JPS5882406A - Silver or silver alloy coated wire and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a silver alloy coated wire with improved corrosion resistance and solderability, and a method for manufacturing the same.

Silver or lead alloy coated wires have the characteristics of core wires, as well as the excellent corrosion resistance and hardness characteristic of copper, so they are used for chair applications.

For example, Cu, Cu-Ag, Cu-8n, Cu-Zu
In addition to the mechanical properties and conductivity of the core wire, wires made of alloy wire coated with Ag have excellent corrosion resistance and solderability peculiar to copper, so they are used as lead wires for electronic components and in electronic devices.゛It is widely used as a conductor, and the thickness of the Ag coating is corrosion resistant, and the soldering is generally 1.
~lO voice level. This type of Ag coated wire is
When exposed to a hot environment, the appearance discolors due to the diffusion of the core wire Cu, and the soldering properties deteriorate significantly. In order to avoid this, devices in which a Ni or Ni alloy layer is provided between the core wire and the Ag coating have been put into practical use. The Ni or Ni alloy layer acts as a diffusion barrier and suppresses the diffusion of the thin coating layer of the core wire C1, and is considered to be economical since no deterioration of surface quality occurs even if the Ag coating thickness is thin. There is.

However, even when such Ag-coated wires are soldered and require a certain amount of solder build-up, the solder wetting and penetrating is active and quickly spreads in a thin layer, making the solder build-up work difficult. In addition, when bleached in a high temperature environment, oxygen in the atmosphere penetrates into the Ag layer at once, and as a result, the surface of the Ni or Ni alloy layer oxidizes, making it easy for the Ag layer to peel off, and electrical connections in electronic device circuits. Not only does it reduce the reliability of the solder, but it also reduces the solder strength to 1. also decreases. Therefore, depending on the application, the use of the Helmetal or Ni alloy layer is stopped and a thick, full-coverage layer is used.

In view of this, and as a result of various studies, the present invention has developed a silver or silver alloy coated wire that has excellent corrosion resistance and soldering properties, is easy to fill with solder, and can save expensive Ag, and a method for manufacturing the same. It was developed.

The plate or silver alloy coated wire of the present invention is a wire in which an Ag or Ag alloy layer is provided on the outermost periphery of a core wire, and a tooth, a Co or alloy layer thereof and a layer of %Zn, Sn on the core wire.

It is characterized by sequentially forming layers of In, Cd, or their alloys, and then providing a layer of Ag or an Ag alloy thereon.

In addition, the method for manufacturing a wire coated with a silver alloy or a silver alloy coated wire includes Ni on the core wire,
After plating Co or alloys thereof, Zn, an,
In, Cd or their alloy is plated, and then A
GN is characterized by being plated with Ag alloy.

As shown in Figure 1, the coated wire of the present invention has a core wire (1).
A Ni, Co or alloy layer (2) of these is formed on the surface, a Zn%8kx%In, Cd or a lid layer (3) of these is formed thereon, and an Ag or Ag alloy layer (3) is formed thereon. 4)
It has been established. Various core wires are used depending on the purpose. For example, in addition to the Cu or Cu alloy wire,
It is a wire coated with Cu or a Cu alloy (for example, a copper coated steel wire or a copper coated AI wire). Ni, C.

These alloy layers (hereinafter referred to as the first intermediate layer) include Ni and Co, for example, N1-co.

i-P%Ni-B, Ni-811, Ni-Zn,
Co-P%Co-5n alloy, etc., and its thickness is 0.
1 to 5 μm of keyaki is sufficient.

Zn, 8n, In, Cd or an alloy layer thereof (hereinafter referred to as second intermediate layer) includes Zn, 8n,
Other than I”%cd, for example, Zn-Cu, Zn-Cd
, 8n-In, 5n-Pb.

5n-Cu, an-Zn, etc., one of these metals or alloys or 21a or more may be laminated to form the IJ2 intermediate noodle, and the thickness may vary or the shaft alloy coating It is desirable to set the thickness to 1 to 5. In addition, as the shaft or Ag alloy layer, Ag-Cu, A
There are G-8B alloys, etc., and the thickness thereof is usually desirably 0.5 μm or more.

The coated wire of the present invention has the above-mentioned structure, and even with a thin Ag or Ag alloy coating, it does not cause any abnormal appearance such as discoloration or peeling, and it does not affect solderability, and has appropriate solder wetting and spreading properties. This makes it easy to apply a suitable amount of solder. These effects are particularly effective when used as lead wires for diodes. In other words, when soldering the 8i tip to the laddered tip of the lead wire at high temperature, the solder wetting and spreading properties are appropriate, making it easy to build up solder to hold the chip, and then sealing the chip with resin. Therefore, even if processed at high temperatures for a long time, the soldering properties of the lead wire P will not deteriorate.

Although it is not always clear which type of oil produces such an effect, it is possible that a part of the second intermediate layer diffuses into Ag or an Ag alloy, alloys it, and is exposed to oxygen in the atmosphere. @1 It is thought that it prevents surface oxidation of the intermediate layer and also moderately suppresses solder wetting and spreading. Therefore, if the thickness of the iJ2 intermediate layer becomes insufficient to prevent All or Ag formation, and exceeds 2, the soldering properties will deteriorate. You can proceed.

That is, after degreasing and activating the surface of the core wire by conventional means, the first intermediate layer, the second intermediate layer, and the second intermediate layer are formed by electroplating or chemical plating.
The container can be manufactured by sequentially forming intermediate layers, Ag or Ag alloy coated layers.The invention will now be described in detail with reference to embodiments.

Example (1) A Cu wire with a diameter of 0.6 mm was continuously supplied, and the following treatment tank was continuously installed on the line that wound the wire, and the Cu wire was coated with a thickness of 1 mm.
0 pitch Ni plating and rhinoceros 0.05μ Zn plating and rhinoceros
Continuously perform 1.5μ Ag plating to obtain Ag coating C.
U-ray was produced.

(]]+Kaa F152J NaaH201
/l lα8hed"-110sec (2) Water washing Fresh water 55ec (3) Pickling H*5O410oV15SeC (4) Water washing
Shimizu 5sec (51Ni/
Tsuki NiSO42401/l 1filj440
"CN1Cb 5077/l "Jy'dm", 5
QsecH*BJs 3011/1 5ec (6) Water washing Fresh water (7) Zn plating '1rrcR609/l
Bath mR, TNa04 401/l IA/dm”
, 29secNre I (8011/1 (8) Water washing Shimizu, 5be
g(91Ag strike plating Ag(N 31/
l Bath temperature RTKCN 409/l IOA/
dm”, 3sec4Ag plating AgCN
5011/It Bath temperature R, TKCN 1009
/l aA/dm", 555ec0υ water washing
Shimizu 10sec++21tlL Drying Example (2) In Example (11), the following treatment tank was installed in place of the Ni plating in (5) and the Zn plating in (7), and the Cu wire was coated with a balanced 10% Co-Ni coating with a thickness of 025μ. Gold plated and thickness 0.
An Ag-coated Cu wire was manufactured by sequentially plating about 30% Zn--Cu alloy for one tone and Ag plating for a thickness of 1.5 tones.

(!11 Ni-Co alloy) Tsuki N15Oa 2
401/l bath! ! 40'CCoEjOs 15
Gino 04A/'dm", 30secNiCh 20
17/1 City BO4309/1 (71Ql-Za@;4Utsujt Cu(N
301/l bath! i40'czn(cN)t l
(1#/A! 041/lm', 30s'e"c"N
a GJ, 5'01/I ”” ' ”
"'""NJI! ωR30ν! Example (3) In Example (2), the following treatment tank was provided in place of the Cu-7,n alloy plating in (7), and the Cu wire was coated with a thickness of 0.25μ.
Approximately 1O% Co-Ni alloy plating and 8
An Ag-coated Cu wire was manufactured by sequentially carrying out N plating and 1.5 μAg plating.

(7) 8u/tsuki 8n80a 100ν
! Bath R, TH Dew 804501/l IA/d
m", 15sec β-naphthol 1g71! Glue 21/11 Example (4) Example (In 11, the following treatment tank was provided in place of the Ni plating of (5) and 15% P-Ni alloy plating, In plating with a thickness of 0.5 μm, and Ag plating with a thickness of 15 μm were performed successively.
Coated Cu wire was manufactured.

(51Ni-P alloy plating Ni phantom 4180.9/j
Bath temperature 45℃ NiC1~301b'l 5A/
dxn" g□secH1130m 301/I HsPOs 101/1 +7111'/ki In (BII'a) s
250Vl Bath temperature R0THsB04151/1.5A
/dm", 20sec!+4 BF'4 5011/7
1 Example (5) In Example (4), a lower d(+) treatment tank was provided in place of the In' plating in (7), and the Cu wire was coated with about 5
% P--N alloy plating, Cd plating with a thickness of 15 μm, and Ag plating with a thickness of 15 μm were carried out successively to produce an Ag-coated Cu wire.

+7) Cd/T* CdCN 3511/l Bath #A30℃NaCN 701/l 25A/das
” 6secNa*COs 401/1 Example (6) In Example (41), the following treatment bath was provided in place of the ln plating in (7), and about 5% P-Ni with a thickness of 15μ was applied to the Cu wire.
An Ag-coated Cu wire was manufactured by sequentially carrying out alloy plating, approximately 10% 8u-Cu alloy plating with a thickness of 1μ, and Ag plating with a thickness of 15μ.

(71Cu-an alloy plating Cu(N 301/
l Bath! ! 60℃K18nOs351/l
5A/dm" 5secK (g) 7011/I K (1 (1211/1 0 Tsusiel salt 3CMl/1 Example (7) In Example (2), the following treatment bath was used in place of the Ni-Co alloy plating in (5). A 0.3-thick Co layer is applied to the Cu wire.
Plating, approximately 30% Zn--Cu alloy plating with a thickness of 01 μm, and Ag plating with a thickness of 1.5 tones were performed successively to produce a coated Cu wire.

(51Co J tsu+ Co 8044001/l
Bath fiR, TNaC1201/l 5A/dm”
18secH BOs 451/1 Example (8) In Example (7), the following treatment bath was provided in place of the Ag plating of Ql, and the Cu wire was coated with Co plating with a thickness of 0.3 and a thickness of 0.1μ. Approximately 3% Zn-Cu alloy plating and thickness 1.5
Continuously plating 8b-Ag alloy at about 2% of μ
A 1 lcu wire coated with I alloy was manufactured.

(10Ag-8b gold metal + AgGJ 121/l
Bath temperature RTK CN 401/l 4A/””
, JQseC ammonium acid acid 2511/Nonical potash oil oil potash 251/1 Sodium KOHlS1/It Comparative example (11 Example (11) Ni plating of (5) and 7 of (7)
．． N plating was omitted and Ag plating with a thickness of 1.5 μm was performed on the Cu wire to produce an Ag-coated Cu wire.

Comparative Example (2) Comparative Example (in 11, the time for α-wise Ag plating was doubled, and Ag plating with a height of 3.0 μm was performed on the Cu wire.
A covered eICu wire was manufactured.

Comparative Example (3) In Example (1) (the Zn plating was omitted and Cu
Ni plating of IDμ and Ag plating of 1.5 tones are performed continuously on the wire to create thin wave gCu wire-1-'l#flx
did.

Comparative Example (4) In Comparative Example 13), the Ag plating time of the decoy was doubled,
NN plating with a thickness of 1.0μ on the Cu wire and a thickness of 3.0μ
Ag-coated Ag-Cu wire was manufactured by continuously performing Ag plating.

Each YuzuAg-coated Cu wire produced in this way was heated at 310°C in an H1 air flow, simulating the diode assembly process.
After heat treatment for 15 minutes at a temperature of The soldered bulk area on the surface was visually compared. In addition, the Ag-coated Cu wire after both heat treatments was
After twisting 0 times, the peeling state of the Ag coating was compared. These results are shown in Table 1.

H! Processing at a temperature of 310°C for 15 minutes in an air stream corresponds to soldering of Si chips, and as can be seen from Table 1, all of the products of the present invention exhibited moderate solderability of around 90%. . On the other hand, Comparative Example Products 1 and 2 had poor soldering properties, and Comparative Example Products 3 and 4 had excessive soldering properties, making it difficult to build up solder.

In addition, treatment in the atmosphere at a temperature of 250°C for 10 hours corresponds to resin sealing, and soldering after resin sealing corresponds to the properties, and the products of the present invention are excellent with a score of 80% or more. . On the other hand, the soldering properties of all the comparative example products are drastically reduced. Further, when twisted at peeling after being treated in the atmosphere at a temperature of 250° C. for 10 hours, the products of the examples of the present invention only slightly peeled, whereas the products of the comparative examples all peeled significantly. In particular, even in Comparative Examples 3 and 4, which had a Ni intermediate layer, the peeling was remarkable because of Ni.
This is due to the oxidation of the surface of the pigeon.

Although the conventional thin or axial alloy-coated Cu wire with a Ni intermediate layer has excellent soldering properties, it is difficult to build up solder in chip soldering, and in order to withstand resin sealing, a thickness of 5 μm is required. A thicker Ag or alloy coating was required.

On the other hand, according to the present invention, the much thinner M or Ag alloy coating makes chip soldering easier and resists resin sealing.
This not only simplifies diode assembly and significantly improves productivity, but also has a significant effect in terms of silver savings.

The above explanation is about Ag or Ag alloy coated Cu wire, but it is not limited to this, and various types of wires or Ag alloy coated wires show excellent corrosion resistance and solderability even after high temperature treatment, and are extremely useful industrially. It is something.

[Brief explanation of the drawing]

FIG. 1 is a 1r view showing an example of the coated wire of the present invention. l, core wire 2. First middle layer 3.182 middle class 4. Ag or fine alloy layer

Claims (1)

[Claims] +11 A wire in which an Ag or M alloy layer is provided on the outermost periphery of the core wire, with a layer of Ni, Co or an alloy thereof on the core wire,
A silver or silver alloy coated wire characterized in that Zn, an, In, Cd, or an alloy layer thereof is sequentially formed, and an Ag or Ag alloy layer 1 is provided thereon. (21) The silver or silver alloy coated wire according to claim 1, wherein the thickness of Zn, Sn, In, Cd, or an alloy thereof is 1 to 1 of the thickness of the Ag or Ag alloy layer. (3) After plating Ni, Co or an alloy of these on the core wire, Zn, Sn, In%Cd or an alloy of these is plated, and then a fine or Ag alloy is plated on top of the silver or Method for manufacturing silver alloy coated wire.