JPS6340824Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention has particularly good workability by directly embedding a capacitor made of a high dielectric chip in a laminated bus bar for a circuit board, which is made by laminating insulating materials and strip-shaped conductors alternately. Concerning a laminated busbar with a built-in capacitor.

With the large-scale integration of ICs and other electronic components and the high-density mounting of these electronic components on circuit boards, the power supply and distribution paths and signal lines for the electronic circuits constructed by these devices are subject to adverse effects from high-frequency noise, etc. There has been a strong demand for devices with low characteristic impedance, such as low inductance and high distributed capacitance. Laminated busbars have a structure in which a film-like insulating material with a good dielectric constant is interposed between the conductors, making them ideal for use in such power supply distribution lines or signal lines. There is a limit to the distributed capacitance that can be obtained with dielectric materials commonly used as insulating materials. Therefore, as an expedient method to solve this problem, attempts have been made to use a special high dielectric material for the intervening insulating material, but this is difficult to put into practical use mainly due to cost considerations. There is.

This invention has a built-in capacitor for circuit boards that enables the design of an extremely good power supply system by directly incorporating capacitors made of a large number of high dielectric chips into this type of laminated bus bar used in power supply systems for electronic circuits. The object of the present invention is to provide a new type laminated bus bar with a built-in capacitor for a circuit board, which has high workability and can reduce the cost of the product.

The laminated busbar with a built-in capacitor of the present invention has a shape of a high dielectric chip to be interposed between strip conductors via an insulating adhesive, so that the width is equal to or larger than the width of the interlayer insulation material and the strip conductor. Form it like this. If the width of the chip is the same as that of the strip-shaped conductor and the interlayer insulating material, an appropriate number of notches are formed on the longitudinal side edges of the conductor and the insulating material, or an appropriate number of notches are formed in the area where the high dielectric chip is located. Provides several holes,
By adhering a conductive material such as solder or solder cream to the notch or hole, it becomes possible to easily bond both sides of the chip to the strip-shaped conductor adjacent thereto. Furthermore, if the width of the high dielectric chip is larger than the width of the interlayer insulating material and the strip-shaped conductor, the above-mentioned bonding process can be easily performed on the protruding portion of the chip, and in any case, the above-mentioned chip and this The assembling work efficiency for a flat capacitor formed by strip-shaped conductors substantially arranged to sandwich the capacitor is greatly improved. Here, for example, a thin ceramic plate can be used as the high dielectric chip, but such materials are generally brittle and break easily, so they must be handled carefully during assembly and other operations. By adopting the above-mentioned chip form of the present invention, workability such as assembly and electrical connection processing between strip-shaped conductors is good.
A multilayer bus bar with a built-in capacitor with excellent characteristics can be obtained.

In addition to the above features, when manufacturing the laminated bus bar with a built-in capacitor of the present invention, a large number of the high dielectric chips are bonded in the form of a tape with a release paper for interlayer insulation in advance, with or without a spacer. It can be easily formed as an interlayer member having a substantially high dielectric constant by sandwiching the material between the layers. Next, at the stage where the release paper is peeled off and the band-shaped conductors are adhered to both sides of the chip, the exterior of the laminate is subjected to a resin coating treatment, thereby improving the productivity of the product with high efficiency.

Hereinafter, the present invention will be explained in more detail according to embodiments shown in the drawings.

Figures 1 to 4 illustrate an embodiment of one of the laminated busbars with a built-in capacitor according to the present invention, and the major feature is that the width of the high dielectric chip is larger than the width of the strip conductor. There is. That is,
In Figures 1 and 2, 1 and 2 are strip-shaped conductors made of copper plates, and on one longitudinal side of each of them, there are many terminals 1 for mounting on a circuit board.
A, 2A are formed with appropriate pitch and necessary offset. Between these two conductors 1 and 2, ceramic plates 3 as high dielectric chips and insulating spacers 4 are interposed and bonded using an insulating adhesive 5, with or without a gap provided alternately. It is something. In this case, at least the ceramic plate 3 is formed to have a width larger than the width of the conductors 1 and 2, and solder or solder cream is applied to both sides of each ceramic plate 3 protruding from the upper edges of the strip conductors 1 and 2 in the longitudinal direction. 6 is attached so that the upper edge of each strip-shaped conductor 1, 2 and each surface of the upper end of the ceramic plate 3 are individually bonded.
Since both the strip-shaped conductors 1 and 2 have the spacer 4 and the ceramic plate 6 interposed therebetween, the terminals 1A and 2A are connected at their bases as shown in FIG. It is preferable to bend them so that they line up in a straight line. 7 shows an insulating coating layer formed on the exterior of such a laminate. The coating layer 7 is formed on the terminals 1A and 2A.
Terminals 1A and 2A are exposed to an insulating powder resin made of polyester resin, butadiel resin, acrylic resin, or epoxy resin while holding the terminals 1A and 2A.
The insulating coating layer 7 can be formed with high efficiency by uniformly adhering this powder resin to the outer circumference of the laminate except for the parts, and then heating it to melt and solidify the powder resin. be.

Since the ceramic plate 3 is brittle and easily cracked, in the present invention, the ceramic plate 3 and the insulating spacer 4 are simply bonded from both sides using two tape-shaped insulating adhesives 5 having a release paper 8, as shown in FIG. It was configured to be sandwiched. As is clear from the process diagram conceptually shown in FIG. 4, such a method can significantly simplify the workability of each process and improve work efficiency. According to this embodiment, the insulating spacers 4 are arranged alternately with the ceramic plates 3, but the size of the spacers 4 may be changed or the spacers 4 may not be used and only the ceramic plates 3 may be interposed. A desired distributed capacitance can be formed by, for example,

That is, as shown in FIG. 4, a large number of tapered insulating adhesives 5 having release papers 8 matching the width and length of the strip conductors 1 and 2 are prepared in advance, and as shown in FIG. Ceramic plates 3 and insulating spacers 4 are alternately pasted on each sheet. In this case, ceramic plate 3 and spacer 4
arranged so that there is a slight gap between them,
Adhesive material produced during curing performed in the post-process 5
It is preferable to take measures to absorb the heat shrinkage. Next, as shown in FIG. 3, another adhesive 5 with a release paper 8 is attached to the upper surfaces of these, so that the state shown in FIG. 3 can be obtained. The release paper 8 prevents foreign matter such as dust and oil from adhering to the other surface of each adhesive 5 during this process, and also facilitates the above-mentioned bonding operation. Above ceramic plate 3, spacer 4
The work of pasting together the adhesive material 5 can be done manually using an appropriate jig or the like, or automatically so that each member takes the arrangement form shown in Figures 1 to 3. be. After completing such a bonding process, the release paper 8 on one side is peeled off and one strip-shaped conductor 1 is bonded to the exposed surface of the adhesive 5 as shown in FIG. Then, the release paper 8 on the other side is peeled off and the other strip-shaped conductor 2 is bonded, and then, in order to firmly bond the laminated body, it is inserted into a heating press and subjected to a curing treatment while being pressurized and heated. After such an integration process for the laminate, as shown in FIGS. 1 and 2, electrical connections are made between the upper end edges of the adjacent conductors 1 and 2 at the upper end portions of the protruding ceramic plates 3, respectively. In order to do this, solder or solder cream 6 must be applied. Finally, as shown in FIG. 6, the above-mentioned coating layer 7 made of powder insulating resin is formed as the exterior of the laminate, thereby making it possible to manufacture the product with high efficiency.

In the above embodiment, the width of the ceramic plate 3 as a high dielectric chip is formed to be larger than the width of the band-shaped conductors 1 and 2, and the electrical connection process necessary to form a capacitor is performed in the upper end region of the conductors 1 and 2. However, instead of this method, the connection methods shown in FIGS. 5 to 8 are also extremely advantageous. That is, the first method is as shown in Figures 5 and 6.
As shown in the figure, the width of the ceramic plate 3A and the spacer 4A is formed to be the same as the width of the band-shaped conductors 1, 2, and the width of the band-shaped conductors 1, 2 and the adhesive material 5A in the area where the ceramic plate 3A is arranged. For example, an appropriate number of common holes 9 as shown in the figure are provided in the central portion in the longitudinal direction, and after the respective members are pasted together as in the above embodiment, the holes 9 are filled with a conductive material 10 such as solder or solder cream, and each conductor is 1 and 2 and the ceramic plate 3A in each facing area. In addition, as a second method, as shown in FIGS. 7 and 8, a ceramic plate 3A and a spacer 4A are also used.
is formed to have the same width as that of the band-shaped conductor 3A and the adhesive material 4A, and a common notch 11 is formed at the upper end of the conductors 1, 2 and the adhesive material 5A at the position where the ceramic plate 3A is arranged. A part of the upper end portion of the ceramic plate 3A is exposed, and then solder or solder cream 1 is applied using the method shown in FIGS. 1 and 2.
2 is attached to establish electrical continuity between the two.
All of these methods can be manufactured with high efficiency through substantially the same steps as in the above embodiments, but in particular, the structures shown in FIGS. This method has the advantage that each member can be easily bonded together.
In these embodiments, as described above, the spacer 4A is eliminated and only the ceramic plate 3A is used, or the length dimension of the spacer 4A and the ceramic plate 3A is arbitrarily changed, or the thickness thereof is changed. It is possible to configure a product to have a distributed capacitance that is optimal for the specifications by taking either or all of them into consideration.

As can be seen from the above description, the present invention has a high dielectric constant chip made of a ceramic plate that is sandwiched between insulating adhesive materials with release paper in advance, together with insulating spacers as necessary, to create a substantially integrated high dielectric constant chip. Since the interlayer insulator having the above structure can be easily constructed, the workability in assembling a plurality of high dielectric chips can be suitably improved. Then, in the process of joining each high dielectric chip with each strip conductor, a conductive material such as solder or solder cream is applied to the protruding portion of the high dielectric chip to the strip conductor or the notch or through hole provided in the conductor. This can be done easily and efficiently by attaching . In addition, since the exterior of such a laminated busbar is obtained by an insulating coating layer made of powder resin, the exterior forming work can be achieved with high efficiency, and the cost of the product can be further reduced, allowing for high-density mounting of electronic components. It is possible to provide a laminated bus bar with a built-in capacitor that is very excellent as a high-quality power supply to a circuit board associated with the above-mentioned circuit board or as an electric circuit means for transmitting and receiving signals.

[Brief explanation of the drawing]

FIG. 1 is a conceptual partial cutaway plan view of a laminated bus bar with a built-in capacitor according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view taken along the line X-X of FIG. 1, and FIG. A partially cutaway enlarged perspective view showing how the ceramic plate and the insulating spacer shown in Figure 2 are sandwiched from both sides by an adhesive having a release paper, and Figures 4 1 to 6 are views of the capacitor built-in laminated busbar shown in Figure 1. 5 is a partial plan view showing the conduction structure between the strip conductor and the ceramic plate of a laminated bus bar with a built-in capacitor according to another embodiment of the present invention; FIG. 6 is an enlarged view of the Y-Y line in FIG. 5; A sectional view, FIG. 7 is a partial plan view showing another conductive structure, and FIG.
The figure is an enlarged sectional view taken along the Z-Z line in FIG. 7. 1, 2: band-shaped conductor, 3: ceramic plate, 4: insulating spacer, 5: insulating adhesive, 6: solder or solder cream, 7: insulating coating layer,
8: Release paper, 9: Hole, 10: Conductive member, 11: Notch, 12: Solder or solder cream.

Claims (1)

[Scope of utility model registration request] In a laminated bus bar for a circuit board, in which a plurality of band-shaped conductors each having a protruding terminal are laminated via an interlayer insulating material, and the exterior is insulated, the conductor is interposed between the interlayer insulating materials, and the above-described A large number of flat high dielectric chips having a width equal to or larger than the width of the strip conductor is provided, and when the width of the high dielectric chip is larger than the width of the strip conductor, each of these high dielectric chips is Conductive members are provided at the protruding portions of the strip-shaped conductor, or, if the width of the high dielectric chip is the same as the width of the strip-shaped conductor, at the notches or through holes provided in the strip-shaped conductor. 1. A multilayer bus bar with a built-in capacitor, characterized in that each high dielectric chip and a strip-shaped conductor are joined together.