JPS5873182A - Printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a 7-lint wiring board used in electronic equipment 1.

(2) Background of Gikon Electronic devices such as computers are becoming smaller and more diverse as semi-integrated integrated circuit devices (devices) become more densely packed. Printed wiring boards disposed in electronic equipment and on which electronic components of the semiconductor integrated circuit device are mounted are also required to realize higher density wiring.

(3) Conventional technology philosophy and problems In order to increase the density of wiring in such printed wiring boards, multilayering is performed, and the wiring formed on the inner layer of the printed wiring board is provided on the surface layer of the printed wiring board. It is electrically led out to the conductor land.

Therefore, in such a multilayer printed wiring board system, a large number of conductor lands are provided on the surface layer printed wiring board.

For this reason, when mounting electronic components or connecting lead wires to the conductor lands arranged on such surface-layer printed wiring boards, it becomes difficult to identify the conductor lands to be connected. The workability of mounting components or connecting lead wires has tended to deteriorate.Therefore, as a means of indicating the level compensation of the conductor land, as shown in FIG. A method of printing a number 13 or a symbol 14 near a predetermined number of conductor lands among a plurality of conductor lands 12 arranged in a matrix by, for example, a screen printing method to indicate the coordinate position of the conductor land. is taken. Note that 12' is a through hole.

However, displaying coordinate positions using such ink using the Inkuri method requires an increase in the number of steps because the formation of the conductor land and the printing of numbers or symbols indicating the coordinate positions are performed in separate processes. However, it is difficult to align the conductor land with the numbers or symbols indicating the coordinate position, and the ink may adhere to the conductor land or penetrate into the through hole provided in the conductor land, causing the conductor land to become damaged. There have been problems such as making it difficult to connect electronic components or lead wires to the device.

(4) Purpose of the invention The present invention eliminates the drawbacks of the conventional art,
The present invention aims to provide a configuration that can clearly indicate the coordinate position of a conductor land arranged on a printed wiring board.

(5) Structure of the Invention Therefore, according to the present invention, in a printed wiring board in which a plurality of conductor lands are arranged on the surface of an insulating substrate, a desired conductor land among the plurality of conductor lands has a shape that is It is intended that a printed wiring board is provided which is made to be different from other conductor lands and has a letter or I symbol attached within the conductor land to indicate its position.

(6) Examples of the invention The present invention will be explained in detail below using examples.

2 and 3 show the printed wiring board according to the present invention.
! Indicates I4 failure◎ In the figure, 21 is an insulating substrate, 22 is the insulating substrate 21
A conductor land 23 provided on the surface of the conductor land 22 is a through hole for interlayer connection provided in the conductor land 22.

Misfire Qi41 Accordingly, in the arrangement of the conductor lands 22, the shape of the damaged conductor land at a predetermined position is made different from the other conductor lands (Fig. 2), or characters or letters are written in the conductor land at the predetermined position. Draw symbols, etc. (Figure 3).

The embodiment shown in FIG. 2 shows an example in which the shape of the conductor lands 24Q) is changed every three in the X direction and the Y direction among the conductor lands arranged in a matrix. That is, while a standard conductor land has a circular shape, a conductor land serving as an index is rectangular or polygonal and indicates the coordinate position of the conductor land array.

Further, in the embodiment shown in FIG. 3, among the conductor lands 25 arranged in a matrix, characters, for example, alphabets, are drawn on the conductor lands at every third position in the X direction. . In other words, while a standard conductor land is circular, the index conductor run 1° has A,
A letter symbol such as B is drawn to indicate the coordinate position of such conductor land array.

Changing the shape of the conductor land or adding letters to the conductor land in this way is done when the conductor land is formed by photo-etching a conductor layer such as steel foil formed on the surface of the insulating substrate. - By making the pattern drawn on the resist layer into a desired shape, it is possible to form a pattern indicating the position of a predetermined conductor land without causing the formation of such conductor turns.

In the above embodiment, the case where the shape of the conductor land is changed and the case where characters and symbols are added to the conductor land are shown separately, but the present invention is not limited to this, and both implementations are shown separately. Of course, examples may be combined.

[Brief explanation of the drawing]

fit<1 Figure is a plan view showing the position of the conductor land on a conventional printed wiring board (display w4 configuration), and Figures 2 and 3 are plan views showing the position display configuration of the conductor land on the printed wiring board according to the present invention. be. In the figure, 11.21...Insulating substrate 12.22...
Conductor lands 12', 23... Through holes 24, 25... Conductor land ears according to the present invention 2 Figure

Claims (1)

[Claims] In a printed wiring board in which a plurality of conductor lands are arranged on the surface of an insulating substrate, a desired conductor land among the plurality of conductor lands has a shape different from that of other conductor lands and/or a conductor land having a shape different from that of the other conductor lands. A printed wiring board that is patented in that it is marked with an inner I character or a 4 symbol to indicate its position.