JPS587658Y2 - printed circuit board - Google Patents

printed circuit board

Info

Publication number
JPS587658Y2
JPS587658Y2 JP12691377U JP12691377U JPS587658Y2 JP S587658 Y2 JPS587658 Y2 JP S587658Y2 JP 12691377 U JP12691377 U JP 12691377U JP 12691377 U JP12691377 U JP 12691377U JP S587658 Y2 JPS587658 Y2 JP S587658Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
pad
pitch
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12691377U
Other languages
Japanese (ja)
Other versions
JPS5453658U (en
Inventor
賢一 古厩
二三幸 小林
則夫 千石
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP12691377U priority Critical patent/JPS587658Y2/en
Publication of JPS5453658U publication Critical patent/JPS5453658U/ja
Application granted granted Critical
Publication of JPS587658Y2 publication Critical patent/JPS587658Y2/en
Expired legal-status Critical Current

Links

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【考案の詳細な説明】 この考案は印刷回路基板の導通検査に関するものである
[Detailed Description of the Invention] This invention relates to continuity testing of printed circuit boards.

従来、印刷回路基板の導通検査は、導通検査機のプロー
バのピッチ寸法が印刷回路基板の格子ピッチ寸法に合致
した検査機を用いておこなわれていた。
Conventionally, continuity testing of printed circuit boards has been performed using a continuity testing machine whose prober pitch dimension matches the grid pitch dimension of the printed circuit board.

そのため、格子ピッチの異なる印刷回路基板に対しては
、寸法をそれに合わせた検査機を用意しなければならな
かったから、印刷回路基板の格子ピッチの寸法の種類が
増えると、それだけ導通検査のための設備費が増大する
という欠点があった。
Therefore, for printed circuit boards with different grid pitches, it was necessary to prepare testing machines whose dimensions matched the dimensions. The disadvantage was that equipment costs increased.

この考案は上述の欠点を克服するためになされたもので
あり、異なる格子ピッチをもつ印刷回路基板であっても
、同じ導通検査機を使って導通検査ができるように工夫
をこらされた印刷回路基板の提供を目的とする。
This idea was made to overcome the above-mentioned drawbacks, and it is a printed circuit that has been devised so that continuity testing can be performed using the same continuity testing machine even for printed circuit boards with different grid pitches. The purpose is to provide substrates.

考案の要点は、印刷回路基板上に形状の異なる複数種類
のパッドを配置することにより、異なる格子ピッチの印
刷回路基板であっても同じ導通検査機によって検査がお
こなわれ得るようにしたことである。
The key point of the invention is that by arranging multiple types of pads with different shapes on a printed circuit board, it is possible to test printed circuit boards with different grid pitches using the same continuity tester. .

以下、図面を参照してこの考案を詳しく説明する。This invention will be explained in detail below with reference to the drawings.

第1図は従来の印刷回路基板の部品取付面を示す。FIG. 1 shows a component mounting surface of a conventional printed circuit board.

第1図において、1は印刷回路基板、2は検査の出来る
パッド、3は検査の出来ないパッド、4は部品取付用パ
ッド、5はパターン、を示す。
In FIG. 1, 1 is a printed circuit board, 2 is a testable pad, 3 is a non-testable pad, 4 is a component mounting pad, and 5 is a pattern.

第1図に示されているように、印刷回路基板1における
パッドの中には、導通検査の出来るパッド2と出来ない
パッド3があるため、検査の必要のある部品取付用パッ
ド4は事前にパターン5により導通検査可能なパッド2
まで引き出しておき検査を受けるようにする。
As shown in FIG. 1, among the pads on the printed circuit board 1, there are pads 2 that can be tested for continuity and pads 3 that cannot be tested. Pad 2 that can be tested for continuity using pattern 5
Bring it out and have it inspected.

さて、検査の出来るパッド2と検査の出来ないパッド3
が生じる理由は次の如くである。
Now, pad 2 that can be inspected and pad 3 that cannot be inspected.
The reason why this occurs is as follows.

印刷回路基板1の格子ピッチを例えば75m1l導通検
査機のプローバのピッチを100 milどすると、最
小公倍数300 milの間に、印刷回路基板は4格子
、プローバは3ピツチ3本となり、縦、横方向に4列に
1列が導通検査の出来ないパッド3となる。
If the grid pitch of the printed circuit board 1 is, for example, the pitch of the prober of a 75ml continuity tester 100 mils, then within the least common multiple of 300 mils, there will be 4 grids on the printed circuit board and 3 probers with 3 pitches, so that the pitch of the probers in the vertical and horizontal directions will be 4. One out of every four rows is a pad 3 that cannot be tested for continuity.

一般的には、次のように計算する。プローバの本数/印
刷回路基板格子数=(プローバのピッチ)2/(格子ピ
ッチ)2 現在の例では、プローバが3ピツチで格子が4ピツチで
あったから、32/42=9/16となり、16個のパ
ッドのうち9個が検査可能であり、残りの7個は検査の
できないパッドである。
Generally, it is calculated as follows. Number of probers / number of printed circuit board grids = (prober pitch) 2 / (grid pitch) 2 In the current example, since the prober has 3 pitches and the grid has 4 pitches, 32/42 = 9/16, and 16 Nine of the pads can be tested, and the remaining seven pads cannot be tested.

第2図は、導通検査のおこなわれる印刷回路基板1の裏
面のパッドの形状および配置を示す図で、この考案の一
実施例を示す図である。
FIG. 2 is a diagram showing the shape and arrangement of pads on the back surface of the printed circuit board 1 on which continuity testing is performed, and is a diagram showing an embodiment of this invention.

第2図において、101は円パッド、102はスルーホ
ール、103は楕円パッド、を示す。
In FIG. 2, 101 is a circular pad, 102 is a through hole, and 103 is an oval pad.

第2図において、印刷回路基板1、−1=−で゛、ブロ
ーμのピッチと一致するところは円パッド101を、フ
In FIG. 2, the printed circuit board 1, -1=-, and the circular pads 101 are placed at the positions that match the pitch of the blow μ.

ローμのピッチと一致しないが導通検査は必要という所
には、スルーホール103を基準にして、縦方向又は横
方向に25 mil (100−75m1l) 、ある
いは45°方向にJ7X25milの長さ寸法をもった
楕円パッド102を配置して、ブローμのピッチに合う
ようにする。
Where continuity testing is required even though the pitch does not match the low μ pitch, use a length of 25 mil (100-75 ml) in the vertical or horizontal direction, or J7 x 25 mil in the 45° direction, using the through hole 103 as a reference. Arrange the elliptical pad 102 so that it matches the pitch of the blow μ.

ブローμのピッチとも一致しないし、導通検査も不要と
いうところには、印刷配線のスルーホール用に円パッド
を配置しておく。
In areas where the pitch of the blow μ does not match and where continuity testing is not required, circular pads are placed for through holes for printed wiring.

第3図は、第2図のA、A’線に沿った印刷回路基板の
断面図において、導通検査機のブローμが接続された状
態を示す。
FIG. 3 is a sectional view of the printed circuit board taken along lines A and A' in FIG. 2, showing a state in which the blow μ of the continuity tester is connected.

201はブローμを示す。第3図から分るように、ブロ
ーμのピッチと一致する個所の円パッド101は、スル
ーホール102にブローμ201を接続し、楕円パッド
103では楕円部分にブローμ201を接続して導通検
査がおこなわれる。
201 indicates blow μ. As can be seen from FIG. 3, the circular pad 101 is connected to the through hole 102 at the circular pad 101 that matches the pitch of the blow μ, and the blow μ 201 is connected to the oval portion of the oval pad 103 for continuity testing. It will be done.

第1図で説明した部品取付用パッド4は、ブローμのピ
ッチと一致する故検査可能な円パッド(例えば101)
か、ブローμのピッチとは一致しないが楕円パッドを配
置されたことによりブローμの接続ができ検査可能とな
ったパッド(例えば103)、にまで゛パターン5によ
り引き出すことが必要なわけである。
The component mounting pad 4 explained in FIG. 1 is a circular pad (for example, 101) that can be inspected because it matches the pitch of the blow μ.
In addition, even pads (for example, 103) that do not match the pitch of the blow μ but can be inspected because the blow μ can be connected due to the placement of elliptical pads (for example, 103) need to be drawn out using pattern 5. .

以上、この考案によれば、例えば楕円形のパッドを印刷
回路基板上に配置することにより、印刷回路基板の格子
ピッチと合致しないピッチ寸法のブローμをもつ導通検
査機によっても導通検査が可能となり、この考案の実用
的、経済的価値は大きい。
As described above, according to this invention, by arranging, for example, an oval pad on a printed circuit board, continuity testing becomes possible even with a continuity testing machine that has a blow μ with a pitch that does not match the grid pitch of the printed circuit board. , This idea has great practical and economic value.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の印刷回路基板の部品取付面を示す。 第2図はこの考案の一実施例を示す図で、印刷回路基板
の裏面のパッドの形状および配置を示す。 第3図は、第2図のA、A’線に沿った印刷回路基板の
断面図において、導通検査機のブローμが接続された状
態を示す。 図において、1は印刷回路基板、2は検査の出来るパッ
ド、3は検査の出来ないパッド、4は部品取付用パッド
、5はパターン、101は円パッド、102はスルーホ
ール、103は楕円パッド、201はブローμを示す。
FIG. 1 shows a component mounting surface of a conventional printed circuit board. FIG. 2 is a diagram showing an embodiment of this invention, showing the shape and arrangement of pads on the back side of a printed circuit board. FIG. 3 is a sectional view of the printed circuit board taken along lines A and A' in FIG. 2, showing a state in which the blow μ of the continuity tester is connected. In the figure, 1 is a printed circuit board, 2 is a pad that can be inspected, 3 is a pad that cannot be inspected, 4 is a pad for mounting components, 5 is a pattern, 101 is a circular pad, 102 is a through hole, 103 is an oval pad, 201 indicates blow μ.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 形状の異なる複数種のパッドをスルーホールに配置され
て成る印刷回路基板であって、スルーホールの格子ピッ
チ寸法と異なるピッチ寸法のプローバをもつ導通検査機
によっても導通検査が可能なように前記各種パッドの形
状を定めたことを特徴とする印刷回路基板。
A printed circuit board in which multiple types of pads with different shapes are arranged in through holes, and the various types of pads described above can be tested even by a continuity tester having a prober with a pitch different from the grid pitch of the through holes. A printed circuit board characterized by having pads having a defined shape.
JP12691377U 1977-09-22 1977-09-22 printed circuit board Expired JPS587658Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12691377U JPS587658Y2 (en) 1977-09-22 1977-09-22 printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12691377U JPS587658Y2 (en) 1977-09-22 1977-09-22 printed circuit board

Publications (2)

Publication Number Publication Date
JPS5453658U JPS5453658U (en) 1979-04-13
JPS587658Y2 true JPS587658Y2 (en) 1983-02-10

Family

ID=29089192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12691377U Expired JPS587658Y2 (en) 1977-09-22 1977-09-22 printed circuit board

Country Status (1)

Country Link
JP (1) JPS587658Y2 (en)

Also Published As

Publication number Publication date
JPS5453658U (en) 1979-04-13

Similar Documents

Publication Publication Date Title
JP3307574B2 (en) Test equipment for printed circuit boards
US4052793A (en) Method of obtaining proper probe alignment in a multiple contact environment
JPS587658Y2 (en) printed circuit board
JPH07201935A (en) Probe card and inspection method
JPS6362294A (en) Printed wiring board
JPH07154053A (en) Wiring board, and method and device for testing the same
CN218123403U (en) Test packaging module, siP chip test equipment and system thereof
JPS6340391A (en) Surface mount printed circuit board
JPH083516B2 (en) Test head for semiconductor device and test method
JPS6138575A (en) Adapter unit for printed circuit board checking machine
JPH02248876A (en) Superadaptor for testing printed board
JPS6245194A (en) Printed wiring board
JP2570033B2 (en) Continuity inspection machine for printed wiring boards
JP2926759B2 (en) Semiconductor integrated circuit measurement jig
JPH06105824B2 (en) Printed board
JPS6249688A (en) Printed circuit board
JPH04265871A (en) Burn-in chamber
JPS6450466U (en)
JPS6286787A (en) Surface mount printed circuit board
JPH03241766A (en) Lsi package
JPS5847777U (en) Test head for testing printed wiring boards
JPH02134843A (en) Integrated circuit
JPS59120969A (en) Fixture device for test of parts
JPS60135677U (en) Fixture for circuit board tester
JPH04155273A (en) Adapter module and interposer for tester of printed-wiring board with adapter module