JPH0576103U - Strip line - Google Patents

Abstract

(57) [Summary] [Objective] The present invention provides a stripline capable of miniaturizing the stripline and obtaining a high Q. [Structure] The strip line is a strip line 16 formed by facing conductive films on both front and back surfaces to first dielectric substrates 11 and 13 having conductive films 14 and 15 serving as ground layers formed on one surface. 17 and the strip line 1
Second dielectric substrate 1 including through hole 19 in which conductive film 20 is formed to connect 6 and 17 at a plurality of points
2 are laminated and configured. Further, a strip line in contact with the strip line of the second dielectric substrate is formed on the surface of the first dielectric substrate on the side of the second dielectric substrate.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a strip line used alone as a transmission line, a resonator, or a filter, or as a part of a multilayer circuit board. In the present specification, the conductive film formed on the dielectric substrate is referred to as “strip line”, and the transmission line, the resonator, and the transmission line configured by the dielectric substrate on which the strip line and the ground layer are formed, Alternatively, the filters, and the filters formed on a part of a multilayer circuit board or the like are collectively referred to as “strip lines”.

[0002]

[Prior Art]

 FIG. 3 is a diagram for explaining a stripline in a conventional example. In FIG. 3, a conductive film 33 1 serving as a ground layer is formed on one surface of the dielectric substrate 31. Further, on one surface of the dielectric substrate 32, a conductive film 34 serving as a ground layer and a strip line 35 composed of a conductive film are formed on the other surface, as described above. Then, in the strip line 3, the dielectric substrate 31 and the dielectric substrate 32 are bonded to each other with the strip line 35 interposed therebetween by an adhesive agent (not shown) or thermocompression bonding. In this way, the strip line 3 is composed of the inductor of the strip line 35 and the capacitance of the strip line 35 and the conductive films 33 and 34 formed as the ground layers.

The filter using the strip line 3 shown in FIG. 3 has a larger insertion loss than the filter formed by the coaxial resonator 4. This is because the Q of the strip line 3 is worse than the Q of the coaxial resonator 4. Therefore, in order to improve the Q of the strip line 3, the following is considered. FIG. 4 shows a conventional stripline in which striplines are formed on both dielectric substrates. In FIG. 4, the dielectric substrate 51 has a conductive film 53 serving as a ground layer on one surface and a strip line 55 on the other surface. In addition, the dielectric substrate 52 has a conductive film 54, which serves as a ground layer, on one surface and a strip line 56 made of a conductive film on the other surface, as described above. The strip line 5 is formed by joining the dielectric substrates 51 and 52 so that the strip line 55 and the strip line 56 are in contact with each other. Even if the strip line 55 in the strip line 5 shown in FIG. 4 has the same thickness as the strip line 35 shown in FIG. 3, by forming it on both the dielectric substrates 51 and 52, the strip line 55 has a double thickness. The track is obtained. Therefore, the Q of the strip line 5 can be improved without widening the width of the strip line.

FIG. 5 shows a conventional example in which a dielectric substrate having strip lines formed on both sides is sandwiched between the dielectric substrates shown in FIG. In FIG. 5, the dielectric substrate 61 has a conductive film 64 serving as a ground layer on one surface and a strip line 66 on the other surface. In addition, the dielectric substrate 63 has a conductive film 65, which is a ground layer, on one surface and a strip line 69 made of a conductive film is formed on the other surface, as described above. Further, strip lines 67 and 68 are formed on both surfaces of the dielectric substrate 62. The strip line 6 is formed so that the strip line 66 formed on the dielectric substrate 61 and the strip line 67 formed on the dielectric substrate 62 are in contact with each other, and the strip line 69 formed on the dielectric substrate 63. And the strip line 68 formed on the dielectric substrate 62 are bonded to each other so as to be in contact with each other. By adopting the triplate structure as shown in FIG. 5, it is possible to obtain a stripline 6 having a small size and a high Q.

[0005]

[Problems to be solved by the device]

 However, in order to increase the Q of the strip line, when the structure shown in FIGS. 4 and 5 is used, the thickness of the portion where the strip line is formed is the same as that of the other portions and the film thickness. There is a difference. Therefore, when each dielectric substrate is pressure-bonded, the force applied to the pressure-bonded portion becomes non-uniform. In such a state, if the dielectric substrates are simultaneously fired, the non-uniform force will be applied to the bonded portion between the strip line and the dielectric substrate, and this will cause manufacturing problems such as peeling. To do. Due to the above problem, the thickness of the strip line cannot be made unlimitedly thick. Further, it is conceivable to widen the width of the strip line in order to increase Q, but if this is done, the strip line cannot be downsized.

An object of the present invention is to solve the above problems, and an object of the present invention is to provide a stripline capable of reducing the size of the stripline and obtaining a high Q.

[0007]

[Means for Solving the Problems]

 (First Invention) In order to achieve the above-mentioned object, the stripline of the present invention has a first conductive film (14 and / or 15 in FIGS. 1 and 2) to be a ground layer formed on one surface thereof. Strip lines (16 and 17 in FIGS. 1 and 2) formed by facing conductive films on both front and back surfaces of a dielectric substrate (11 and / or 13 in FIGS. 1 and 2) and the strip lines (16 , 17) a second dielectric substrate (12 in FIGS. 1 and 2) formed of a through hole (19 in FIGS. 1 and 2) formed with a conductive film (20 in FIG. 1) for connecting the plurality of portions. ) Are stacked.

(Second Invention) The strip line of the second dielectric substrate (12) is provided on the surface of the strip line of the present invention on the second dielectric substrate (12) side of the first dielectric substrate (11). (16 and / or 17)) to form a stripline (21 and / or 22 in FIG. 2).

[0009]

[Work]

 (First and Second Inventions) On the second dielectric substrate, a strip line formed by facing conductive films on both front and back surfaces thereof and a conductive film for connecting the strip lines at a plurality of points are formed. Since the through hole is provided, the volume of the conductor is increased by the amount of the conductive film formed in the through hole. Therefore, Q can be set higher than that of a strip line having the same volume. Further, since the second dielectric substrate is provided with the through holes, when the first dielectric substrate and the third dielectric substrate are sandwiched, the wraparound of the adhesive or the biting of the substrate member is good, and the fixing strength is high. You can get a high price.

[0010]

【Example】

 1 (a) and 1 (b) are views for explaining one embodiment of the strip line in the present invention. 1A and 1B, the dielectric substrate 11 has a conductive film 14 serving as a ground layer formed on one surface thereof. In addition, the conductive film 15 to be a ground layer is formed on one surface of the dielectric substrate 13 in the same manner as described above. Further, the dielectric substrate 12 has strip lines 16 and 17 formed on both surfaces thereof, and also has a plurality of through holes 18 connecting the strip lines 16 and 17 via the dielectric substrate 12. .. A conductive film 20 is formed in the plurality of through holes 18 to form a through hole 19.

The strip line 1 includes strip lines 16 and 17 connected by a plurality of through holes 19 formed in the dielectric substrate 12, and a dielectric layer in which a conductive film 14 serving as a ground layer is formed. It is configured by being sandwiched between the substrate 11 and the dielectric substrate 13 on which the conductive film 15 serving as the ground layer is formed. Further, the strip line 1 can be fired after the conductive films 14 and 15, the strip lines 16 and 17, or the through holes 19 to be the ground layers are previously formed on the dielectric substrates 11 to 13. The through holes 19 have a diameter of 0.25 mm and are provided at intervals of 1 mm or less with respect to a line having a strip line width of 1.0 mm, for example. Alternatively, after firing the dielectric substrates 11 to 13, the conductive films 14 and 15, the strip lines 16 and 17, or the through holes 19 to be the ground layers are formed, and these can be fired later. Further, as the dielectric substrates 11 to 13, well-known dielectric members such as ceramic type or glass epoxy resin type can be used.

As described above, since the strip lines 16 and 17 in this embodiment are connected by the through holes 19 via the dielectric substrate 12, as compared with the triplate type strip line 6 shown in FIG. Since the through hole 19 is formed, the resistance becomes low, so that Q can be improved despite the same size. When a substrate made of ceramic or the like is used, after the ground layer, the strip line, and the through hole are formed on the green sheet to be the substrate, they can be pressure bonded by heat before firing. By such heat-bonding, a part of the substrate is embedded in the through hole, and the substrate is firmly bonded. Therefore, after the dielectric substrate on which the strip lines 16 and 17 are formed is baked, the substrate does not peel off.

FIG. 2 is a view for explaining another embodiment of the strip line according to the present invention. 2 is different from the strip line 1 shown in FIG. 1 in that strip lines 21 and 22 are formed on the dielectric substrate 11 and the dielectric substrate 13. That is, since the strip line 2 shown in FIG. 2 has strip lines 21 and 22 formed therein, the strip line 2 has a resistance lower than that of the strip line 1 shown in FIG.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Further, various design changes can be made without departing from the present invention described in the claims for utility model registration. For example, the material of the dielectric substrate is not particularly limited, and any known member can be adopted. Further, the shape of the strip line is not limited to the straight line as in the embodiment, and various shapes including curved lines can be adopted. Further, a well-known method such as a thick film forming method using copper or silver or a plating method can be employed for forming the conductive film forming the ground layer or the strip line.

[0015]

[Effect of the device]

 According to the present invention, the strip line formed by facing the conductive films on both surfaces of the second dielectric substrate and the through hole for connecting the strip lines at a plurality of locations are provided, thereby providing a small size and a high Q. Could be obtained. Further, according to the present invention, by providing the through hole in the second dielectric substrate, when the first dielectric substrate is pressure-bonded, the member of the first dielectric substrate bites into the through hole portion. Alternatively, the adhesive may wrap around to increase the bonding strength between the dielectric substrates.

[Brief description of drawings]

1A and 1B are views for explaining an embodiment of a strip line according to the present invention.

FIG. 2 is a view for explaining another embodiment of the strip line according to the present invention.

FIG. 3 is a diagram for explaining a stripline in a conventional example.

FIG. 4 shows a conventional example of a strip line in which strip lines are formed on both dielectric substrates.

5 shows a conventional example in which a dielectric substrate having strip lines formed on both sides is sandwiched between the dielectric substrates shown in FIG.

[Explanation of symbols]

 1, 2 ... Strip line 11 to 13 ... Dielectric substrate 14, 15 ... Ground layer 16, 17, 21, 22 ... Strip line 18 ... Through hole 19 ... Through hole 20 ... Conductive film

Continuation of the front page (72) Creator Satoshi Kazama 6-16-20 Ueno, Taito-ku, Tokyo Inside Taiyo Induction Co., Ltd.

Claims (2)

[Scope of utility model registration request] 1. A first dielectric substrate having a conductive film serving as a ground layer formed on one surface thereof, and a strip line formed by facing conductive films on both front and back surfaces, and the strip lines at a plurality of locations. A stripline comprising a second dielectric substrate, which is formed by laminating a through hole having a conductive film to be connected, laminated. 2. The strip line is formed on the surface of the first dielectric substrate on the second dielectric substrate side so as to be in contact with the strip line of the second dielectric substrate. Stripline.