JPH0376580B2 - - Google Patents
Info
- Publication number
- JPH0376580B2 JPH0376580B2 JP18162281A JP18162281A JPH0376580B2 JP H0376580 B2 JPH0376580 B2 JP H0376580B2 JP 18162281 A JP18162281 A JP 18162281A JP 18162281 A JP18162281 A JP 18162281A JP H0376580 B2 JPH0376580 B2 JP H0376580B2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- positioning
- pellets
- semiconductor
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000008188 pellet Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 241000282326 Felis catus Species 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
Description
【発明の詳細な説明】
本発明は、半導体素子製造工程の中で特に半導
体ペレツトをベース又はリードフレーム等の上に
搭載するマウント工程において要求されるペレツ
ト自動位置決め技術に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic pellet positioning technique required in a semiconductor device manufacturing process, particularly in a mounting process in which semiconductor pellets are mounted on a base, lead frame, or the like.
第１図に示すように、対象となるペレツト１は
金属製リング２に張られた粘着性シート３上に配
列して供給される。上記リング２はモータ駆動の
XYまたはXYθテーブル（図示せず）に装着され
るが、ペレツト１はその中心が突上げ棒４および
吸着コレツト５の中心軸上にくるように位置決め
された後、吸着コレツト５によつてシート３から
はがされてベース上へマウントされる。 As shown in FIG. 1, target pellets 1 are arranged and supplied onto an adhesive sheet 3 stretched over a metal ring 2. The ring 2 above is motor driven.
The pellet 1 is mounted on an XY or It is peeled off and mounted onto the base.
上記ペレツトの自動位置決めに関しては現在ま
でに様々な方式が提案されているが、それらの位
置決めアルゴリズムには必ずインデツクス送りと
いう動作が各ペレツト位置決めの１サイクル中に
行なわれている。これは、第２図中に表わされて
いるペレツト中心間距離にほぼ等しい値としての
インデツクス量IxおよびIyがあらかじめ定められ
ていて、１個のペレツトに対する位置決め・吸着
動作の終了後この移動量だけＸまたＹ方向に前出
のテーブルを動かしてから次のペレツトの位置決
めを開始するというものである。 Various methods have been proposed to date for the above-mentioned automatic positioning of pellets, but these positioning algorithms always include an operation called index feeding during one cycle of pellet positioning. This is because the index amounts Ix and Iy are predetermined as values that are approximately equal to the distance between the centers of the pellets shown in FIG. After the table is moved in the X or Y direction by a certain amount, positioning of the next pellet is started.
従来のペレツト位置決め方式は、いずれも位置
決め開始時のペレツト中心位置と正規の位置にお
ける中心の間のずれに対する許容範囲が小さいた
め、ペレツトの配列は第２図のごとく整然とぬけ
なく並んでいるという前提のもとに、前述のイン
デツクス送りを施すことによつて位置決め開始時
のペレツト中心位置を許容範囲内に持つてきてい
るわけである。しかし、同図のような配列である
ことはまれであり、第３図や第４図に示すような
ペレツトのぬけやかたよりがしばしば発生する。
従来、キヤツ上のペレツトを順次くまなく位置決
め対象として見ていくために通常以下のような動
作が行なわれている。即ち、第５図に示すごとく
まず最初にペレツトに対して位置決めと吸着を行
なつた後、Ｘ方向で左又は右へインデツクス送り
を行ない、次ペレツトに対して同様に位置決めを
行なう。上記動作はキヤツプ端に到達するまで繰
返され、キヤツプ端にきたならばＹ方向で上又は
下のいずれかへインデツクス送りを行ない、Ｘ方
向のインデツクス送りはそれまでの方向と反対向
きにして同様の動作を続行する。 Conventional pellet positioning methods all have a small tolerance for deviation between the pellet center position at the start of positioning and the center at the normal position, so it is assumed that the pellets are arranged in an orderly and consistent manner as shown in Figure 2. By performing the above-mentioned index feeding, the center position of the pellet at the start of positioning can be brought within the permissible range. However, it is rare that the arrangement is as shown in the figure, and the pellets often become loose or skewed as shown in Figures 3 and 4.
Conventionally, in order to sequentially view all pellets on a cat as objects for positioning, the following operations are usually performed. That is, as shown in FIG. 5, the pellet is first positioned and attracted, and then indexed to the left or right in the X direction, and the next pellet is positioned in the same manner. The above operation is repeated until the end of the cap is reached. When the end of the cap is reached, the index feed is performed either upward or downward in the Y direction, and the index feed in the X direction is performed in the opposite direction to the previous direction. Continue operation.
この際、インデツクス送りを行なつた時ペレツ
トが存在しないと判定された場合はただちにイン
デツクス送りを行なう。従つて、第３図および第
４図に示すようにペレツトの存在しない部分が連
続している領域においても、一回ごとインデツク
ス送りを行なう必要があり、この部分で費される
時間も大きい。 At this time, if it is determined that no pellet exists when index feeding is performed, index feeding is immediately performed. Therefore, as shown in FIGS. 3 and 4, even in areas where there are continuous portions where no pellets are present, it is necessary to perform index feeding every time, and a large amount of time is consumed in this portion.
そこで、本発明の目的は特開昭58−23448号公
報「ペレツト位置決め認識方式」にて提案し後述
するマスクカウント方式を用いた位置決め方式を
改良し、前出の時間ロスを減少させる高速ペレツ
ト位置決め方式を提案することにある。 Therefore, the purpose of the present invention is to improve the positioning method using the mask counting method proposed in Japanese Patent Application Laid-Open No. 58-23448 entitled "Pellet Positioning Recognition Method" and described later, and to achieve high-speed pellet positioning that reduces the above-mentioned time loss. The goal is to propose a method.
本発明は、粘着性シート上に貼られたパターン
形成済の半導体ウエハーにダイシング又はスクラ
イビングを施した後上記シートを引き延ばし、マ
トリツクス状に配列させて供給される半導体ペレ
ツトを吸着アームによつて順次引きはがしてベー
ス又はリードフレーム等へマウンテイングするた
めに、上記半導体ペレツト像を光学系にて２次元
撮像系に結像させ、そのビテオ信号を設定時間間
隔でサンプリングした時の出力電圧値と設定閾値
との比較を行なうことによつて２値化画像に変換
した後、その２値化画像情報に基づいてペレツト
位置決めに必要な修正量を計算し、ペレツトを配
列させたキヤツプを保持するテーブルの駆動系を
前記修正量に従つて動かすことにより位置決めを
行なうペレツト位置決め方式において、次に位置
決めすべきペレツトが存在する方向の領域が撮像
されている２次元画像内に、白または黒ビツトの
個数計数を制限する領域としての１個なしい複数
個のマスクを設定し、ペレツトが連続して存在し
ない状態における前記テーブルの送り形態を高速
連続送りとし、前記マスク内の白または黒ビツト
のカウント数により高速連続送りの続行・停止を
判定して前記テーブル駆動系を制御することを特
徴とした高速ペレツト位置決め方式である。 The present invention involves dicing or scribing a patterned semiconductor wafer pasted on an adhesive sheet, stretching the sheet, and sequentially pulling out semiconductor pellets arranged in a matrix using a suction arm. In order to peel off and mount it on a base or lead frame, etc., the semiconductor pellet image is focused on a two-dimensional imaging system using an optical system, and the output voltage value and set threshold value when the video signal is sampled at set time intervals. After converting into a binary image by comparing with In the pellet positioning method, in which positioning is performed by moving the system according to the amount of correction, the number of white or black bits is counted in a two-dimensional image that captures a region in the direction in which the next pellet to be positioned exists. One or more masks are set as the area to be restricted, and the feeding mode of the table in a state where pellets do not exist continuously is high-speed continuous feeding, and the speed is changed depending on the count number of white or black bits in the mask. This is a high-speed pellet positioning system characterized by controlling the table drive system by determining whether to continue or stop continuous feeding.
次に、本発明の詳細な説明を第６図以降を用い
て行なう。第６図ａは、前記特開昭58−23448号
公報にて用いられている位置決め認識用マスク配
置であり、２次元画像内に配置された前記マスク
内の白又は黒ビツトのカウント数によつて位置決
めを行なうわけであるが、同図ａの粗位置決め用
マスクＵ，Ｄ，Ｒ，Ｌ ４ケのなかでカウント数
が規定ビツト数以上と判定されたものの個数が０
なしい１ケの場合はペレツトが存在しないとして
ただちにインデツクス送りを行なう。本発明で
は、このようにしてペレツトなしと判定されて直
接インデツクス送りになるという状況が１ないし
数回連続した時、マスクの配置を第６図ｂのよう
に変更し、テーブルの高速連続送りを開始するも
のである。同図においてマスクS1およびS2（以下
先行マスクの記す）は、マスクＰで示した位置決
め時のペレツト像の領域よりもインデツクス送り
方向に関して前方に設定される。テーブルが高速
連続送りを行なつている間、一定時間間隔で絶え
ず２次元画像情報を入力し、前記先行マスクのカ
ウント数を設定値と比較を行ないながら、ペレツ
ト像が先行マスク内に入り設定値を越えた時点で
テーブルに停止指示を行ない、位置決め処理を行
なう。第７図ｂおよびｃは各々同図ａのようにペ
レツトが並んでいる時のテーブル駆動の従来方式
の場合と本発明による方式の場合のタイミングチ
ヤートである。これでわかり通り本発明における
高速連続送りを導入することによりトータル所要
時間は大巾に削減される。 Next, a detailed explanation of the present invention will be given using FIG. 6 and subsequent figures. FIG. 6a shows the mask arrangement for positioning recognition used in the above-mentioned Japanese Patent Application Laid-Open No. 58-23448, and is based on the count number of white or black bits in the mask arranged in the two-dimensional image. However, among the 4 coarse positioning masks U, D, R, and L shown in Figure a, the number of those whose count number is determined to be equal to or greater than the specified number of bits is 0.
If there is one missing pellet, it is assumed that no pellet exists and index feeding is performed immediately. In the present invention, when the situation in which it is determined that there are no pellets and direct index feeding occurs one or several times in a row, the arrangement of the mask is changed as shown in Figure 6b, and the high-speed continuous feeding of the table is performed. It is a start. In the figure, masks S 1 and S 2 (hereinafter referred to as preceding masks) are set ahead of the area of the pellet image at the time of positioning, indicated by mask P, in the index feeding direction. While the table is continuously feeding at high speed, two-dimensional image information is constantly input at fixed time intervals, and while comparing the count number of the preceding mask with the set value, the pellet image enters the preceding mask and is set to the set value. When the distance exceeds the limit, the table is instructed to stop and positioning processing is performed. FIGS. 7b and 7c are timing charts for the conventional method of table driving and the method according to the present invention, respectively, when pellets are lined up as shown in FIG. 7a. As can be seen from this, by introducing the high-speed continuous feed in the present invention, the total required time is greatly reduced.
第８図は本発明の実施する際の処理回路例を示
す。２次元撮像系から入力されたビデオ信号は２
値化回路とマスク回路を通り第６図に示す各マス
クの白又は黒ビツト数の情報に変換される。制御
回路ではそ情報に基づいてテーブル駆動回路へ位
置修正量又はインデツクス送り、高速連続送りの
開始、停止を出力するとともに、マスク回路へそ
の配置の変更を指示する。 FIG. 8 shows an example of a processing circuit when implementing the present invention. The video signal input from the two-dimensional imaging system is 2
It passes through a value converting circuit and a mask circuit and is converted into information on the number of white or black bits of each mask shown in FIG. Based on this information, the control circuit outputs the position correction amount or index feed, start and stop of high-speed continuous feed to the table drive circuit, and also instructs the mask circuit to change its arrangement.
運用上問題となるのは先行マスクの位置と数で
あるが、ペレツトの並びの乱れを考慮すれば上下
２個以上設定した方がペレツト像の判定が確実で
あり、位置としてはテーブルの停止指示後のオー
バーラン量に相当する距離だけ中心からはなれた
所に設定すれば後続の位置決めも短時間で行なう
ことが可能となる。 The problem in operation is the position and number of the preceding masks, but if you take into account the disarray of the pellets, it is better to set two or more above and below to determine the pellet image more reliably. By setting the distance away from the center by a distance corresponding to the amount of subsequent overrun, subsequent positioning can be performed in a short time.
第１図はペレツト位置決め・吸着動作を説明す
るための断面図、第２図、第３図ならびに第４図
はペレツトの配列状態の説明図、第５図は従来の
インデツクス送りの説明図、第６図はマスク配置
図で同図ａは従来方式の粗位置決め時のマスク配
置で、同図ｂは本発明における高速連続送り時の
マスク配置図、第７図は従来方式と本発明による
所要時間を比較するための説明図で、同図ａはそ
の１例としてのペレツト配列図、同図ｂおよびｃ
は従来方式・本発明による方式におけるタイミン
グチヤート、第８図は本発明の一実施例を適用し
た処理回路のブロツク図である。
なお図中、１……ペレツト、２……リング、３
……シート、４……突上げ棒、５……吸着コレツ
トを示す。
Fig. 1 is a sectional view for explaining the pellet positioning and suction operation, Figs. 2, 3, and 4 are explanatory views of the arrangement of pellets, Fig. 5 is an explanatory view of the conventional index feeding, Figure 6 is a mask layout diagram, Figure a is a mask layout during rough positioning using the conventional method, Figure b is a mask layout diagram during high-speed continuous feeding according to the present invention, and Figure 7 is the required time between the conventional method and the present invention. Figure a is an example of a pellet arrangement diagram, and Figure b and c are explanatory diagrams for comparison.
8 is a timing chart for the conventional method and the method according to the present invention, and FIG. 8 is a block diagram of a processing circuit to which an embodiment of the present invention is applied. In the figure, 1...pellet, 2...ring, 3
. . . Sheet, 4 . . . Push-up rod, 5 . . . Indicates suction collet.
Claims (1)
半導体ウエハーにダイシング又はスクライビング
を施した後上記シートを引き延ばし、マトリツク
ス状に配列させて共給される半導体ペレツトを吸
着アームによつて順次引きはがしてベース又はリ
ードフレーム等へマウンテイングするために、上
記半導体ペレツト像を光学系にて２次元撮像系に
結像させ、そのビテオ信号を設定時間間隔でサン
プリングした時の出力電圧値と設定閾値との比較
を行なうことによつて２値化画像に変換した後、
その２値化画像情報に基づいてペレツト位置決め
に必要な修正量を計算し、ペレツトを配列させた
キヤツプを保持するテーブルの駆動系を前記修正
量に従つて動かすことにより位置決めを行なうペ
レツト位置決め方式において、次に位置決めすべ
きペレツトが存在する方向の領域が撮像されてい
る２次元画像領域内に、白または黒ビツトの個数
計数を制限する領域としての１個ないし複数個の
マスクを設定し、ペレツトが連続して存在しない
状態における前記テーブルの送り形態を高速連続
送りとし、前記マスク内の白または黒ビツトのカ
ウント数により高速連続送りの続行・停止を判定
して前記テーブル駆動系を制御することを特徴と
した高速ペレツト位置決め方式。1 After dicing or scribing a patterned semiconductor wafer pasted on an adhesive sheet, the sheet is stretched, arranged in a matrix, and the co-supplied semiconductor pellets are sequentially peeled off using a suction arm. In order to mount the semiconductor pellet onto a base or lead frame, etc., the semiconductor pellet image is formed on a two-dimensional imaging system using an optical system, and the output voltage value and the set threshold value when the video signal is sampled at set time intervals. After converting into a binarized image by performing a comparison,
In the pellet positioning method, the amount of correction required for pellet positioning is calculated based on the binary image information, and positioning is performed by moving the drive system of the table that holds the cap in which the pellets are arranged in accordance with the amount of correction. Next, one or more masks are set as a region to limit the counting of white or black bits in the two-dimensional image region in which the region in the direction in which the pellet to be positioned exists is imaged. The table is fed in a high-speed continuous feed mode in a state where the table does not exist continuously, and the table drive system is controlled by determining whether to continue or stop the high-speed continuous feed based on the count number of white or black bits in the mask. A high-speed pellet positioning system featuring
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56181622A JPS5884436A (en) | 1981-11-12 | 1981-11-12 | High speed pellet positioning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56181622A JPS5884436A (en) | 1981-11-12 | 1981-11-12 | High speed pellet positioning system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5884436A JPS5884436A (en) | 1983-05-20 |
| JPH0376580B2 true JPH0376580B2 (en) | 1991-12-05 |
Family
ID=16104006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56181622A Granted JPS5884436A (en) | 1981-11-12 | 1981-11-12 | High speed pellet positioning system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5884436A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161485A (en) * | 1987-12-17 | 1989-06-26 | Nichiden Mach Ltd | Method for recognizing small work piece |
| JPH09257067A (en) * | 1996-03-19 | 1997-09-30 | Komatsu Ltd | Abrasion detection device for vehicular brake |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100432A (en) * | 1980-01-14 | 1981-08-12 | Toshiba Corp | Mounting device for semiconductor pellet |
-
1981
- 1981-11-12 JP JP56181622A patent/JPS5884436A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100432A (en) * | 1980-01-14 | 1981-08-12 | Toshiba Corp | Mounting device for semiconductor pellet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5884436A (en) | 1983-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5512951A (en) | Auto-focusing apparatus | |
| US4707780A (en) | Method and apparatus for reducing track errors in computer controlled machine tools or industrial robots | |
| JPH0722166B2 (en) | Pellet recognition method for die bonder etc. | |
| US4999717A (en) | Image reading apparatus | |
| US5946409A (en) | Pick-up apparatus and method for semiconductor devices | |
| JPH0376580B2 (en) | ||
| US5946408A (en) | Pick-up apparatus and method for semiconductor chips | |
| US4057845A (en) | Group control system for visual information processing | |
| US6380000B1 (en) | Automatic recovery for die bonder wafer table wafermap operations | |
| JP2654217B2 (en) | Wafer transfer method | |
| JP2000012571A (en) | Method for positioning in die bonder of semiconductor chip | |
| KR910007418B1 (en) | Method of pick-up of chip transmitting device | |
| JPS6398782A (en) | Recognizing method for micro work piece | |
| JP2001250834A (en) | Method of manufacturing semiconductor device | |
| EP0248904A1 (en) | Method of carrying out operation in working apparatus | |
| US7170045B2 (en) | Apparatus having at least two image recording devices and its method for placing at least one component in a desired position on a substrate | |
| JPS61252517A (en) | Power setting device for zoom lens | |
| JP2917483B2 (en) | Semiconductor element push-up control method | |
| JP2706440B2 (en) | Control device for sub-scanning speed | |
| JPS60154535A (en) | Wire bonding device | |
| JPS62197220A (en) | Multi-direction strain straightening device for metal plate | |
| JPH05297951A (en) | Wire bonding method | |
| JPS60206570A (en) | Method for matching projecting length of core wire | |
| Kawato et al. | Automatic IC wire bonding system with TV cameras | |
| JP2580882B2 (en) | Wire bonding equipment |