JPS5873184A - Method of machining substrate mask - Google Patents
Method of machining substrate maskInfo
- Publication number
- JPS5873184A JPS5873184A JP17193781A JP17193781A JPS5873184A JP S5873184 A JPS5873184 A JP S5873184A JP 17193781 A JP17193781 A JP 17193781A JP 17193781 A JP17193781 A JP 17193781A JP S5873184 A JPS5873184 A JP S5873184A
- Authority
- JP
- Japan
- Prior art keywords
- resist ink
- mask
- board
- land
- substrate mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はプリント配線基板にソルダーレジストインキを
塗布する際に基板上のランド部をマスキングする基板マ
スク加工法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a substrate mask processing method for masking land portions on a printed wiring board when applying solder resist ink to the printed wiring board.
従来このようなソルダーレジストインキｌ５ＩＦＩのラ
ンド部のマスキングは一般にスクリーン印刷のような印
Ｉσ１ｊ法を用いて行なってｔｎたが、このような方杖
でにレジストインキがずれて印刷される恐れがあり、こ
のずれを微少にするためには高度な技術が必要となり、
さらにこの場合フィルムや版を製作しなければならな力
為った。Conventionally, masking of the land portion of the solder resist ink 15IFI was generally performed using a mark Iσ1j method such as screen printing, but there was a risk that the resist ink would be printed out of alignment with this method. , advanced technology is required to minimize this deviation.
Furthermore, in this case, it was necessary to produce films and plates.
本発明はこのような点に鑑みなされたものであり、基板
上にソルダーレジストインキを簡単な方法で塗布するこ
とができ、且つフィルムや版を用すずに確実にランド部
をマスキングすることができる基板マスク加工法を提供
するものである。The present invention has been developed in view of these points, and it is possible to apply solder resist ink onto a substrate in a simple manner, and also to reliably mask the land portions without using a film or a plate. A substrate mask processing method is provided.
以下図面に示す実施例とともに本発明を説明する。The present invention will be described below with reference to embodiments shown in the drawings.
ここでは１ず第１図に示すように表面に所望のパターン
に銅箔１がプリント配線されるとともに銅箔ｌの一部で
ある各ランド部１′に予め端子挿入用の透孔２が穿設さ
れたプリント配線基板３を準備する。そして第２図に示
すように各ランド１′の透孔２の上に弾性変形を生じ易
−ゴム球４をそれぞれ載置する。次に、真空ポンプ等を
用−て基板３の裏面より透孔２を通してゴム球４を吸引
する。このときゴム球４は第３図に示すように扁平に弾
性変形を生じランド部１′に吸着される。そしてこのゴ
ム球４が吸着された状態でスプレーを用いて基板ｌの表
面にソルダーレジストインキ５を噴霧する。然る後にゴ
ム球４の吸引を停止しゴム球を取除けば、このとき第５
図に示すように、ランド部１′を除く表面にソルダーレ
ジストインキ５が塗布された基板３が得られる。First, as shown in Figure 1, a copper foil 1 is printed on the surface in a desired pattern, and a through hole 2 for terminal insertion is pre-drilled in each land portion 1' which is a part of the copper foil 1. The installed printed wiring board 3 is prepared. Then, as shown in FIG. 2, a rubber ball 4, which is susceptible to elastic deformation, is placed on the through hole 2 of each land 1'. Next, the rubber balls 4 are sucked from the back side of the substrate 3 through the through holes 2 using a vacuum pump or the like. At this time, the rubber ball 4 is elastically deformed into a flat shape as shown in FIG. 3, and is attracted to the land portion 1'. Then, with the rubber balls 4 adsorbed, solder resist ink 5 is sprayed onto the surface of the substrate 1 using a sprayer. After that, if the suction of the rubber ball 4 is stopped and the rubber ball is removed, the fifth
As shown in the figure, a substrate 3 is obtained, the surface of which is coated with solder resist ink 5 except for land portions 1'.
なお、上記実施例では基板上の各ランド部１′にゴム球
４を吸着した状態で基板表面にソルダーレジストインキ
５をスプレー噴射しているが、ゴム球４の代りに各ラン
ド部１′の透孔２に傘状のピンを差込んだ状態でソルダ
ーレジストインキをスプレー噴射するようにしてもよい
。In the above embodiment, the solder resist ink 5 is sprayed onto the surface of the board with the rubber balls 4 adsorbed on each land 1' on the board. The solder resist ink may be sprayed while an umbrella-shaped pin is inserted into the through hole 2.
本発明によれば、上記のようにプリント配線基板上の各
ランド部にゴム′ｆ＄或いは傘状ビンのようなマスク材
を被着しだ状態で基板表面にソルダーレジストインキを
スプレー噴射することによってレジストインキを塗布し
ているため、従来のスクリーン印刷法のような特殊なフ
ィルムや版を必要とせず、またレジストインキがずれた
状態で塗布されることはなく、ランド部はレジストイン
キから確実に保護される。According to the present invention, as described above, the solder resist ink is sprayed onto the surface of the printed circuit board while a mask material such as rubber or umbrella bottle is applied to each land portion on the printed wiring board. Since the resist ink is applied using the traditional screen printing method, there is no need for special films or plates like in conventional screen printing methods, and the resist ink is not applied in a misaligned manner, making it possible to ensure that the land areas are covered with the resist ink. protected.
第１図乃至第５図は本発明の加工法の１実施例］を説明
するだめの工程断面図である。
１′ ・・・ランド部、 ２・・・透孔、 ３・・
・プリント４線基板、 ４・・・ゴム球、 ５・・
・ソルり９−レジストインキ
代理人 弁理士 福 士 愛 彦
３1 to 5 are process cross-sectional views for explaining one embodiment of the processing method of the present invention. 1'...Land part, 2...Through hole, 3...
・Printed 4-wire board, 4...Rubber bulb, 5...
・Soluri 9-Resist ink agent Patent attorney Aihiko Fukushi 3
Claims (1)
着した状態で基板表面にツルグーレジストインキをスプ
レー噴射することによってレジストインキを塗布するこ
とを特徴とする基板マスク加工法。 ２、 前記マスク材としてゴム球を用ｂ１このゴム球を
各ランド部に吸着させるようにした前記特許請求の範囲
１記載の基板マスク加工法。[Scope of Claims] 1. A board mask characterized in that resist ink is applied by spraying Tsurugo resist ink onto the surface of the board while a mask material is applied to each land portion on the printed wiring board. Processing method. 2. The substrate mask processing method according to claim 1, wherein rubber balls are used as the mask material, and the rubber balls are adsorbed to each land portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17193781A JPS5873184A (en) | 1981-10-26 | 1981-10-26 | Method of machining substrate mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17193781A JPS5873184A (en) | 1981-10-26 | 1981-10-26 | Method of machining substrate mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5873184A true JPS5873184A (en) | 1983-05-02 |
Family
ID=15932586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17193781A Pending JPS5873184A (en) | 1981-10-26 | 1981-10-26 | Method of machining substrate mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5873184A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154152A (en) * | 1984-12-21 | 1986-07-12 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | Housing for electronic apparatus |
-
1981
- 1981-10-26 JP JP17193781A patent/JPS5873184A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154152A (en) * | 1984-12-21 | 1986-07-12 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | Housing for electronic apparatus |
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