JPS5895063U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS5895063U
JPS5895063U JP1981191426U JP19142681U JPS5895063U JP S5895063 U JPS5895063 U JP S5895063U JP 1981191426 U JP1981191426 U JP 1981191426U JP 19142681 U JP19142681 U JP 19142681U JP S5895063 U JPS5895063 U JP S5895063U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
layer
ics
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981191426U
Other languages
English (en)
Inventor
松下　典道
Original Assignee
ニチコン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ニチコン株式会社 filed Critical ニチコン株式会社
Priority to JP1981191426U priority Critical patent/JPS5895063U/ja
Publication of JPS5895063U publication Critical patent/JPS5895063U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の混成集積回路の特価回路図、第２図は従
来の混成集積回路の要部の平面図、第３図〜第５図は本
考案の混成集積回路の一実施例で、第３図は等価回路図
、第４図は要部の平面図、第５図は要部の断面図である
。 １：電源ライン層、２：アースライン層、４：ＩＣチッ
プ、８：誘電体層。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＩＣを塔載してなる混成集積回路において、上記ＩＣの
    共通の電源ライン層とアースライン層とを誘電体層を介
    して上層電極と下層電極に対向させて配線したことを特
    徴とする混成集積回路。
JP1981191426U 1981-12-21 1981-12-21 混成集積回路 Pending JPS5895063U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981191426U JPS5895063U (ja) 1981-12-21 1981-12-21 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981191426U JPS5895063U (ja) 1981-12-21 1981-12-21 混成集積回路

Publications (1)

Publication Number Publication Date
JPS5895063U true JPS5895063U (ja) 1983-06-28

Family

ID=30104887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981191426U Pending JPS5895063U (ja) 1981-12-21 1981-12-21 混成集積回路

Country Status (1)

Country Link
JP (1) JPS5895063U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS557346B2 (ja) * 1975-08-27 1980-02-25
JPS5582454A (en) * 1978-12-15 1980-06-21 Toshiba Corp Container for integrated circuit element
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS557346B2 (ja) * 1975-08-27 1980-02-25
JPS5582454A (en) * 1978-12-15 1980-06-21 Toshiba Corp Container for integrated circuit element
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device

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