JPS5880184A - Magnetic bubble memory device - Google Patents
Magnetic bubble memory deviceInfo
- Publication number
- JPS5880184A JPS5880184A JP56177892A JP17789281A JPS5880184A JP S5880184 A JPS5880184 A JP S5880184A JP 56177892 A JP56177892 A JP 56177892A JP 17789281 A JP17789281 A JP 17789281A JP S5880184 A JPS5880184 A JP S5880184A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- substrate
- memory chip
- magnetic field
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C19/00—Digital stores in which the information is moved stepwise, e.g. shift registers
- G11C19/02—Digital stores in which the information is moved stepwise, e.g. shift registers using magnetic elements
- G11C19/08—Digital stores in which the information is moved stepwise, e.g. shift registers using magnetic elements using thin films in plane structure
- G11C19/085—Generating magnetic fields therefor, e.g. uniform magnetic field for magnetic domain stabilisation
Abstract
Description
【発明の詳細な説明】
(1)発明の技術分野
本発明は排気バブルの高速駆動を可能とする磁気)(プ
ルメモリデバイスに関する。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a magnetic pull memory device that enables high-speed driving of an exhaust bubble.
(2)従来技術と問題点
磁気バブルメモリデバイスにおいてメモリ素子として働
らく磁気バブルメモリチップ(以下メモリチップ)は印
刷配線基板に塔載され、これに駆動コイルが装着纒れて
駆動磁界を与えるように構成されている゛。(2) Prior art and problems A magnetic bubble memory chip (hereinafter referred to as a memory chip) that functions as a memory element in a magnetic bubble memory device is mounted on a printed wiring board, and a drive coil is attached and wound around it to provide a drive magnetic field. It is composed of ゛.
第1図はか\る基板の正面図で、第2図は印刷配線パタ
ーンを省略した基板の斜視図である。FIG. 1 is a front view of the board, and FIG. 2 is a perspective view of the board with the printed wiring pattern omitted.
メモリチップ1は深い切シ込み都2をもつ基板3の中央
部4に接着剤を用いて固定されておシ、メモリチップ1
の1林端子は基板3上に設けられている印刷配線5とポ
ンディングパッド6においてボンディング縁続されてい
る。The memory chip 1 is fixed to the center part 4 of the substrate 3 having a deep notch 2 using adhesive.
The first terminal is bonded to a printed wiring 5 provided on the substrate 3 at a bonding pad 6.
こ\で従来の基板3はアルミナ磁器のような無機材料或
はガラスエポキシ、ポリイミドのような高分子材料から
なっておシ、この上に施された単層、或は多層からなる
印桐配森5は基板の端面にある端子s7において図示し
ていないパッケージのリード端子と溶着される構造とな
っている0次に基板3に設けられている旅い切シ込み部
2紘メモリチップ1に駆動磁界を与えるためのX方゛向
コイルを挿着するためのものである◎第3図と第4図れ
基板3に駆動コイルを装着する工程を示すもので第3図
は予め巻回されているY方向コイ、ル8をメモリチップ
lが塔載されている重板3の中央部に装着した状雇図で
あシ、第4図は基板3の深い切シ込み部2を用いてY方
向コイル8の上にX方向コイル9を′#1着し丸状ii
w図である。Here, the conventional substrate 3 is made of an inorganic material such as alumina porcelain or a polymeric material such as glass epoxy or polyimide, and a single-layer or multi-layer paulownia coating is applied thereon. The forest 5 has a structure in which it is welded to a lead terminal of a package (not shown) at the terminal s7 on the end surface of the board. This is for inserting a coil in the X direction to provide a driving magnetic field. ◎ Figures 3 and 4 show the process of installing the driving coil on the board 3. Figure 3 shows the coil that has been wound in advance. Figure 4 shows a Y-direction coil 8 attached to the center of the heavy plate 3 on which the memory chip l is mounted. Place the X-direction coil 9 on top of the direction coil 8 to form a round shape II
This is a w diagram.
さてY方向コイル8とX方向コイル9Fiこのように直
交して設けられておシ、パッケージ装層恢リード端子を
通じて外部のコイルドライバーIg1kIに接続されて
磁気バブルを&動する回転磁界が形成されるように構成
されている。Now, the Y-direction coil 8 and the X-direction coil 9Fi are installed perpendicularly in this way and are connected to the external coil driver Ig1kI through the package layered lead terminal to form a rotating magnetic field that moves the magnetic bubble. It is configured as follows.
こ\で従来駆動コイルに与えられている動作周波数は1
00KHz程度であるが、磁気バブル(以下バブル)を
高速駆動させるために動作周波数を例えば−200KH
g以上に壕で増加すると駆動コイルのりアクタンスが増
加して100KHzで駆動しとKなる。Here, the operating frequency conventionally given to the drive coil is 1.
00KHz, but in order to drive the magnetic bubble (hereinafter referred to as bubble) at high speed, the operating frequency is set to -200KH, for example.
When the trench increases to more than g, the drive coil actance increases and becomes K when driven at 100KHz.
それで従来通シの電圧値で必要とする妹外を得るため(
はコイルを小形化すれによいが、机在の基板を用いる限
シこれ紘不可能でめり、またコイルの巻l!1数を等ら
す場合は必要な磁界を得るために電流値を増すことが必
要で発熱の点から制約され、何れも実用的な方法とは云
えない。So, in order to obtain the required voltage with the conventional voltage value (
This is good for making the coil smaller, but it is impossible to do this unless you use an existing board, and the winding of the coil is too small! In order to equalize the numbers, it is necessary to increase the current value to obtain the necessary magnetic field, which is restricted in terms of heat generation, and neither method can be said to be practical.
(3)発明の目的
本発明は従来の駆動コイルを用いて電圧値を変えずに高
い周波数での動作t−TI]能とするものであって、こ
れによシバプルメモリデバイスの高速化を達成させるも
のである。(3) Purpose of the Invention The present invention enables high-frequency operation (t-TI) without changing the voltage value using a conventional drive coil, and thereby increases the speed of a server-pull memory device. It is something that can be achieved.
(4) 発明の構成
本発明はメモリチップ搭載基板の表向または全体を導体
とすることによシリフレクション効米による磁界を生じ
させ、これを用いて必要とする磁界を得ると共にメモリ
チップ搭載面と反対側にある駆動コイルを導体で包むこ
とによシリアクタンスを約半分に減少させるものである
。(4) Structure of the Invention The present invention generates a magnetic field due to the reflection effect by making the surface or the entire surface of the memory chip mounting board a conductor, and uses this to obtain the required magnetic field and improve the memory chip mounting surface. By wrapping the drive coil on the opposite side with a conductor, the serial actance is reduced by approximately half.
本発明に使用するりフレダション効果は例えば第4図の
基板30表面部に金iよ)なる導体層を設け、これを反
射面として基板3のメモリチップ搭載面側にあるN方向
コイル9およびY方向コイル8の鈍像を作;シ、これに
よる磁界を)FIJ J’Hするものであるら
そのためには従来の絶縁基板に代って導体層をもつ基板
にメモリチップを塔載する必要がある。The refraction effect used in the present invention can be achieved by, for example, providing a conductor layer made of gold (i) on the surface of the substrate 30 in FIG. If you want to create an obtuse image of the directional coil 8 (the magnetic field produced by this), it is necessary to mount the memory chip on a substrate with a conductive layer instead of the conventional insulating substrate. be.
第5囚および第6図はか\る基板を用いたバブルメモリ
デバイスの実施例についての断面図である0
第5図の実施例で使用している基板はアルξ或は銅など
の金属板100表面にポリイミド、ポリシルキサンなど
の耐熱性樹脂11を被覆してこの上に印刷配線を施して
基板としたものであシ、この基板の中央部にメそりチッ
プを塔載し、以後従来と同様な方法でY方向コイル8と
X方向コイル9が挿着されて第4図と同様な外観をもつ
素子が形成される。Figures 5 and 6 are cross-sectional views of examples of bubble memory devices using such substrates. The substrate used in the example of Figure 5 is a metal plate made of aluminum or copper. The surface of 100 is coated with heat-resistant resin 11 such as polyimide or polysiloxane, and printed wiring is printed on this to form a substrate.A mesori chip is mounted on the center of this substrate, and the rest is carried out in the same manner as before. The Y-direction coil 8 and the X-direction coil 9 are inserted in a similar manner to form an element having an appearance similar to that shown in FIG.
この第5図に示す構造をとる実施例においては金−板1
0の表面がリフレクション面で表・シ、この面Jj)上
にあるY方向コイル8とX方向コイル9は本実施例の場
合臂、像が金属板10中に生じこれらの磁界がメモリチ
ップ1に加わってこの中のパズルを駆動する。In this embodiment having the structure shown in FIG.
In this embodiment, the Y-direction coil 8 and the X-direction coil 9 on this surface Jj) are the reflection surface, and an image is generated in the metal plate 10, and these magnetic fields are reflected in the memory chip 1. Join us to drive the puzzles in this.
次に第6図の場合は基板12は従来と同じアルミナ、′
ポリイミドなどの絶縁材料により形成されているが上層
部に銅、銀などの導電膜からなる導体層13があり、こ
の上に基板と同じ材料を用いて絶縁層14が形成されて
印刷配線基板を構成している。Next, in the case of Fig. 6, the substrate 12 is made of alumina, which is the same as before.
Although it is made of an insulating material such as polyimide, there is a conductive layer 13 made of a conductive film such as copper or silver on the upper layer, and an insulating layer 14 is formed on top of this using the same material as the substrate to form a printed wiring board. It consists of
この実施例の場合は導体層13の上面がリフレクション
面と々シ、X方向コイルおよびY方向コイルの鶴像は絶
縁材料よシなる基板12の中に形成されている。In this embodiment, the upper surface of the conductor layer 13 is a reflection surface, and the crane images of the X-direction coil and the Y-direction coil are formed in the substrate 12 made of an insulating material.
さてリフレクション効果により生じた磁界の方向は元の
コイルによる方向と対称的であシ、基板上に塔載されて
いるメモリナツプに加算して加わるため従来の基板を挾
んで設けられている表面側のコイルによる寄与分と#1
ソ郷しい。Now, the direction of the magnetic field generated by the reflection effect is symmetrical to the direction caused by the original coil, and in order to be added to the memory nap mounted on the board, it is Contribution by coil and #1
It feels so hometown.
次に高周波で使用する場合のりアクタンスの増加を減ら
すためには基板の裏面側の磁界を遮蔽すればよく、この
方法として基板の裏側部分を導体をもって覆えばよい。Next, in order to reduce the increase in flux actance when used at high frequencies, it is sufficient to shield the magnetic field on the back side of the substrate, and this can be done by covering the back side of the substrate with a conductor.
第5図および第6図の実施例においては銅箔15を用い
て基板10,12の下面のコイル8.9を包んである。In the embodiments of FIGS. 5 and 6, copper foil 15 is used to wrap coils 8.9 on the bottom surfaces of substrates 10, 12.
か\る方法をとることによシ下面のコイル8.9による
磁界は遮蔽されリアクタンスは1/2に減少さすことが
できる。By adopting this method, the magnetic field due to the coils 8 and 9 on the lower surface is shielded, and the reactance can be reduced to 1/2.
なおか\る遮蔽導体は本実施例のように電気的に浮かせ
て設けても差支えないが基板のりフレクション用導体と
結線すると雑音対策上有利である。It should be noted that the shielding conductor may be provided electrically floating as in this embodiment, but it is advantageous in terms of noise countermeasures if it is connected to the substrate flexion conductor.
(5)発明の効果
本発明は100KHzの動作周波数で従来使用されてい
たバブルメモリデバイスを更に高速動作させる場合、駆
動コイルのリアクタンスが増加するため従来と同様な駆
動磁界を得るためにはTsA動コイルへの印加電圧値の
増加が必要であるが、リフレクション効果を用い、一方
メモリチップと反対側の磁界を遮蔽する本発明を実施す
ることにょシ駆動コイルへの印加電圧値を堀・すことな
く200KHzへの高速化を達成することができた。(5) Effects of the Invention The present invention provides that when a bubble memory device conventionally used at an operating frequency of 100 KHz is operated at a higher speed, the reactance of the drive coil increases. Although it is necessary to increase the voltage value applied to the drive coil, it is necessary to increase the voltage value applied to the drive coil by implementing the present invention, which uses the reflection effect to shield the magnetic field on the side opposite to the memory chip. We were able to achieve a speed increase of 200KHz without any problems.
第1図は磁気バブルメモリチップを塔載する基板の正面
図、第2図は基板のf!+祝図、43図は基板にY方向
コイルを装着した状四図、第41町はこれにX方向コイ
ルを装着【、た状態図、&se’:および第6図は本発
明の実施例の1I7T爾1構造である。
図において
lは磁気メモリチップ、3打基板、8はY方向コイル、
9けX方向コイル、1oは金b&、11は耐熱性樹脂、
12は絶#基板、13は導体層、14は絶縁編、15は
一箔。
第1図
り
第5図
12図
舅4図
第6図
hイFigure 1 is a front view of the board on which the magnetic bubble memory chip is mounted, and Figure 2 is the f! Figure 43 shows the state in which the Y-direction coil is attached to the board, and Figure 41 shows the state in which the X-direction coil is attached to it. 1I7T er 1 structure. In the figure, l is a magnetic memory chip, 3-stroke board, 8 is a Y-direction coil,
9 pieces of X direction coil, 1o is gold b&, 11 is heat resistant resin,
12 is a thin board, 13 is a conductive layer, 14 is an insulating layer, and 15 is a single foil. Fig. 1 Fig. 5 Fig. 12 Fig. 4 Fig. 6 Fig. h
Claims (1)
を搭、載したる後、該チップを中心としてX方向コイル
およびY方向コイルを装着して磁気バブルの駆動コイル
を形成してなる磁気バブルメモリデバイスにおいて、該
チップを塔載する前記基板に導体層を設けると共に基板
の裏面側の駆動コイル(導体を用いて遮蔽してなること
を特徴とする磁気バブルメモリデバイス。 イス。(1) A magnetic bubble formed by mounting and mounting a magnetic bubble memory chip in the center of a printed wiring board, and then attaching an X-direction coil and a Y-direction coil around the chip to form a magnetic bubble drive coil. A magnetic bubble memory device characterized in that a conductor layer is provided on the substrate on which the chip is mounted, and a drive coil (shielded using a conductor) on the back side of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56177892A JPS5880184A (en) | 1981-11-06 | 1981-11-06 | Magnetic bubble memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56177892A JPS5880184A (en) | 1981-11-06 | 1981-11-06 | Magnetic bubble memory device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5880184A true JPS5880184A (en) | 1983-05-14 |
JPS6156590B2 JPS6156590B2 (en) | 1986-12-03 |
Family
ID=16038880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56177892A Granted JPS5880184A (en) | 1981-11-06 | 1981-11-06 | Magnetic bubble memory device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5880184A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009113137A (en) * | 2007-11-05 | 2009-05-28 | Zuikan Ko | Holder for hand tool |
-
1981
- 1981-11-06 JP JP56177892A patent/JPS5880184A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009113137A (en) * | 2007-11-05 | 2009-05-28 | Zuikan Ko | Holder for hand tool |
Also Published As
Publication number | Publication date |
---|---|
JPS6156590B2 (en) | 1986-12-03 |
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