JPS589980A - Planetary type vapor depositing device - Google Patents

Abstract

PURPOSE:To provide a planetary type vapor depositing device which can vapor- deposit metals on both surfaces of wafers without turning over the wafers by rotating a revolving shaft that supports a wafer holder by means of a link mechanism. CONSTITUTION:A wafer 1 is held freely attachably and detachably by means of leaf springs 17, 18 via tips 19, 24, 25 for chucking. A revolving shaft 30 that supports such wafer holder is mounted freely rotatably to a planetary via bearings 36, 37 and bearing holders 34, 35. The shaft 30 is rotated 90 deg. respectively in opposite directions from the central position by the operations of a link pin 38, a link 39 and a torsion spring 43 which returns the revolving position of the shaft 30 to the central position. The wafer 1 supported to the shaft 30 is turned about 180 deg. by such mechanism. The wafer holder is designed to hold the wafer 1 nearly in contact with the shaft 30. Many wafer holders are inverted without mutual interferences by this mechanism.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to planetary deposition equipment for semiconductor wafers (hereinafter referred to as wafers).

FIG. 1 shows the external appearance of a wafer 1, which is a workpiece, and 2 is the upper surface thereof, and 3 is the lower surface thereof.

Aluminum on the surface of the wafer as above.

To perform vapor deposition of silver or the like, a planetary type vapor deposition apparatus 4 as shown in FIG. 2 is usually used. This device is equipped with several (usually 6) planetaries 5, each of which has 10 to 30 wafer holders 6.
are attached so that each can hold one wafer.

The planetary 5.5 is rotatably supported at the tip of each arm 7.7 via a bearing 8, and the base end of the arm 7.7 is fixed radially to the rotating plate 9. .

Reference numeral 10 denotes a lid, and a mechanism (not shown) for rotationally driving the rotary plate 9 is built into this lid 1o.

The aforementioned planetary 5.5 is placed on a circular rail 11, and when the rotating plate 9 is driven to rotate, the planetary 5.5 rolls while contacting the circular rail 11, and rotates around the central axis YY. It is designed to rotate around the bearing part 80 while revolving.

After covering and sealing the opening of the evaporation device 4 with the lid 1o supported by the hinge 12, the inside is evacuated and the evaporation dish 1 is closed.
By rotating and revolving the planetary 5 while heating and vaporizing the vapor deposition material put in the wafer holder 6,
Vapor deposition is performed on the wafer mounted on -6.

FIG. 3 is a plan view of the wafer holder 6, and FIG. 4 is a side sectional view thereof.

The wafer holder 6 has a circular recess 6a formed in the planetary 5 and having a slightly larger diameter than the wafer, a circular opening 6b having a slightly smaller diameter than the wafer and provided concentrically with the recess, and the circular recess. Bolt 15 near 6&. Natsu 16
It consists of a round plate spring 14 attached to the base plate. By fitting the wafer 1 into the circular recess 6a and pressing it with the leaf spring 14, the wafer 1 is removably attached to the wafer holder 6, and one side of the wafer 1 is exposed to the inside of the planetary 5 through the opening 6b. , undergoes vapor deposition on this surface.

As is clear from the above structural features, in the conventional planetary deposition apparatus described above, the wafer 1 is deposited on only one side in a single deposition operation. Therefore, when vapor deposition must be performed on both sides of a wafer for large-capacity semiconductor integrated circuits, for example, after performing the vapor deposition operation on one side as described above, the vacuum of the vapor deposition apparatus 4 is turned off once, and the lid 10 is closed.
It is necessary to open the wafer 1, manually turn the wafer 1 over, and then perform the same deposition operation again. In this way, turning off the vacuum, opening the lid, and turning the wafer is a waste of time and effort. Not only does this increase the possibility of foreign matter adhering to the wafer, but it also involves loss of energy and time required for reheating.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a planetary type vapor deposition apparatus that can perform vapor deposition on both sides of a wafer without the need to open the holder and manually turn over the wafer during the vapor deposition operation. It is.

In order to achieve the above object, the present invention includes a wafer holder that removably holds a wafer, a rotating shaft that supports the wafer holder, and means for rotating the rotating shaft by about 180°, and A feature of the present invention is that the rotation shaft is substantially in contact with the wafer held by the wafer holder.

Next, an embodiment of the present invention will be described with reference to FIGS. 5 to 9.

FIG. 5 is a side view of the wafer holder according to the present invention and a plan view of FIG. Spring holders 26 and 51 are respectively attached to both ends of the rotating shaft SO, and the spring holders 26 and 51 are mounted so that the two leaf springs 17 and 18 face each other with the wafer 1 in between.
．． Install it on 31.

27 is a block for attaching the leaf spring 17, and 28 and 29 are the same screws. 33 is a block for mounting the leaf spring 18, and 33 is the same screw.

A wafer chuck chip 19 is fixed to the tip of the leaf spring 17, and a block 21 is fixed to the tip of the leaf spring 18.

Wafer chuck chips 24 are attached to both ends. The block 22 is fixed to the center of the plate 25 to which the block 25 is fixed,
This block 22 and a block 21 fixed to the tip of the spring 1B are pivotally connected via a pin 21 so as to be slightly rotatable. 40 is a pin inserted into the chip 19 for the sea urchin installation hatchet.

When force is applied with a fingertip to the pins 21 and 40 in the directions of arrows A and B, the leaf springs 17 and 18 are bent and pushed apart. In this way, the quenching chip 19. Same 2
4. When the wafer 1 is sandwiched between the chuck chips 19 and 25, the wafer 1 is held between the chuck chips 19 and 19 by the elasticity of the leaf springs 17 and 1B.
Retained through 24.25. In this embodiment, a wafer holder that removably holds the wafer 1 is configured as described above, and this wafer holder is supported by the rotating shaft 50. Then, the rotating shaft 30 is connected to the bearing 66.
37 and bearing holders 54 and 55, it is rotatably attached to the aforementioned planetary 5.

38 is a link pin attached to the spring holder 26 for rotating the rotating shaft 30; 39 is a link for rotationally driving this;
43 is a torsion spring for returning the rotational position of the rotating shaft 30 to the neutral position.

In this embodiment, the leaf spring 517, the same 18, and the rotating shaft 30 are used.
The wafer chuck tips 19, 24 and 25 are provided so that they are fixed to each other so that they form a U-shape, and the wafer 1 is clamped along a plane that includes the U-shape. , the wafer 1 is held substantially in contact with the rotating shaft 30. FIG. 7 shows three wafer holders 6.6', 6", and Three wafers 1, 1', 1'' held by these wafer holders are illustrated. The axes of the rotational axes 50, 30' and 3CI'' of the wafer holders arranged in this manner are made to intersect at a point 0, and the adjacent wafer holders 1 and 1' are aligned with respect to the rotational axis 30. The wafers 1' and 1'' are arranged in symmetrical positions with respect to the rotation axis 50'. As a result, three rotating shafts 30, 30', 50"
When wafer 1 rotates 2 times in the same direction at the same time, wafer 1 rotates 1' in the same direction.
, wafer 1' is at position 1'', and so on.
All wafers are moved to adjacent wafer positions and turned over.

FIG. 8 shows the planetary 5 equipped with the wafer holder 6.6 described above, and the rotation (ji') of the eno holder.
, 1 is a sectional view showing a drive mechanism for rotating the rotating shaft 50.30. The wafer holder 6.6 is attached to the inner surface of the spherical plate-shaped planetary 5. 44 is a mounting space, and 45 is a mounting screw.

A hollow shaft 50 having seven flange is provided separately from the above, and this hollow shaft 50 has five shafts (only two are shown) 4
8.48 is fixed. 51 is a set screw. and,
Above shirt) 48. Form a thread at the tip of 48,
(Oak) 49.49 are screwed together and the center part of the planetary 5 mentioned above is sandwiched and supported.

46.47 is a washer.

The hollow shaft 50 is rotatably supported at the tip of the arm 7 via bearings 53 and 55. 7a is a bearing cage integrally formed at the tip of the arm 7a. color 5
2. Bearing nut 54. The washer 55, bolt 57 and rotation stopper plate 56 are means for positioning the bearing 53.

A slide shaft 58 is slidably fitted onto the hollow shaft 50, and a drive plate 64 is attached to one end thereof.

The nut 65 and washer 62 are means for attaching the drive plate 64. A disk 59 for driving the slide shaft is attached to the other end of the slide shaft 58 with bolts 60.

Reference numeral 39 is a link for rotating the rotating shaft 30, which was previously explained with reference to FIG. A link holder 65 having a slot formed therein is attached to the drive plate 64 at a position corresponding to the tip of the link 39, and the slot is engaged with the tip of the link 59 via the pin 66. 67 is a nut for attaching the link holder 65.

As described above, the rotating shaft 3 that supports the sea urchin/S holder
Link 39.0 is attached to the same rotating shaft. Link holder 65 engaged with the link. It constitutes a means for rotating the driven shaft approximately 180 degrees via the drive plate 64 to which the link holder is attached and the slide shaft 58 attached to the drive plate. In general, a set of link mechanisms is used to rotate the driven shaft by 180 degrees. is not easy. Therefore, in this example, as previously explained with reference to FIG. 6, the rotating shaft 50 is provided with a torsion spring 43 that urges it to the neutral position to enable rotation of 180 degrees. This refers to a position where the wafer supported on the rotating shaft 50 is substantially perpendicular to the plane of the planetary 50. That is, when no separate force is applied to the link 39, the wafer is in the i-force perpendicular to the plane of the planetary 50, so it is rotated by 90 degrees in the opposite direction from this neutral position with respect to the rotation axis 30. If given, the Ueno shaft supported on this rotation shaft will rotate 180 degrees. Furthermore, since the rotation shaft 30 is provided on the inner surface of the spherical planetary 5, the rotation angle required to flip the wafer held by the shaft 30 is smaller than 180°. It's over.

Ball plunger 61 and corresponding V type 61a
, 61b are means for maintaining the sliding position of the slide shaft 58 in the axial direction.

FIG. 9 shows an operating mechanism for sliding the slide shaft 58 in the axial direction.

A shaft hole is bored in the block 68a fixed to the vacuum container 6B, and the slide shaft 71 is inserted therethrough. 72. 72 is a seal for maintaining airtightness. A block 73 having a groove with a U-shaped cross section is attached to the tip of the slide shaft 71, and the U-shaped groove is connected to the drive disk 59 of the slide shaft 5B.
spaced apart from each other.

The slide shaft 71 is a motor cylinder 7 which is fixed concentrically with the slide shaft 71 by a boss 69.69.
It is driven back and forth by 0. A guide piece 74 is rotatably attached to the slide shaft 71, and by sliding along the post 69, it functions to prevent the slide shaft 71 from rotating, and the drive block 73 rotatably attached to the slide shaft
This prevents the disk from interfering with the disk 59.

Since the arm 7 rotates around the center axis Y-Y of the rotating plate 9, the slide shaft 5 provided at the tip of the arm 7
When the motor cylinder 70 is actuated when the motor cylinder 8 is stationary at a position facing the slide shaft 71 concentrically, the slide shaft 7
1. The slide shaft 58 is driven forward or backward as desired via the drive block 73 and the drive disc 59,
Accordingly, the rotation shaft 30 is rotated and the wafer is reversed.

FIG. 10 shows an example of application of the present invention. Compared to the embodiment shown in FIG. 5, this example has a wafer chuck tip of 19° and 24°. Same 2
The width of the wafer holding groove portion 5 is widened so that it can hold two wafers 1 and 1'. When two wafers are held stacked in this way, when vapor deposition is performed on one side of wafer 1 and wafer 1, one set and one vacuum pull can be applied to one side of wafer 1'. After vapor deposition, the two wafers can be reversed and the other wafer 1 can be vapor-deposited, so the time, labor, evacuation work, and heating energy for vapor deposition can be significantly reduced. Also, wafer chuck chip 19.2
By appropriately setting the shape of 4.25, it is also possible to hold two wafers with different shapes.

As explained above, according to the present invention, by providing a rotating shaft for supporting a wafer holder and a means for rotating this rotating shaft by about 180 degrees, the front and back sides of the wafer can be rotated while maintaining a vacuum in the vapor deposition apparatus. When performing vapor deposition on both sides of a wafer, there is no need to open the lid and turn the wafer over during the vapor deposition operation. Furthermore, by positioning the rotating shaft so that it touches the wafers held by the same rotating shaft, when holding a large number of wafers and inverting them at the same time, it is possible to invert them without interfering with each other. Moreover, a large number of wafer holders can be effectively arranged without leaving wasted area on the inner surface of the planetary.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a wafer, Figs. 2 to 4 show a planetary type vapor deposition apparatus commonly used in the past, Fig. 2 is an overall perspective view, Fig. 3 is a plan view of a wafer holder portion, and Fig. 4 is a perspective view of a wafer holder. The figure is a side view of the same. 5 to 9 show an embodiment of the planetary vapor deposition apparatus according to the present invention, in which FIG. 5 is a side view of the wafer holder portion, FIG. 6 is a plan view of the same, FIG. FIG. 8 is a sectional view of a planetary equipped with a wafer holder, and FIG. 9 is a sectional view of an operating mechanism for the planetary and wafer holder shown in FIG. FIG. 10 is a side view of a wafer holder in an embodiment different from the above. 1, 1', 1"... Wafer 17, 18... Leaf springs constituting the wafer holder 19.24.25...
Chip for the chuck 30...Rotary shaft that supports the wafer holder 38...Link pin constituting means for rotating the rotation shaft 39...Link 65...Link holder 64...Driving plate 48...Same shaft 7) 58.71...Slide shaft 70...Same motor cylinder No. II￥1 Modification 2 Fig. 0 Fig. 3 Fig. 4m Seat 6 Fig. ＼Fig. 8 Fig. 10

Claims (1)

[Claims] A Ueno holder that removably holds a wafer, a rotating shaft that supports the wafer holder, and a rotating shaft that is approximately 18
1. A planetary vapor deposition apparatus, comprising means for rotating the wafer by 0 degrees, and wherein the wafer holder holds the wafer so as to be substantially in contact with the rotation axis.