JPS5884436A - High speed pellet positioning system - Google Patents

High speed pellet positioning system

Info

Publication number
JPS5884436A
JPS5884436A JP56181622A JP18162281A JPS5884436A JP S5884436 A JPS5884436 A JP S5884436A JP 56181622 A JP56181622 A JP 56181622A JP 18162281 A JP18162281 A JP 18162281A JP S5884436 A JPS5884436 A JP S5884436A
Authority
JP
Japan
Prior art keywords
positioning
pellet
pellets
masks
high speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56181622A
Other languages
Japanese (ja)
Other versions
JPH0376580B2 (en
Inventor
Yoshiki Sakurai
良樹 櫻井
Yoshiaki Fukui
福井 好明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56181622A priority Critical patent/JPS5884436A/en
Publication of JPS5884436A publication Critical patent/JPS5884436A/en
Publication of JPH0376580B2 publication Critical patent/JPH0376580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Abstract

PURPOSE:To greatly shorten the total required time of the titled system, by introducing high speed continuous feeds in a positioning system wherein the mask count system for a semiconductor pellet is used. CONSTITUTION:The pellets 1 to be the object are arranged on an adhesive sheet 3 spread over a metallic ring 2 and supplied. The ring 2 is loaded on an XY or XYO table driven by a motor, and the pellet 1, after such a positioning that the center thereof may come onto the central axis of a thrust-up rod 4 and an adsorption collet 5, is tore off from the sheet 3 by the adsorption collet 5 and mounted onto a base. First, after performing a positioning and an adsorption to the first pellet, an index feed is performed to the left or right in the X direction, and the positioning is likewise performed to the next pellet. For this positioning, recognition masks shown in figures (a) and (b) are used. Among four masks for rough positioning U, D, R, L, when the number of those whereof the count number is judged as the regulated bit number or more is 0-1, it is judged that no pellets exist, and immediately an index feed is performed. Further, when the situation for the index feed is continuous 1-several times, the configuration of masks is changed into that of the figure (c), and the high speed continuous feed of the table is started.

Description

【発明の詳細な説明】 本発明は、半導体素子製造l−の中で特に半導体ベレッ
トをベース又はリードフレーム等の上に搭載するマウン
トエ機に参いて豪求専れるペレシト自励位置決め挟置に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to self-excited positioning and clamping, which is particularly sought after in semiconductor device manufacturing, especially in mounting machines that mount semiconductor pellets on bases, lead frames, etc. It is.

第1−に示すように、対象となるペレv)1は金属層り
ング2に優られた粘着性シート3上El!列して供給さ
れる・上記リング3はそ一夕駆励のX!またはxYOテ
ープkIc装着専れるが、ペレット1はその中心が央上
げ棒4および吸着コレット5の中心軸上化くるように位
置決めされた後、吸着コレット5によってシート3から
はがされてベース上ヘマウントされる〇 上記ベレットの自動位置決めに関しては現在まてに様々
な方式が提案されているが、それらの位置決めアルゴリ
ズムには必ずインデックス送りという動作が各ペレット
位置決めの1サイクル中に行なわれている。これは、第
2m!ll中に表わされているベレット中心間距離にほ
ぼ等しい値としてのインデックス量lxおよび17があ
らかじめ・定められていて、1個のベレットに対する位
置決め@吸着動作の終了後この容動量だけXtたはY方
向化前出のテーブルを動かしてから次のベレットの位置
決めを開始するというものである〇従来のペレット位置
決め方式は、いずれも位置決め開始時のベレット中心位
置と正規の位置における中心の間のずれに対する許容範
囲が小さいため、ベレットの配列は第2図のごとく整然
きぬけなく並んでいるという前提のもとに、前述のイン
デックス送りを施すことによって位置決め開始時のベレ
ット中心位置を許容範囲内に持ってきているわけである
0しかし、同図のような配列であることはまれてあり、
第3811や第411に示すようなベレットのぬけやか
たよりがしばしば発生する・従来、キャップ上のベレッ
トを順次くまなく位置決め対象として見ていくために通
電以下のような動作が行なわれている0即ち、#Is図
に示すごとくマス最初のベレットに対して位置決めと吸
着を行なった後、X方向で左又は右へインデックス送り
を行ない、次ベレットに対して同様に位置決めを行なう
・上記動作はキャップ端に到達するまで繰返され、キャ
ップ端にきたならばY方向て上又は下のいずれかへイン
デックス送りを行ない、X方向のインデックス送りはそ
れまての方崗七反対向きにして同様の動作続行する〇 この際、インデックス送りを行なうた時ペレットが存在
しないと判定された場合はただちにインデックス送りを
行なう。従って、第3116よび菖4図に示すようにベ
レットの存在しない部分が連続している領域Kmいても
、−回ととインデックス送りを行なう必要があり、この
部分で費される時間も大きい。
As shown in No. 1-, the target Pele v) 1 is placed on the adhesive sheet 3 superior to the metal layer 2! The above ring 3 is supplied in rows and is driven by X! Alternatively, the xYO tape kIc can be attached only, but the pellet 1 is positioned so that its center is on the center axis of the central lifting rod 4 and the suction collet 5, and then it is peeled off from the sheet 3 by the suction collet 5 and mounted on the base. Various methods have been proposed to date for the above-mentioned automatic pellet positioning, but these positioning algorithms always include an operation called index feeding during one cycle of pellet positioning. This is the 2nd m! An index amount lx and 17, which are approximately equal to the distance between the centers of the pellets represented in ll, are predetermined, and after the positioning for one pellet @ the suction operation is completed, only this capacitance Xt or Y-direction The above-mentioned table is moved before positioning of the next pellet is started. In all conventional pellet positioning methods, the deviation between the center position of the pellet at the start of positioning and the center at the normal position is As the tolerance range for However, it is rare that the arrangement is as shown in the figure.
The bullets are often loose or tilted, as shown in No. 3811 and No. 411. Conventionally, the following operations have been performed to position the bullets on the cap one by one. , #Is After positioning and suctioning the first pellet in the mass, perform index feeding to the left or right in the X direction, and position the next pellet in the same way.The above operation is performed at the end of the cap. This is repeated until reaching the end of the cap, and when the end of the cap is reached, the index feed is performed either upward or downward in the Y direction, and the same operation is continued with the index feed in the X direction in the opposite direction. 〇At this time, if it is determined that there are no pellets when index feeding is performed, index feeding is performed immediately. Therefore, even if there is a continuous area Km in which there is no pellet as shown in FIGS. 3116 and 4, it is necessary to carry out the index feeding in negative and negative times, and the time spent in this part is also large.

そこで、本発明の目的は特願昭56−123271号明
細書「ペレット位置決めiim方式」にて提案されたマ
スクカウント方式を用いた位置決め方式を改良し、前出
の時間ロスを減少させる高速ベレット位置決め方式を提
案−することにある◎本発明は、粘着性シート上に貼ら
れたパターン形成済の牛導体ウーハ−にダイシング又は
スクライビングを施した後上記シートを引き延ばし、マ
トリックス状に配列させて供給される牛導体ペレットを
吸着アームによつて順次引きはがしてベース又はリード
フレーム等ヘマウンティングするために、上記亭導体ペ
レット像を光学系化で2次元撮像系に結像させ、そのビ
デオ信号を設定時間間隔てサンプリングした時の出力電
圧値と設定閾値との比較を行なうことによって2値化i
!ii像に変換した後1その2値化画像情報に1づいて
ペレット位置決めに必要な修正量を計算し、ベレットを
配列させたキャップを保持するテーブルの駆動系を前記
修正量に従って動かすことにより位置決めを行なうペレ
ット位置決め方式において、次に位置決めすべきベレッ
トが存在する方向の領域が撮像されている2次元画像内
に、白または黒ビットの個数計数を制限する領域として
の1個ないし複数佃のマス−りを設定し、ベレットが連
続して存在しない状態における前記テーブルの送り形態
を高速連続送りとし、前記マスク内の白または黒ビット
□のカウント数により高速連続送りの続行・伜止を判定
して前記テーブル駆動系を制御することを轡徴とした高
速ペレット位置決め方式である。
Therefore, the purpose of the present invention is to improve the positioning method using the mask counting method proposed in Japanese Patent Application No. 123271/1982, "Pellet Positioning IIM Method", and to provide high-speed pellet positioning that reduces the above-mentioned time loss. The purpose of the present invention is to propose a system in which a patterned conductor woofer pasted on an adhesive sheet is diced or scribed, and then the sheet is stretched and arranged in a matrix to be supplied. In order to sequentially peel off the conductor pellets using a suction arm and mount them on a base or lead frame, etc., the conductor pellet images are optically formed on a two-dimensional imaging system, and the video signal is transmitted over a set time. Binarization is performed by comparing the output voltage value when sampled at intervals with the set threshold value.
! After converting into an image, the amount of correction required for pellet positioning is calculated based on the binary image information, and positioning is performed by moving the drive system of the table that holds the cap on which the pellets are arranged according to the amount of correction. In the pellet positioning method that performs this, one or more squares are created as an area to limit the counting of white or black bits in a two-dimensional image that captures an area in the direction in which the next pellet to be positioned exists. - is set, and the feed mode of the table in a state where there are no continuous pellets is set as high-speed continuous feed, and whether to continue or stop the high-speed continuous feed is determined based on the count number of white or black bits □ in the mask. This is a high-speed pellet positioning method that is characterized by controlling the table drive system by using the table drive system.

次に、本発明の詳細な説明を第6図以降を用いて行なう
◎籐6図6)詔よび缶)は、前記特願昭56−1232
7五号明細書にて用いられている位置淡め認識用のマス
ク配置であり、2次元画像内に配置薯れた前記マスク内
の白又は黒ビットのカウント数によって位置決めを行な
うわけであるが1#4図(a)の粗位置決め用マスクU
、D、R,L  4ケのなかでカウント数が規定ビット
数以上と判定されたものの個数がOないし1ケの場合は
ペレットが存在しないとしてただちにインデックス送り
を行なう0本発明では、このようkしてペレットなし七
判定されて直談インデックス送り化なるという状況が1
ないし数回連続した時、マスクの配置を第6図(dのよ
うに変更し、テーブルの高速連続送りを開始するもので
ある。同図に肴いてマスク81および8倉(以下先行マ
スクと記す)は、マスクPで示した位置決め時のペレッ
トeの領域よりもインデックス送り方向$CIIL、て
前方に設定される。
Next, a detailed explanation of the present invention will be given using Figures 6 onwards.
This is a mask arrangement for light position recognition used in the specification of No. 75, and positioning is performed based on the count number of white or black bits in the mask arranged in a two-dimensional image. 1#4 Rough positioning mask U in Figure (a)
, D, R, L If the count number is determined to be equal to or greater than the specified number of bits among the 4 bits, but the number is O or 1, it is assumed that no pellet exists and index feeding is performed immediately. There is a situation where it is determined that there are no pellets and the direct consultation index is sent.
When this happens several times in a row, the arrangement of the masks is changed as shown in Figure 6 (d) and the table starts to be fed continuously at high speed. ) is set ahead of the area of the pellet e during positioning indicated by the mask P in the index feeding direction $CIIL.

テーブルが高速連続送りを行なっている閏、一定時間間
隔て絶えず2次元画像情報を入力し、前記先行マスクの
カウント数を設定値と比較を行ないながら、ペレット像
が先行マスク内に入り設定値を越えた時点でテーブルに
停止指示を行ない、位置決め処理を行なう。第7図伽)
および(r)は各々同E (a)のようにペレットが並
んでいる時のテーブル駆動の従来方式の場合と本発明に
よる方式の場合のタイミングチャートである。これでわ
かる通り本発明Kmける高速連続送りを導入することに
よりトータル所要時間は大巾に削減される。
When the table is continuously feeding at high speed, two-dimensional image information is constantly input at fixed time intervals, and while the count number of the preceding mask is compared with the set value, the pellet image enters the preceding mask and the set value is reached. When the distance is exceeded, the table is instructed to stop and positioning processing is performed. Figure 7)
and (r) are timing charts for the conventional table drive method and the method according to the present invention when pellets are lined up as shown in E (a). As can be seen, by introducing the high-speed continuous feed of the present invention, the total required time is greatly reduced.

第6図は本発明を実施する際の処理回路例を示す02次
元#l僚系から入力されたビデオ信号は2値化回路をマ
スク回路を通り第6図に示す各マスクの白又は黒ビット
数の情報に変換される。制御回路ではその情報に基づい
てテーブル駆動關路へ位置修正量又はインデックス送り
、高速連続送りの111#l、停止を出力するとともに
、マスク回路へその配置の変更を指示する。
FIG. 6 shows an example of a processing circuit when implementing the present invention. The video signal input from the 02-dimensional #l system passes through a binarization circuit and a mask circuit, and the white or black bits of each mask shown in FIG. converted into numerical information. Based on the information, the control circuit outputs a position correction amount or index feed, high-speed continuous feed 111#l, and stop to the table drive link, and also instructs the mask circuit to change its arrangement.

運用上問題となるのは先行マスクの位置と黴であるが、
ペレットの並びの乱れを考直すれば上下2個以上設定し
た方がベレット像の判定が確実であり、位置としてはテ
ーブルの停止指示後のオーバーラン量に和尚する距離だ
け中るからはなれた所に設定すれば螢統の位置決めも煙
時間で行なうことが可能となるO
The operational problems are the position of the advance mask and mold,
Considering the disorder of the pellet arrangement, it is better to set two or more upper and lower pellets to determine the pellet image, and the position is a distance that is within the center or away from the overrun amount after the table is instructed to stop. If set to , it becomes possible to position the tether using the smoke time.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はベレット位置決め―機部動作を11羽するため
の断面図、第2図、第3図ならびに第411はペレット
の配列状履のIIi羽図5M5riaは従来のインデッ
クス送りの説91!園、嬉Saaはマスク配置図で同図
(s) (b)はそれぞれ譬原@56−121271勺
明、1書における粗位置決め・精管位置決め時のマスク
配置図で、岡l1lCc)は本発明における高速連続送
り時のマスク配置図、第711は従来方式と本発明によ
る所要時間を比較するための説@図で、同図−)はその
1例としてのペレット配列図、鍔間(b)詣よび(e)
は従来方式・本発明による方式に自けるタイミングチャ
ート、第8図は本発明−実施例における処理回路のブロ
ック図である〇なお図中 1・・・・・・・・・ペレッ
ト、  2・・・・・・・・・リング、  3・・・・
・・・・・シート、 4・・・・・・−・・央上げ棒、
5・・・・・・・・・吸着コレット を示す。 !!pJ1図 第 2 図 I。 第3図 vJJ  図 JPls  図 絶6図 (α)       (b)        (C)菓
7図 (cL) Cb)
Figure 1 is a cross-sectional view of the pellet positioning-machine operation for 11 operations, Figures 2, 3, and 411 are IIi blades of the pellet arrangement; Figure 5M5ria is the conventional index feed theory 91! Sono and Saa are the mask layout diagrams, and the same figure (s) and (b) are the mask layout diagrams for rough positioning and vas deferens positioning in the book 1 of Takahara @56-121271, and Oka l1lCc) is the present invention. Figure 711 is a diagram showing the mask arrangement during high-speed continuous feeding, and Figure 711 is a diagram for comparing the time required by the conventional method and the present invention. Pilgrimage (e)
8 is a timing chart of the conventional method and the method according to the present invention, and FIG. 8 is a block diagram of a processing circuit according to an embodiment of the present invention.・・・・・・Ring, 3・・・・・・
・・・・・・Seat, 4・・・・・・−・・・Center raising bar,
5...Indicates a suction collet. ! ! pJ1 Figure 2 Figure I. Figure 3 vJJ Figure JPls Figure 6 (α) (b) (C) Figure 7 (cL) Cb)

Claims (1)

【特許請求の範囲】[Claims] 粘着性シート上に貼られたパターン形成済の半導体ウー
ハ−化ダイシング又はスクライビングを施した後上記シ
ートを引会孤ばし、マトリツタス状に配列させて供給さ
れる半導体ベレットを吸着アームによって順次引きはが
してベース又はリードフレーム勢ヘマウンティングする
ために、上記半導体ベレット儂を光学系にて2次元撮g
II系に結像させ1そのビデオ信勺を設定時間間隔てサ
ンプリングした時の出力電圧値と設走閾値七の比較を行
なうことによって2値化画俄に変換した後、その2億化
函像情味に基づいてベレット位置決めに必要な修正量を
計算し、ベレットを配列させたキャップを保持するテー
プktb駆動系を前記修正量に従って動かすことにより
位置決めを行なうベレット位置決め方式に怠いて、次に
位置決めすべ会ベレνトが存在する方向の領域が撮像さ
れている2次元−健領域内に、白または黒ビットの個数
計数を制限する領域としての1@ないし複数個のマスク
を設定し、ベレットが連続して存在しない状態に怠ける
前記テーブルの送り形慧を高速連続送りとし、前記マス
ク内の白または愚ビットのカウント数により高速連続送
りの続行[株]停止を判定して前記テーブル駆動系を制
御することを轡黴とした高速ベレット位置決め方式。
After dicing or scribing the patterned semiconductor wafer pasted on the adhesive sheet, the sheet is pulled and separated, and the semiconductor pellets, which are arranged in a matrix and are supplied, are sequentially peeled off by a suction arm. In order to mount the semiconductor pellet onto a base or lead frame, the semiconductor pellet is photographed two-dimensionally using an optical system.
After converting into a binary image by comparing the output voltage value when the video signal is sampled at a set time interval with the set threshold value, the image is formed on the II system, and then converted into a binary image. The amount of correction necessary for pellet positioning is calculated based on the circumstances, and the tape ktb drive system that holds the cap with the pellets arranged is moved according to the amount of correction, thereby performing positioning. One or more masks are set as a region to limit the counting of white or black bits in the two-dimensional healthy region where the region in the direction in which the beret exists is imaged, and the beret is The feeding form of the table that is lazy in a state where it does not exist continuously is set to high-speed continuous feeding, and the table driving system is determined to continue or stop the high-speed continuous feeding based on the count number of white or stupid bits in the mask. A high-speed pellet positioning system that focuses on control.
JP56181622A 1981-11-12 1981-11-12 High speed pellet positioning system Granted JPS5884436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56181622A JPS5884436A (en) 1981-11-12 1981-11-12 High speed pellet positioning system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56181622A JPS5884436A (en) 1981-11-12 1981-11-12 High speed pellet positioning system

Publications (2)

Publication Number Publication Date
JPS5884436A true JPS5884436A (en) 1983-05-20
JPH0376580B2 JPH0376580B2 (en) 1991-12-05

Family

ID=16104006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56181622A Granted JPS5884436A (en) 1981-11-12 1981-11-12 High speed pellet positioning system

Country Status (1)

Country Link
JP (1) JPS5884436A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01161485A (en) * 1987-12-17 1989-06-26 Nichiden Mach Ltd Method for recognizing small work piece
US6047793A (en) * 1996-03-19 2000-04-11 Komatsu Ltd. Device for detecting abrasion of brake for vehicle

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100432A (en) * 1980-01-14 1981-08-12 Toshiba Corp Mounting device for semiconductor pellet

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100432A (en) * 1980-01-14 1981-08-12 Toshiba Corp Mounting device for semiconductor pellet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01161485A (en) * 1987-12-17 1989-06-26 Nichiden Mach Ltd Method for recognizing small work piece
US6047793A (en) * 1996-03-19 2000-04-11 Komatsu Ltd. Device for detecting abrasion of brake for vehicle

Also Published As

Publication number Publication date
JPH0376580B2 (en) 1991-12-05

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