JPS5874276A - Discharging device of liquid-like substance - Google Patents
Discharging device of liquid-like substanceInfo
- Publication number
- JPS5874276A JPS5874276A JP17146081A JP17146081A JPS5874276A JP S5874276 A JPS5874276 A JP S5874276A JP 17146081 A JP17146081 A JP 17146081A JP 17146081 A JP17146081 A JP 17146081A JP S5874276 A JPS5874276 A JP S5874276A
- Authority
- JP
- Japan
- Prior art keywords
- valve
- nozzle
- discharge
- liquid
- vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
１）発明の技術分野
この発明は溶剤または溶融材料等の液状体を微量でかつ
定量吐出させるための吐出装置の改良櫨二関する。この
発明で液状体と称するものは、例えば半導体装置の製造
４；おいて基板上に局部的に溶剤や解融はんだ等を微量
でかり定蓋設けるために用いる吐出装置から吐出させる
ものである。DETAILED DESCRIPTION OF THE INVENTION 1) Technical Field of the Invention The present invention relates to an improvement in a dispensing device for dispensing a small amount of a liquid material such as a solvent or a molten material at a constant rate. In this invention, what is referred to as a liquid substance is, for example, something that is discharged from a dispensing device used to locally deposit a small amount of a solvent, molten solder, etc. onto a substrate in the manufacture of semiconductor devices.
２）従来の技術
吐出装＠ｉ’ニーは例えば第１図纏二略図ｉ二よって示
される構造のものがある。図舊：おいて、（１）は敵状
体を容れる客器で、その下Ｗ６（＝弁座（２ａ）と存留
の上方から容器内を貫通させた弁棒（２ｂ）仁よって上
下動される弁（２ｃ）とを備え、弁の開放時間（上昇し
て弁座を埴れる時間）をコントロールするととによって
容器内に充填された液状体を、そのｎ１または容器の内
圧ζ二より所定量流下させる。また、前記弁座（２＆）
の下部には吐出ノズル（３）が設けられており、前記液
状体はこれから流下吐出される。2) Conventional technology There is a discharge device @i' knee having a structure as shown in FIG. 1, schematic diagram i2, for example. Figure: In the figure, (1) is a container that contains an enemy-like body, and it is moved up and down by the valve seat (2a) and the valve stem (2b) that penetrates the inside of the container from above. and a valve (2c) that controls the opening time of the valve (the time for it to rise and hit the valve seat). Also, the valve seat (2&)
A discharge nozzle (3) is provided at the bottom of the discharge nozzle (3), from which the liquid material is discharged downward.
なお、８ｔＩ記弁俸の上下動はソレノイドまたはエヤー
スピンドル（いずれも図示省略）等で駆動される。また
、弁の構造で弁棒を下げて弁を開くよう（＝シたものも
める。装置の吐出量は弁の開閉時間、ストローク菫およ
び吐出ノズルの孔径等によって調整される。The vertical movement of the 8tI valve is driven by a solenoid, an air spindle (both not shown), or the like. In addition, the structure of the valve is such that the valve stem is lowered to open the valve.The discharge amount of the device is adjusted by the opening/closing time of the valve, the stroke diameter, the diameter of the discharge nozzle, etc.
３）従来技術の間憩点
前項の装置は構造的にも簡単である上に吐出特性も比較
的賀定しておシ、吐出材料の種類、用途尋の利用軸回が
広いものであるが、吐出材料の物性、特感二比１、粘に
等によっては吐出切れが悪かつメジ、吐出時間が遅れた
り、ばらつきを生ずるなどの不都谷が生ずる。これは、
吐出材料の物性しよって吐出ノズルの先端に吐出材料が
付着し完全４二吐出されない現象が生ずるのが原因であ
る。3) Breaking points between conventional technologies The device described in the previous section is structurally simple and has relatively stable discharge characteristics, and can be used in a wide range of applications depending on the type of material to be discharged and the number of applications. However, depending on the physical properties, viscosity, etc. of the material to be discharged, disadvantages may occur such as poor or uneven discharge, delayed discharge time, or variations in discharge time. this is,
This is because the physical properties of the material to be discharged cause the material to adhere to the tip of the discharge nozzle, resulting in a phenomenon in which the material is not completely discharged.
４）発明の目的
上り己従来の装置の欠点を改良し良好表吐出特性な偏え
た吐出装置を提供する。4) The object of the invention is to improve the shortcomings of conventional devices and provide a biased discharge device with good surface discharge characteristics.
５）構成の要約
敵状物質を容れる容器と、前記容器の下部−二設けられ
た弁座および前記容器の上方から容器内を貫通させた弁
４ｓ４二よって上下動される弁からなる弁４ｍｍと、前
記弁座の下部（＝取着された吐出ノズ゛ルと、前記吐出
ノズルを同軸Ｃ：取り巻きかつこのノズルの吐出方向４
ニガスを一射する噴気ノズルと□
を具備する。5) Summary of the configuration: A 4mm valve consisting of a container containing a hostile substance, a valve seat provided at the bottom of the container, and a valve 4s4 that is moved up and down by a valve 4s4 that penetrates the inside of the container from above. , the lower part of the valve seat (= attached discharge nozzle and the discharge nozzle coaxially C: surrounding and discharging direction of this nozzle 4
Equipped with a blow nozzle and □ that shoot out a single blow of nitrogen gas.
６）災施例（構成、作用、効果）
第２図６＝示す（Ｉυは溶融はんだのような液状体を谷
れる容器で、その下部し弁座（２ａ）と容器の上方から
容器内を貫通させた弁棒（２ｂ）４二よって上下動され
る弁（２Ｃ）とを備え、さら（＝弁座の下部４二は吐出
ノズルａｊとこれを同軸（二取り巻きかつこのノズルの
吐出方向くニガスを噴射する噴気ノズルｕ１がるる。ｊ
ＦＭ己弁ｍ （２ｂ）はソレノイド、またはエヤースピ
ンドル（いずれも図示省略）等（二よってｍｄされる。6) Disaster Example (Structure, Function, Effect) Figure 2 6 = Shown (Iυ is a container that can hold liquid such as molten solder, and the valve seat (2a) and the inside of the container are inspected from above the valve seat (2a) and the container. It is equipped with a valve (2C) that is moved up and down by a valve rod (2b) 42 passed through it, and furthermore, the lower part 42 of the valve seat is coaxial with a discharge nozzle aj (two surrounding and in the discharge direction of this nozzle). Fumarole nozzle u1 that injects nitrogen gas is ruru.j
The FM self-valve m (2b) is md by a solenoid, an air spindle (both not shown), or the like.
でして装置の吐出量は弁の開閉時間、ストロークｊｔｉ
−よび吐出ノズルの孔１によって調歪６れるようになっ
ている。次鴫二前記吐出ノズル（１１を取り巻くこれと
同軸の噴気ノズル（１４は吐出終了と同時鴫；例えば窒
素ガス（？ｌ！融状態のはんだｔ醸化させないカス）を
軸方向−二噴射させ、そのガス苑圧（二より吐出の児了
を早める。ガスの噴射条件は弁の開閉条件や吐出ノズル
の寸法等と同様域＝吐出材料の？Ｊａ４：、よりきめら
れるが、弁の開閉等の動作と関係なく′１連続して、か
つ一定の流圧としてお、カニよ、坤”１゜、工、３イ、
２□ｈｂ＜−足の時間内毫ニー壷圧力のガス流を噴射さ
せる方法のいずれでもよい。上記２方法のうち前者は比
軟的低圧のガス流圧でよい場合、また、吐出材料が吐出
後の〆囲気な限定させる場合等は有効である。Therefore, the discharge amount of the device is determined by the opening/closing time of the valve and the stroke jti.
- and distortion 6 can be adjusted by the hole 1 of the discharge nozzle. Next, a jet nozzle coaxial with the discharge nozzle (11) surrounding the discharge nozzle (14 is at the same time as the discharge ends; for example, nitrogen gas (?l! molten solder scum) is injected in the axial direction, The gas pressure (2) accelerates the completion of discharge.The gas injection conditions are the same as the valve opening/closing conditions and the dimensions of the discharge nozzle. Irrespective of the movement, keep the flow pressure continuous and constant, crab, gon'1°, work, 3,
Any method of injecting a gas flow having a knee pot pressure within a time period of 2□hb<-leg may be used. Of the above two methods, the former is effective when a comparatively low gas flow pressure is sufficient, or when the material to be discharged is confined to a closed atmosphere after being discharged.
次鴫二後者の場合は比較的高圧のガス流でも動作が容易
で−あるが、ガス噴射を断続させるためのガス導入弁の
設置、吐出弁との連動設計等を要し装置がやや高価４二
つくので、吐出材料の物性、吐出量等用、途ｌ的鴫；よ
り使い分ける。In the latter case, it is easy to operate even with a relatively high-pressure gas flow, but it requires installation of a gas introduction valve to intermittent gas injection, interlocking design with a discharge valve, etc., and the equipment is somewhat expensive4. Since there are two types, they can be used depending on the physical properties of the material to be discharged, the amount of discharge, etc.
叔上の如く、半導体装置の組立しおける半導体ペレット
のボンディングや、電子部品の組立しおける部品のボン
デインカニ微量でかつその量が厳密４ニ一定であること
を要求されるもの６二対し満足できる性能を示す。As mentioned above, the bonding of semiconductor pellets in the pre-assembly of semiconductor devices and the bonding of parts in the pre-assembly of electronic parts has satisfactory performance for bonding of small amounts of bonding particles in pre-assembled electronic parts, which requires the amount to be strictly constant. shows.
７）発明の効果
液状の材料で、特（二粘性の高いものを微量でかつ一短
（二吐出させる点で半導体装置等の一造ζ：顕著な幼果
がある。7) Effects of the invention A liquid material, which is particularly highly viscous, can be discharged in a small amount and has a disadvantage in that it can be used for semiconductor devices, etc.: It has remarkable young fruit.
第１図は従来の吐出装置、弗２図はこの発明の１実施例
の吐出装置のいずれも断面図である。
２ａ・・・弁座 ２ｂ・・・弁棒２ｃ −弁
１１・・・容器１３・・・吐出ノズル
１４・・・噴気ノズル第１図FIG. 1 is a sectional view of a conventional discharging device, and FIG. 2 is a sectional view of a discharging device according to an embodiment of the present invention. 2a... Valve seat 2b... Valve rod 2c - Valve 11... Container 13... Discharge nozzle
14... Fumarole nozzle Figure 1
Claims (1)
８１！ｌＸを容れる容器と、前記容器の下部噛二設けら
れた弁座および前記容器の上方から容器内を貫通させた
弁棒（＝よって上下動される弁からなる弁機構と、前記
弁座の下部に取着された吐出ノズルと、前記吐出ノズル
を同軸に取９巻きかつこのノズルの吐出方向にガスを噴
射する噴気ノズルとを共軸した液状体の吐出装置。In a device for discharging a liquid in predetermined amounts, a liquid 11
81! A valve mechanism consisting of a container containing lX, a valve seat provided at the bottom of the container, and a valve rod (=a valve that is moved up and down) passing through the container from above the container, and the bottom of the valve seat. A liquid material discharging device comprising a coaxial discharge nozzle attached to the discharge nozzle and a jet nozzle which has nine turns coaxially surrounding the discharge nozzle and injects gas in the discharge direction of the nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17146081A JPS5874276A (en) | 1981-10-28 | 1981-10-28 | Discharging device of liquid-like substance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17146081A JPS5874276A (en) | 1981-10-28 | 1981-10-28 | Discharging device of liquid-like substance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5874276A true JPS5874276A (en) | 1983-05-04 |
Family
ID=15923512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17146081A Pending JPS5874276A (en) | 1981-10-28 | 1981-10-28 | Discharging device of liquid-like substance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874276A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102363U (en) * | 1984-12-05 | 1986-06-30 | ||
| FR2670505A1 (en) * | 1990-12-17 | 1992-06-19 | Solems Sa | METHOD AND APPARATUS FOR SUPPLYING A METALLIC COMPOUND MADE OF A SUBSTRATE. |
| WO2013157226A1 (en) * | 2012-04-18 | 2013-10-24 | 株式会社デンソー | Solder supply device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4424189Y1 (en) * | 1968-03-22 | 1969-10-13 |
-
1981
- 1981-10-28 JP JP17146081A patent/JPS5874276A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4424189Y1 (en) * | 1968-03-22 | 1969-10-13 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102363U (en) * | 1984-12-05 | 1986-06-30 | ||
| FR2670505A1 (en) * | 1990-12-17 | 1992-06-19 | Solems Sa | METHOD AND APPARATUS FOR SUPPLYING A METALLIC COMPOUND MADE OF A SUBSTRATE. |
| WO2013157226A1 (en) * | 2012-04-18 | 2013-10-24 | 株式会社デンソー | Solder supply device |
| JP2013220460A (en) * | 2012-04-18 | 2013-10-28 | Denso Corp | Solder supply device |
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