JPH03208366A - Structure of hybrid integrated circuit part - Google Patents

Abstract

PURPOSE:To prevent the transfer of radiated noise to ambient parts thereby avoiding the erroneous operation, etc., of circuits by a method wherein an opening part passing through a substrate is made to contain a noise radiating electronic part inside the opening part while short rings shielding the radiated noise are formed along the inner diameter part of the opening. CONSTITUTION:An electronic part 7 such as a transistor, etc., radiating noise is mounted on a mother substrate 11 with the terminals 10 fixed to the conductor patterns 12 formed on the mother substrate 11. An opening part 13 is made in the thickness direction in the central part of a compound inductor 3 to contain the electronic part 7 in the opening part 13 so that specific terminal electrodes 8 on both sides of the substrate 11 comprising the compound inductor 3 may be fixed to the conductor patterns 12 by soldering process etc. Furthermore, short rings 14 are formed on the inner diameter part of the opening part 13 by such process as printing conductors in laminated structure or laminating sheet type conductors. Through these procedures, the noise radiated from the electronic part 2 can be converted into a current fed back to the short rings 14 to be thermal-consumed thereby enabling the effect of the radiated noise on ambient circuit to be minimized.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a single substrate comprising a composite inductor formed by a laminated structure of a magnetic material and a conductor, or at least one of a composite inductor, a composite capacitor, or a composite resistor. The present invention relates to the structure of a hybrid integrated circuit component having a composite substrate with overlapping edges.

(Prior Art) FIG. 4 is a cross-sectional view showing this type of conventional hybrid integrated circuit component, which is a composite inductor in which a plurality of inductors are formed by laminating a magnetic material 1 and a coil conductor 2 by a printing method or the like. 3
(Although a transformer may be configured within the composite inductor 1, in this specification, the inductor is used as a representative, and the description of the transformer is omitted.) The dielectric material 4 and the electrode conductor 5 are formed by a printing method. A composite capacitor 6 which is laminated to form a plurality of capacitors is superimposed, and this superimposed body is used as an integrated substrate, and a transistor and a transistor are placed on the substrate.
one or more electronic components 7A, such as an IC or chip resistor;
It will be equipped with 7B. Reference numeral 8 denotes a terminal electrode made of a conductor formed on the side surface of the laminate, which connects the built-in inductor, capacitor, or electronic components 7A, 7B, and connects the predetermined terminal electrode 8 to the motherboard (not shown). be soldered. Reference numeral 9 denotes a conductor pattern connecting the terminals 10 of the electronic components 7A and 7B to the terminal electrodes 8 and the like.

(Problem to be solved by the invention) In such hybrid integrated circuit components, the electronic component 7A
Alternatively, if 7B is something that generates radiation noise, such as a switching element, the radiation noise will be transmitted to peripheral components, causing malfunctions in peripheral circuits or signal disturbances. For products that have electronic components that generate such radiation noise, take measures such as covering the causing elements and circuits with a shielding case, or placing them at a distance from surrounding circuits. There is a problem in that it leads to an increase in size.

In view of the above-mentioned problems, it is an object of the present invention to provide a structure of a hybrid integrated circuit component that minimizes the influence of radiation noise on peripheral circuits.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a single substrate consisting of a composite inductor formed by a laminated structure of a magnetic material and a conductor, or a composite inductor and a composite capacitor, or a composite inductor and a composite capacitor. A hybrid integrated circuit component including a composite substrate on which at least one of the resistors is superimposed, an opening passing through the substrate in the thickness direction, an electronic component that generates radiated noise accommodated in the opening, and the opening A short ring is provided along the inner diameter of the sensor to shield radiation noise.

(Function) Since the present invention has the above-described structure, the radiation noise generated by the electronic component housed in the opening is converted into current by the short ring and heat is consumed.

(Embodiment) FIG. 1 is a sectional view showing an embodiment of the structure of a hybrid integrated circuit component according to the present invention, and FIG. 2 is a plan view of the embodiment. In FIGS. 1 and 2, 11 is a motherboard;
An electronic component 7 such as a transistor that generates radiation noise on the mother board 11 or its terminal 10 is connected to the mother board 1.
It is fixedly attached to a conductor pattern 12 formed on the conductor pattern 1. The composite inductor 3 is provided with an opening 13 penetrating in the thickness direction at the center thereof, the electronic component 7 is accommodated in the opening 13, and the terminal electrode 8 on the side surface of the substrate made of the composite inductor 3 is provided. A predetermined material is fixed to the conductive pattern 12 by soldering or the like. Further, the short ring 14 is formed on the inner diameter portion of the opening 13 by printing a conductor in a laminated structure or laminating sheet-like conductors.

With this structure, noise emitted by the electronic component 7 is converted into a current flowing back to the short ring 14, and heat is consumed.

Further, in the present invention, an electronic component that does not substantially generate radiation noise may be mounted on the substrate consisting of the composite inductor 3;
In the configuration in which only the components housed within the composite inductor 3, the thickness T of the entire component is only the thickness of the composite inductor 3, and a reduction in thickness is achieved.

FIG. 3 shows another embodiment of the present invention, in which a composite inductor 3
A composite capacitor 6 is integrally superimposed on a composite capacitor 6, and an opening 13 is provided in the same way as in the previous embodiment, and an electronic component 7 that generates radiation noise is housed in the opening 13. Furthermore, in this embodiment, the terminal IO of the electronic component 7 is soldered not to the conductor pattern 12 of the motherboard 1141 but to the conductor pattern 9 formed on the board made of a laminate.

In addition to the embodiments described above, the present invention can also be applied to a composite inductor 3 with a composite resistor superimposed thereon, or a composite resistor further superimposed on the laminate shown in FIG.

(Effects of the Invention) According to the present invention, an opening is provided that penetrates a substrate made of a laminate in the thickness direction, an electronic component that generates radiation noise is housed in the opening, and a Since the short ring is provided to shield radiation noise, transmission of radiation noise to peripheral components is prevented, and circuit malfunctions and signal disturbances are prevented. Furthermore, compared to conventional measures such as covering with a shield case or keeping a distance from peripheral circuits, according to the present invention, a short ring can be provided integrally with the laminate, so the circuit Overall miniaturization can be achieved.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of a hybrid integrated circuit component according to the present invention, and FIG. 2 is a plan view of the embodiment. FIG. 3 is a sectional view showing another embodiment of the present invention, and FIG. 4 is a sectional view showing the structure of a conventional hybrid integrated circuit component.

Claims (1)

[Claims] In a hybrid integrated circuit component equipped with a single substrate consisting of a composite inductor formed by a laminated structure of a magnetic material and a conductor, or a composite substrate in which a composite inductor and at least one of a composite capacitor and a composite resistor are superimposed, the substrate is A hybrid device characterized by having an opening penetrating in the thickness direction, accommodating an electronic component that generates radiated noise in the opening, and providing a short ring for shielding radiated noise along the inner diameter of the opening. Structure of integrated circuit components.