JPS5868998A - Method of forming printed wire - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing printed wiring using a porcelain substrate and using the sandblasting method. A concave groove that matches the printed circuit wiring is formed by spraying abrasive particles, and the concave groove is baked at P, +2 degrees Celsius before baking, and the groove is filled with silver or other metal. The method is characterized in that it is filled with electrical metal paste and fixed by baking, which minimizes the amount of electrically conductive metal paste used.Moreover, the printed wiring does not protrude from the surface of the porcelain board, and the printing method allows precision printing. It is also intended to be firmly fixed.

Conventional lint wiring involves forming a conductive metal film tightly covering the required upper surface of an insulating plate, and then dissolving and removing the metal film, leaving the wiring area, or printing the conductive wiring. In any case, the printed wiring is formed on the surface of the insulating board. It was not easy to pudding it, unless it was fixed on an insulating plate by applying a process.

According to the present invention, the depth of grooves formed on the surface of a magnetic substrate formed by sandblasting with abrasive particles can be freely adjusted to eliminate roughness and defects.

An embodiment of the method of the present invention will be described with reference to the accompanying drawings.

In the figure, l is an alumina porcelain substrate formed into a desired area by baking, and as shown in 2rA, an unexposed photosensitive resin film is formed on the entire surface by coating, and on that surface. Using the original diagram 3 that depicts the wiring diagram q of the printed circuit, as shown in Figure 3, apply exposure light f's such as a quartz lamp to perform exposure printing, wash it with water, and make the cured resin exposed to the light. The sandblasting protective film 6 is washed off, leaving the part that has not been cured due to the wiring diagram not allowing the exposure light s to pass through (Fig. q), and after drying, abrasive particles are applied by sandblasting. The alumina porcelain substrate/
A concave groove // is formed on the surface (Fig. S).

Next, remove the sandblasting protective film 6 as shown in Fig. 6, apply a generous amount of silver paste lλ on the surface of the alumina porcelain substrate, fill in the groove 7 with a doctor blade 3, and fill the groove 7 with a silver paste saw. The silver paste /, 2 is removed from the surface of the alumina porcelain substrate l other than the structure /1, and further, baking is performed at a temperature where only silver remains to fix the printed wiring /17 by baking to obtain the product IS.

For alumina porcelain substrates, grooves l/ can be formed by sandblasting on the material before baking.

J In that case, apply a photosensitive resin coating to the mount -I-,
The original drawing 3 showing the wiring diagram q was applied, and the sandblasting protective film 6 exposed to the exposure light beam S was pasted on the alumina porcelain fabric together with the backing paper, the backing paper was removed, and then the abrasive particles Ir were completely sprayed and the concave @l It is also possible to perform yakijime after it has been formed into human blood. Furthermore, the sandblasting protective film 6 formed on the above-mentioned mount can also be attached to a baked alumina porcelain substrate. A sandblasted protective coating with a backing may use a backing that is rapidly destroyed by blasting with abrasive particles to prevent stripping of the backing.

The alumina ceramic substrate can be replaced with other insulating ceramic substrates. The silver paste can also be replaced with other conductive metal pastes. Here, the conductive gold P, G paste is a metal oxide ingot kneaded into a paste, which is a fine metal powder, and is of the same type as those used in ceramic painting materials, printing inks, paints, and the like.

As clarified from the above explanation, the method of the present invention does not involve transferring a conductive metal paste to the surface of a ceramic substrate by means such as printing, but printing by spraying abrasive particles onto the surface of the substrate by sandblasting. Wiring O,: A matching groove is formed, and a conductive metal paste 12 is placed in the groove.
It is a product that is filled with and baked, and is printed! '／ψ
The thickness of the material can be arbitrarily determined by the pressure of spraying the abrasive particles or the hardness, etc., and it can have a conductive capacity proportional to the depth of the concave groove/l, so it lowers the resistance and does not generate heat. In addition, by forming the concave groove /l by sandblasting, it is possible to determine various conditions regarding the conductivity of the printed wiring, and to simplify the formation of the printed wiring /<() to create it accurately and robustly. Furthermore, it can be adapted to both mass production and small quantity production.

[Brief explanation of drawings]

The attached drawings are process diagrams showing an example of implementing the present invention,
Figure 1 is a cross-sectional view of the ceramic substrate, Figures 1 to q are cross-sectional views showing an example of forming a sandblasting protective film, Figure 5 is a cross-sectional view showing the formation of grooves //, and Figure 6 is a conductive FIG. 7 is a cross-sectional view of the process of embedding the metal paste into the groove //, and FIG. 7 is a cross-sectional view of the product. 41 → Porcelain substrate, 6 → Sandblasting protective film,
7-・Through hole, r→abrasive particle, 7/→four grooves, /ko→silver (4
Electrical Metal) Paste Applicant Kei Goto 311 Seedling 2 Figure 1is- ,,/ Do: 7th pot 1 4-ni'-

Claims (1)

[Claims] Before or after baking, abrasive particles are sprayed onto the surface of the porcelain substrate using a sandblasting method to form grooves that match the printed circuit wiring. A method of creating printed wiring characterized by filling the groove with silver or other conductive metal paste and fixing it by baking.