JPS5887366U - 発光ダイオ−ド - Google Patents
発光ダイオ−ドInfo
- Publication number
- JPS5887366U JPS5887366U JP18246681U JP18246681U JPS5887366U JP S5887366 U JPS5887366 U JP S5887366U JP 18246681 U JP18246681 U JP 18246681U JP 18246681 U JP18246681 U JP 18246681U JP S5887366 U JPS5887366 U JP S5887366U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- pellet
- frame
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18246681U JPS5887366U (ja) | 1981-12-08 | 1981-12-08 | 発光ダイオ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18246681U JPS5887366U (ja) | 1981-12-08 | 1981-12-08 | 発光ダイオ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5887366U true JPS5887366U (ja) | 1983-06-14 |
| JPS6236311Y2 JPS6236311Y2 (forum.php) | 1987-09-16 |
Family
ID=29980851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18246681U Granted JPS5887366U (ja) | 1981-12-08 | 1981-12-08 | 発光ダイオ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5887366U (forum.php) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010153800A (ja) * | 2008-12-24 | 2010-07-08 | Ind Technol Res Inst | Ｌｅｄ照明モジュール及びそのパッケージ方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5327769U (forum.php) * | 1976-08-18 | 1978-03-09 |
-
1981
- 1981-12-08 JP JP18246681U patent/JPS5887366U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5327769U (forum.php) * | 1976-08-18 | 1978-03-09 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010153800A (ja) * | 2008-12-24 | 2010-07-08 | Ind Technol Res Inst | Ｌｅｄ照明モジュール及びそのパッケージ方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6236311Y2 (forum.php) | 1987-09-16 |
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