JPS5883143U - semiconductor wafer - Google Patents
semiconductor waferInfo
- Publication number
- JPS5883143U JPS5883143U JP17973781U JP17973781U JPS5883143U JP S5883143 U JPS5883143 U JP S5883143U JP 17973781 U JP17973781 U JP 17973781U JP 17973781 U JP17973781 U JP 17973781U JP S5883143 U JPS5883143 U JP S5883143U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- insulating film
- abstract
- principal surfaces
- back principal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Formation Of Insulating Films (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は半導体装置の一例としてのダイオードペレット
の断面図、第２図および第３図はこの考案の異なる実施
例の半導体ウェーハの断面図である。
５．５′・・・・・・絶縁膜、８・・・・・・拡散用窓
孔、９゜９′・・・・・・スクライブライン。FIG. 1 is a sectional view of a diode pellet as an example of a semiconductor device, and FIGS. 2 and 3 are sectional views of a semiconductor wafer of different embodiments of this invention. 5.5'...Insulating film, 8...Diffusion window hole, 9°9'...Scribe line.
Claims (1)
ブライン部分は絶縁膜がないか他部分よりも絶縁膜が薄
い半導体ウェーか。Is the semiconductor wafer a semiconductor wafer that has an insulating film on both the front and back principal surfaces, and has no insulating film on the scribe line portions of both the front and back principal surfaces, or has a thinner insulating film than other portions?
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17973781U JPS5883143U (en) | 1981-11-30 | 1981-11-30 | semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17973781U JPS5883143U (en) | 1981-11-30 | 1981-11-30 | semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5883143U true JPS5883143U (en) | 1983-06-06 |
Family
ID=29975700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17973781U Pending JPS5883143U (en) | 1981-11-30 | 1981-11-30 | semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5883143U (en) |
-
1981
- 1981-11-30 JP JP17973781U patent/JPS5883143U/en active Pending
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