JPS5879794A - Hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to hybrid integrated circuits, and particularly to hybrid integrated circuit boards that require heat dissipation effects.

Conventional hybrid integrated circuits are formed by appropriately attaching passive circuit elements such as resistors and capacitors and active circuit elements such as transistors to an insulating substrate such as a ceramic plate or a glass plate.

However, in the above configuration, since the substrate is an insulating material such as ceramic or glass, heat dissipation is poor, especially when incorporating resistors or transistors designed for high power use.
These resistors and transistors generate significant heat, so
There is a risk that the heat will destroy not only peripheral parts such as capacitors, but also the resistors and transistors themselves, and even if it does not result in destruction, it often significantly changes their electrical characteristics.

In addition, in order to make heat dissipation more effective, there is a method in which a gold layered aluminum plate is used, and the entire surface of the aluminum plate is anodized to form an aluminum oxide film, which is used as an insulating substrate. However, in this case, the aluminum oxide film is very sensitive to heat and cracks at about 120°C, and cracks occur even at a temperature difference of 110°C, so the electrical insulation properties are a major problem.

As a measure to improve this electrical insulation, some have coated the aluminum oxide film with a resin, but this has the disadvantage that the resin layer deteriorates heat dissipation. Insulating substrates are also used in which a resin layer is directly provided on the whole surface of an aluminum plate, but due to problems with pinholes in the resin layer and electrical insulation, the resin layer is thick and difficult to dissipate heat. The result is very bad. As described above, it is unsuitable for use as a circuit board for a hybrid integrated circuit in which circuit elements that consume large amounts of power and generate large amounts of heat must be incorporated, and they have many drawbacks.

The present invention solves the above-mentioned drawbacks by providing a hybrid integrated circuit board that effectively dissipates heat generated from resistors and transistors, has good electrical insulation, has a simple structure, and can be mass-produced. .

The structure of the hybrid integrated circuit board of the present invention is to form a film of aluminum oxide aqueduct 2 on at least the entire surface of an aluminum plate 1 (so-called boehmite treatment), and to stably apply silicon oxide to a phenol made of silicone resin and a solvent. The dispersed treatment agent is formed on the film of the aluminum oxide aquarium 2 (so-called Vesta treatment in the Dow Corning type Pesta treatment agent). Next, a conductive material is selectively deposited to form a plurality of circuit elements such as conductors 4 and 5 and resistors 6 and 7.

The hybrid integrated circuit board of the present invention constructed in this manner has aluminum oxide hydrated on the surface of the aluminum plate 1.

Because it forms a film of substance 2, it has excellent durability, corrosion resistance, and chemical resistance, and also has good electrical insulation properties. Compared to aluminum oxide produced by anodizing, it does not require chemicals or large amounts of electricity, so it is resource-saving. , it can save energy, has no pollution problems, is economical, and has a short processing time, improving productivity (5 to 10 minutes is enough compared to the 20 to 40 minutes required for anodizing). ). It also provides strong adhesion as a paint base, and compared to when PESTA treatment is applied directly to the aluminum surface, it is much stronger when applied through the aluminum oxide hydrate film 2. Yes, you can get something reliable.

Furthermore, because a PESTA treatment agent consisting of a silicone resin and a solvent, in which silicon oxide is stably dispersed in a varnish, is applied onto the aluminum oxide hydrate film, it has very good heat resistance. Whereas the aluminum oxide film shown above cracks when heated to about 120°C, no cracking occurs even after heating at 350°C for 10 minutes. Thermal shock resistance is also extremely high; in the case of an aluminum oxide film alone, a temperature difference of approximately 110°C will cause the film to crack, but even after heating at 300°C for 10 minutes, the film will crack immediately after being immersed in water at 20°C. There is no. Furthermore, since a boehmite film is formed on the aluminum surface and then PESTA treated, there are almost no pinholes and it exhibits extremely high corrosion resistance. Approximately 500% in boiling water
No blackening occurs even after long immersion.

Further, when a coating formed by Pesta treatment is applied by a dip method, a coating thickness of 4 to 6 μm can be obtained in one treatment. In this way, the film can be formed thinly, without the occurrence of pinholes, and the aluminum oxide hydrate film itself can be treated in boiling water by freely controlling its treatment time. As a result, heat generated from the resistor or transistor itself can be quickly transmitted to the aluminum plate through each film and dissipated to the outside air.

In this way, the hybrid integrated circuit board of the present invention is made by subjecting the entire surface of an aluminum plate to boehmite treatment and Pesta treatment to obtain a film, and then forming circuit elements on the film, and this structure is extremely simple. Moreover, it can be easily and thinly formed with a uniform thickness. In addition, due to the double film, the electrical insulation properties are very good.The heat generated from the resistor and transistor is quickly transmitted to the aluminum plate, and can be dissipated from the aluminum plate to the outside air.It is designed for high power use. It can be used as a circuit board for hybrid integrated circuits.

Examples of the present invention will be described below.

(Example) The aluminum plate l has a thickness of 2. Omm length 6. A board with a width of 40 mm and a width of 40 mm was used and subjected to degreasing, etching, and neutralization. Degreasing is done with a 3% alkaline degreaser solution at a temperature of 70±5.
It was carried out for 5±1 minutes at ℃. After that, it was washed with water and etched. For etching, use 6-thick soda at a temperature of 50~
The test was carried out at 55°C for 6 minutes. Thereafter, it was thoroughly washed with water and neutralized. Neutralization was carried out using IO nitric acid at room temperature for 1 to 2 minutes, followed by washing with water. After obtaining the aluminum material in this way, it is thoroughly washed with pure water (deionized water) and boiled water (deionized water, over 1060 m, at a temperature of over 90°C for 3 hours.
The aluminum oxide hydrate film 2 (about 1 μm thick) was formed on both surfaces of the aluminum plate. next,
Using Dow Corning's Vesta treatment agent, it was applied by the Diazo method and cured at 150° C. for 30 minutes to form a Vesta treatment film (about 5 μm thick) 3.

After that, conductors 4 and 5 are formed on predetermined main turns by vapor deposition (nickel-based conductor material is used), a copper heat sink 8 is fixed to the transistor fixing part of the conductor, and the transistor is mounted. Also, capacitors and resistors 6, 7
By attaching peripheral parts such as, a hybrid integrated circuit board could be obtained. In addition, as a method of forming a conductor, before applying the PESTA treatment agent and curing it, it is also possible to laminate a copper foil, etc., and then harden it, then etch the copper foil into a predetermined pattern, and then apply nickel plating, etc. A hybrid integrated circuit board of the present invention is obtained.

FIG. 3 shows the heat dissipation characteristics of the hybrid integrated circuit board according to the present invention.

A is a paper phenol board, B is a glass epoxy board, C is a ceramic board, D is a conventional aluminum board, and E is a hybrid integrated circuit board of the present invention.

As described above, the hybrid integrated circuit board of the present invention effectively radiates heat generated from resistors and transistors, has good electrical insulation, has a simple structure, is easy to mass produce, and has practical value. It is something that has.

[Brief explanation of drawings]

1 and 2 are diagrams showing a hybrid integrated circuit board used in an embodiment of the present invention, with FIG. 1 being a plan view and FIG. 2 being a sectional view. FIG. 3 is a diagram showing the heat dissipation characteristics of various substrates. DESCRIPTION OF SYMBOLS 1... Aluminum plate, 2... Aluminum oxide hydrate, 3... Film by Besta treatment, 4, 5... Conductor, 6.7... Resistor, 8... Heat sink.
1 To Figure 1 Figure 2 Figure 3 0.5 1.0 1.5 2.0 Discharge power (W)

Claims (1)

[Claims] A treatment agent in which silicon oxide is stably dispersed in a face made of silicone resin and a solvent is applied and cured on the film formed by leaving aluminum oxide hydrate on the surface of the aluminum plate by leaving it in boiling water for at least a lifetime. Forms an insulating film,
A hybrid integrated circuit board 0 characterized in that a plurality of circuit elements are mounted after selectively depositing a conductive material on the insulating film.