.

In the gear pump 27, 41 is the drive shaft and the motor 28
is connected to. 42 is a driven shaft.

In FIG. 4(b), 43 is a guide shaft that serves as a guide for assembling the gear pump 7'27, and 44 is a semicircular guide shaft used to fix the gear pump 2γ to the wax tank body 26. The fixing device 45 is a disc-shaped upper case, 46 and 47 are a pair of spur gears, which mesh with each other at the shaded area in FIG. 4(b), and the spur gear 46 is connected to the drive shaft 4.
1, the spur gear 4T is fixed to the driven shaft 42. 4B
49 is a gear case that surrounds and stores the spur gears 46 and 47 on the lower surface of the upper case 45, and 49 is the gear case 48.
50 is an inlet for the molten wax 25 formed in the gear pump fixture 44, 45a;
Reference numeral 48a denotes a supply picture card for supplying the molten wax 25 from the introduction port 44a to the spur gears 46 and 47, 48b and 49a the delivery holes for sending out the molten wax 25 pressurized by the gears 46 and 4γ, and 51 the aforementioned The supply holes 49b, 52 which supply the molten wax 25 from the gear pump 27 to the passage 30 are return holes for the molten wax 25 which is returned from said passage 30.32 via the control valve 29.

In FIG. 5, the same parts as in FIGS. 4(a) and 4(b) are indicated by the same reference numerals, 44c and 45c are insertion holes through which the drive shaft 41 is rotatably inserted, and 49c is the insertion hole of the drive shaft 41. Support holes 44d and 45d are insertion holes through which the driven shaft 42 is rotatably inserted, 49d is a support hole for the driven shaft 42, and 46c is a fixing hole for fixing the spur gear 46 to the front drive shaft 41. 47C is a fixing hole for fixing the spur gear 41 to the driven shaft 42, 44e, 45e, 4
8e and 49e are insertion holes 44f and 45f through which the guide shaft 43 is inserted.

When assembling the gear pump 2γ, the drive shaft 41 is
, the driven shaft 42, and the guide @43 are attached to the base 49, and then the spur gears 46, 47 are engaged, and the drive shaft 41. Driven shaft 4
It sticks to 2. Next, the gear case 48 is placed on the base 49, the spur gears 46 and 47 are stored, and then the upper case 4
5 is attached to the gear case 48 to form the gear pump 27, which is attached to the pot and then to the wax tank body 26, and the drive shaft 41 is connected to the motor 28.

Next, the operations shown in FIGS. 4(a) and 5(bL) will be explained.

The solid wax charged into the wax tank main body 26 is heated by a heater (not shown) to become molten wax 25, the temperature is detected by a thermostat 38, and the temperature is maintained at a constant temperature by operation on a control panel 40. .

A pair of spur gears 4 of the gear pump 27 are driven by the motor 28.
6.47 rotates, the molten wax 25 in the wax tank body 26 is sucked into the inlet 44avL, passes through the supply holes 45a and 48a (arrow A) and is pressurized by the gear 46.47, and then passes through the delivery hole. 4&b, 49a, supply hole 5
1 into the passageway 30 (arrow B).

The molten wax 25 in the passage 30 enters the inside of the filter 31, and after dust etc. are removed, it passes through the passage 32 (arrow C) and is branched into a plurality of vices 33 (arrow D), where it is ejected from each injection device 36. By spraying the printed circuit board 13,
It is sprayed onto the entire electronic component 14 mounted on the top surface.

On the other hand, the molten wax 25 in the passage 32.30 is
9 controls the flow and pressure, and from the passage 32.degree. 30 passes through the control valve 29 as shown by arrows E and F in FIG. .4
It is refluxed to 7.

As described above, this invention meshes a pair of spur gears with each other, stores the pair of spur gears in a gear case, places the lower surface of the gear case on a base, and places the upper surface of the gear case on the upper surface of the gear case. In addition, a supply hole is provided in the upper case and the gear case that conducts to the pair of spur gears, a delivery hole that conducts from the pair of spur gears is provided in the gear case and the base, and the gear case is connected to the base. Since the gear pump is formed with a return hole that communicates with the supply hole, it can be easily assembled and disassembled even in the narrow spaces of the Waxy Δ body, and it can be connected to a new motor with an output that is compatible with the wax tank. Compared to the case of using a general-purpose toothed Jμ pump, there are no restrictions on the size or output of the gear pump (replacement of each part is easy, power consumption is reduced, and the entire wax processing section is It has the advantage of being able to be made smaller.

[Brief explanation of the drawing]

Fig. 1 is a 7" long view showing an example of a conventional soldering device, Fig. 2 is a partial side cross-sectional view showing how electronic components are mounted on a printed circuit board, and Fig. 3 is an embodiment of the present invention. Figure 4 (a) is a schematic configuration diagram showing the wax processing section shown in Figure 3. In the figure, 3 is a cutting device, 4 is a processing device for final soldering, and 8 is a cooling device. 9 is a flux treatment device, 10 is a preheater, 11 is a soldering bath, 13 is a printed circuit board, 14 is an electronic component, 15 is a lead wire (or lead terminal), 16 is a through hole, 21 is a soldering device , 22A, 22B
is i'4j, feeding chain, 23 is processing equipment with wax,
24 is a wax processing section, 25 is melted wax, 26 is a wax tank body, 27 is a gear pump, 28 is a motor, 29
is IBL" both valves, 30.32 is a passage, 31 is a filter,
33 is a pipe, 34 is a tape heater, 35 is a thermal shrine, 3
6 is an injection device, 37 is a connecting fitting, 38 is a thermostat, 39 is a lid, 40 is a control panel, 41 is a drive shaft, 42 is a driven shaft, 43 is a guide shaft, 44 is a fixture, 45 is an upper case,
46. 47 is a spur gear, 48 is a gear case, 4 to 9 is a base, 50 is a fixing screw, 51 is a supply hole, 52 is a return hole, 44
a is an introduction port, 45a, 48a are supply holes, 48b, 49a
are delivery holes, 49b are reflux holes, 44c, 45c, and 44d. 9e 45dt 44e, 45e, 48e+ 4
4f, 45f, 48f, 49f are insertion holes, 46c,
47e Hongogin is a fixed hole, and 49c * 49d is a support hole.

Claims (1)

[Claims] A pair of spur gears are meshed with each other, the pair of spur gears are housed in a southeast case, the lower surface of this gear case is placed on a base, the upper surface is covered with an upper case, and the upper case is placed on a base. The case and the gear case are provided with a supply hole that conducts to the pair of spur gears, the gear case and the base are provided with a delivery hole that is conductive from the pair of spur gears, and the base is provided with a supply hole that conducts to the pair of spur gears.