JPS5893247A - 流体圧で駆動される半導体ウエ−ハ締付け装置 - Google Patents

流体圧で駆動される半導体ウエ−ハ締付け装置

Info

Publication number
JPS5893247A
JPS5893247A JP57203835A JP20383582A JPS5893247A JP S5893247 A JPS5893247 A JP S5893247A JP 57203835 A JP57203835 A JP 57203835A JP 20383582 A JP20383582 A JP 20383582A JP S5893247 A JPS5893247 A JP S5893247A
Authority
JP
Japan
Prior art keywords
wafer
pressure plate
fluid
plate
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57203835A
Other languages
English (en)
Japanese (ja)
Inventor
ロバ−ト・ビリングズ・ブラムホ−ル・ジユニア
ノ−マン・レオナ−ド・タ−ナ−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of JPS5893247A publication Critical patent/JPS5893247A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10P72/0434
    • H10P72/7606
JP57203835A 1981-11-24 1982-11-22 流体圧で駆動される半導体ウエ−ハ締付け装置 Pending JPS5893247A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32451281A 1981-11-24 1981-11-24
US324512 1989-03-16

Publications (1)

Publication Number Publication Date
JPS5893247A true JPS5893247A (ja) 1983-06-02

Family

ID=23263921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57203835A Pending JPS5893247A (ja) 1981-11-24 1982-11-22 流体圧で駆動される半導体ウエ−ハ締付け装置

Country Status (5)

Country Link
JP (1) JPS5893247A (Direct)
DE (1) DE3242856A1 (Direct)
FR (1) FR2517124A1 (Direct)
GB (1) GB2109996B (Direct)
NL (1) NL8204560A (Direct)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62272441A (ja) * 1986-05-20 1987-11-26 Tokyo Electron Ltd イオン注入装置におけるウエハ保持装置
JPS62272445A (ja) * 1986-05-20 1987-11-26 Tokyo Electron Ltd 半導体製造装置用高真空チヤンバ−における駆動装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891335A (en) * 1986-10-15 1990-01-02 Advantage Production Technology Inc. Semiconductor substrate heater and reactor process and apparatus
US4938815A (en) * 1986-10-15 1990-07-03 Advantage Production Technology, Inc. Semiconductor substrate heater and reactor process and apparatus
US5044314A (en) * 1986-10-15 1991-09-03 Advantage Production Technology, Inc. Semiconductor wafer processing apparatus
US4956046A (en) * 1986-10-15 1990-09-11 Advantage Production Technology, Inc. Semiconductor substrate treating method
US4778559A (en) * 1986-10-15 1988-10-18 Advantage Production Technology Semiconductor substrate heater and reactor process and apparatus
US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
CH697200A5 (de) 2004-10-01 2008-06-25 Oerlikon Assembly Equipment Ag Klemmvorrichtung und Transportvorrichtung zum Transportieren von Substraten.
CN110379729B (zh) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 加热基座及半导体加工设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
FR2501907A1 (fr) * 1981-03-13 1982-09-17 Thomson Csf Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62272441A (ja) * 1986-05-20 1987-11-26 Tokyo Electron Ltd イオン注入装置におけるウエハ保持装置
JPS62272445A (ja) * 1986-05-20 1987-11-26 Tokyo Electron Ltd 半導体製造装置用高真空チヤンバ−における駆動装置

Also Published As

Publication number Publication date
DE3242856A1 (de) 1983-06-01
GB2109996B (en) 1985-08-07
FR2517124A1 (fr) 1983-05-27
FR2517124B1 (Direct) 1985-02-15
GB2109996A (en) 1983-06-08
NL8204560A (nl) 1983-06-16

Similar Documents

Publication Publication Date Title
EP0025670B1 (en) Method and apparatus for conducting heat to or from an article being treated under vacuum
JP2717308B2 (ja) ウエーハ状物品の冷却方法及びその方法を実施するための装置
KR920005622B1 (ko) 음극 스퍼터링 장치
JPS5893247A (ja) 流体圧で駆動される半導体ウエ−ハ締付け装置
JP5053632B2 (ja) 基板支持体、プラズマ処理装置及びプラズマ処理装置内の基板を熱的に制御する方法
JPH0622214B2 (ja) ガスを利用して真空中でウェーハを冷却するための装置
JPS60240045A (ja) サイクリツク真空処理装置において熱伝達を制御するための装置
EP0357424A3 (en) A wafer supporting apparatus
US4274476A (en) Method and apparatus for removing heat from a workpiece during processing in a vacuum chamber
JP2512378B2 (ja) 凍結により試料片を固定するための方法および該方法を実施するための装置
WO2002021579A1 (en) Wafer clamping apparatus and method
US4297190A (en) Method for removing heat from a workpiece during processing in a vacuum chamber
JPH0790582A (ja) 基板保持装置
US4806769A (en) Disk exchangeable target mechanism with effective cooling means, for ion implantation system
US5669437A (en) High efficiency thermal interposer
JPS61264649A (ja) 基板冷却装置
JP2001068427A (ja) 基板冷却装置
JPH0682749B2 (ja) 真空内処理における板状処理物の冷却方法
JPH0227496Y2 (Direct)
JPS63193447A (ja) 試料保持装置
JP2002158174A (ja) 真空処理装置
JPH04184851A (ja) オージェ電子分析装置
US6904957B1 (en) Cooled particle accelerator target
JPS59138043A (ja) イオン打込装置のウエハ冷却機構
JPS63193450A (ja) 試料保持装置