JPS5875903A - Multilayered line structure - Google Patents

Abstract

PURPOSE:To obtain a multilayered line structure which has improved characteristics and improve reliability of connection by shifting the lead-out positions of through hole conductors from each other, and adhering conductor plates which overlaps with each other in a prescribed section between said lead-out positions and in the same plane with an external conductor surface. CONSTITUTION:When multilayered triplet lines each consisting of an external conductor plate 1, a dielectric substrate 2, and an internal conductor plate 3 are connected mutually by through hole conductors 4a and 4b, the through hole conductor 4b is shifted in position from the through hole conductor 4a, and conductor plate 5 are formed between them while overlapping with each other in a prescribed section. The conductor plates 5 are adhered to the same surface with the external conductor plates 1 between the triplet lines and serve as the external conductor plates 1 of the triplet lines to be connected and internal conductor plates of triplet lines formed newly by utilizing the dielectric substrates 2.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a multilayer line structure essential for multilayering a triplate line for transmitting microwaves.

Figures 1 (a) and (b) show configuration diagrams of a conventional multilayer line structure. Figure 1 (a) is a plan view showing the main parts cut away, and Figure 1 (1)) is a diagram showing the structure of a conventional multilayer line structure. A sectional view thereof is shown. (1) in the diagram
is the outer conductor plate, (2) is the dielectric substrate, (3) is the inner conductor plate, (4a) ? (4b) is a through-hole conductor. Here, the through-hole conductors (4a) and (4b) are realized by chemical engineering techniques such as plating.

This conventional multilayer line structure will be briefly described below.

Conventionally, in order to connect microwaves between multilayer triplex (Ill) lines, a multilayer line structure has been realized using through-hole conductors (4a) (4b) formed on a dielectric substrate (2) as main media. In this multilayer line structure, there are connection parts between each layer, that is, through-hole conductors (4a), (4
In order to improve the reliability of the contact part b), the area of the contact part is made as large as possible.

However, in this multilayer line structure, the through-hole conductor (4a)
, (4b) If the area of the contact portion is increased, the electrical characteristics deteriorate, and there is a drawback in that the frequency of use is increased. On the other hand, in this multilayer line structure, when trying to realize a higher frequency range, through-hole conductors (4a), (4
In b), the area of the contact portion must be narrowed, which has the disadvantage of reducing the reliability of the connection between each layer.

The multilayer line structure of the present invention eliminates the above-mentioned conventional drawbacks, and its purpose is to improve characteristics and reliability.

FIGS. 2(a) and 2(b) are configuration diagrams showing an embodiment of the multilayer line structure of the present invention, FIG. 2(a) is a plan view showing the main part cut away, and FIG. 2(1) ) shows the cross-sectional view. In the figure, (1) is an external conductor plate, and (2) is a dielectric substrate.

(3) Fi internal conductor plate, (4a) and (4b) are through-hole conductors.

(5) is a conductor plate.

Here, the through-hole conductors (4a) and (4b) are realized by chemical technology such as plating.

Hereinafter, the multilayer line structure according to the present invention will be explained in detail. In the multilayer line structure according to the present invention, the through-hole conductor (4b) is shifted from the through-hole conductor (4a), and the conductor plate (5) is formed between them so as to overlap in a predetermined section. The conductor plate (5) is attached to the same surface as the external conductor plate (1) between the triplate lines to be connected, and is attached to the external conductor plate (1) and dielectric substrate of the triplate line to be connected. Utilizing (2), it serves as the internal conductor plate of the newly formed triplate line.

Therefore, in the multilayer line structure according to the present invention.

The connection between each layer is realized by surface contact of the external conductor plate (5) attached on the same surface as the external conductor plate (11) between each layer, so the reliability of the connection is improved.On the other hand, the characteristics of the connection Since the conductor plate (5) that plays the role of 1 is the internal conductor plate of the newly formed tri-plate line, even if you increase the contact area on 9 surfaces, that is, the overlap of the conductor plates (5), there will be no force deterioration like in the past. does not occur.

The disadvantage of the multilayer line structure according to the present invention is that the dimensions are slightly larger, and that the dielectric substrates above and below the conductor plate (5)
Since the thickness of 2), that is, the thickness of the dielectric portion of the newly formed triplate line is thick, higher-order modes are likely to occur. This is the section where the conductor plate (5) is formed.

By forming a conductor layer having the same potential as the outer conductor plate (1) on the attachment surface of the inner conductor plate (3) or the attachment surface of the conductor plate (5),
It is possible to downsize the newly formed triplate line and prevent the generation of higher-order modes.

In addition, in the multilayer line structure according to this invention,
One through-hole conductor (4a) for each connection between one path
, (4b) has been described, but the present invention is not limited to this, and can also be applied to a case where a coaxial line is formed using a plurality of through-hole conductors.

[Brief explanation of drawings]

Figures 1(a) and 1(b) show the configuration of a conventional multilayer line structure. Figure 1(a) is a plan view showing the main parts cut away, and Figure 1(b) is a cross-sectional view. , Fig. 2(a),(b)
1 shows a configuration diagram of a multilayer line structure according to the present invention, and FIG. The same figure (b) shows the sectional view. In the figure, (1) is an external conductor plate, (2) is a dielectric substrate, and (3) is a dielectric substrate.
) is an internal conductor plate, (4a) and (4b) are through-hole conductors. (5) is a conductor plate. (5) -1° In Figure 9, the same or Buddhist parts are designated by the same reference numerals. Agent Shin Kuzuno − = (6)

Claims (2)

[Claims] (1) In a multilayer line structure in which multilayer triplate lines consisting of an outer conductor plate, a dielectric substrate, and an inner conductor plate are connected by through-hole conductors taken out perpendicularly from the triplate line. A multilayer line structure characterized in that the lead-out positions of the through-hole conductors are shifted from each other, and a conductor plate overlapping a predetermined section is formed between them and on the same surface as the outer conductor plate surface between the triplate lines. (2) A conductor layer having the same potential as the outer conductor plate is formed on the inner conductor plate adhesion surface or the conductor plate adhesion surface of the section where the conductor plate is formed, as set forth in claim No. fl). Multilayer track structure.