JPS586785A - Laser machining device - Google Patents

Abstract

PURPOSE:To perform accurate laser machining automatically by measuring the quantity of the measuring light passing through the machined hole during working, discriminating said quantity of comparison with a reference value and controlling laser irradiating pulses. CONSTITUTION:A laser machining device is constituted of the 1st pulse laser oscillator 1 which machines a hole in the work 6, the optical axes L1, L2 of the oscillator 1 which measure the hole diameter of the hole 6a machined in the work 6, the 2nd laser oscillator 8 for measurement disposed on the optical axis, and photodetecting parts 3, 4 which detect the laser outputted from said oscillator and passed through the hole 6a. The total quantity of the laser outputted from the oscillator 8 and the quantity value of the light passed through the hole 6a operated with a controller 14, and the pulse oscillation of the oscillator 1 is controlled by the operated signals.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a Rade processing apparatus that controls a Rade oscillator by measuring the amount of light proportional to the area of the hole during drilling of a workpiece.

In drilling using a drill bit, it is difficult to always obtain a predetermined shape and size because the drilling is discontinuous. Therefore, in order to make the hole to be machined with a Rede into a predetermined shape as much as possible, there is a Rede machining machine disclosed in Japanese Patent No. 868892. The processing radar and measurement light are placed on the same axis, and the measurement light passes through the processing hole during processing, and the measurement light is detected based on the amount detected per unit time. This is a device that performs drilling by controlling the energy of However, this processing machine has some deficiencies. In a normal Rade processing machine, the Rade light output from the Rade oscillator is focused onto the workpiece using a condensing lens. If this occurs and adheres to the condensing lens, it will partially block the processing window and may damage the lens. A protective glass is inserted to protect the lens, but the above-mentioned flying objects end up adhering to the protective glass.

This is the same as part of the measurement light being blocked, and as a result, the amount of light passing through the machined hole is also attenuated by that amount. In other words, the attenuation of the detected amount means that it is always difficult to process into a predetermined shape.

Energy is also a superimposed element for controlling the processing radar, but this is insufficient. This is because, in the case of crus machining, the effect on the hole diameter for each 1/4 lus is very discontinuous, and normally if the number of lugs is increased, the diameter will increase accordingly, but in the above machining, In particular, the melt is divided into both the removed material and the melted material, which may also occur if the machining hole is prevented. Therefore, if the energy is controlled, the hole will be prevented from collapsing before reaching a predetermined dimension during machining, and the energy will be increased, and the machining amount in the next pulse will be the same as that of the previous machining. be larger than the quantity. That is, since the amount of change in the hole diameter of 1/9 Lus becomes large, it is not suitable for finishing to a predetermined size.

This invention was made in view of the above circumstances, and its purpose is to measure the amount of measurement light passing through the processed hole during processing, compare the amount with a reference value, and determine the amount of measurement light that passes through the hole. It is an object of the present invention to provide a radar machining device that can perform radar machining with less variation in machined holes by controlling the base radius.

The present invention will be described below based on an embodiment shown in the drawings. 1 in Fig. 1 is the first pulse Radhe oscillator, which has a Radhe power supply of 2Kg1! ! It is continued.

A dichroic mirror 3 is provided on the optical path of the 9-Russlede light L1 oscillated from the first /#Russlede oscillator 1, and reflects the /4 Russlede light L1, condenses it, and enters the lens 4. There is. This condensing lens 4
The front part of the is kept! It, y TS 5 is provided, and the nine-pulse Raded light L4 is collected by the condensing lens 4 and held 1lif.
The beam passes through the lath 5 and is irradiated onto the workpiece 6.

Further, a detection switch 7 for detecting the presence or absence of the workpiece 6 is provided at the location where the workpiece is installed. Furthermore, 8I
The Rade light emitted from the second measuring Rade oscillator is reflected by mirrors 9 and 10, and is incident on the opposite side of the workpiece to the processing side. When the machined hole 6a of the workpiece C penetrates, this radar light Lm passes through the machined hole Ca of the workpiece 6, the 1ml glass 5, the condenser lens 4, and the gicroic mirror 3. Then, the reflecting mirror 1 is
2. The light started to come in. This reflected light 2-is reflects the radar light and enters the sensor IJ, which is a light receiving section, and the amount of light at that time is input to the control device 14. This control device 14 is provided with a light amount signal processing circuit 16 that is activated by a signal from a start signal generator 15, and this light amount signal processing circuit 16 includes a detection switch that is activated when the workpiece 6 is removed. 7, the radar light L3 from the second measurement laser oscillator 8
The total amount of light is input and held. Then, this total light quantity value passes through the machined hole 6a of the workpiece 6, and is totally divided by the original quantity value of the dimensional measurement source. Further, this light amount signal processing circuit 16 is connected to a comparison circuit 18 via a delay circuit 17t, and this comparison circuit 18 compares the value X of the above calculation result with a base corresponding value that can be arbitrarily set. , x < y, a NO signal is obtained,
On the contrary, X≧y'? 'Complete ES signal can now be obtained. Then, this NO signal is directly sent to the radar trigger control circuit 19, and the YIC8 signal is sent to the radar trigger control circuit 19 by the strag signal generator 20.
9 and is configured to switch the radar power supply 2 from ON to OFF.

Next, the operation of the radar processing apparatus configured as described above will be explained. First, when the workpiece 6 is removed from its set position, the detection switch 1 is activated and the signal is input to the start signal generator 15. Therefore, the Raded light Lsld mirror 9, 1o from the Raded oscillator 8 for measurement in Series 2
Through the protective glass 5, condensing lens, e4, make Roy,
Mirror 3, intermediate lens 10f: Transmission, reflection Mi = -x
It enters the sensor quantity 13 via xt-.

Therefore, the total amount of light at this time, that is, the Rade light from the jig 2 measuring Rade oscillator I, is held in the light amount signal processing circuit 16. Next, workpiece 6
is set and the first ΔRusslede oscillator 1t oscillates, the pulsed light L1 is reflected by the microscopic mirrors 2 and 3, further condensed by the condensing lens 4, and then transmitted through the laser beam 5 to the workpiece 6. is irradiated. At this time, the measurement radar light L3 is shunted by the workpiece C, and the sensor? Although not incident on JJ, the processed hole 6& is formed in the workpiece C by the pulsed Raded light L1 for processing &'
and enters the sensor 13 through the nine optical paths described above.

Therefore, the light amount signal processing circuit 16 divides the already held total light amount value M and the measured light amount value B that has passed through the processed hole 6hf, and obtains the value X as a calculation result by B/A. This O@x is input to a comparison circuit 18 via a delay circuit 17, and the comparison circuit 18 compares it with a reference value y that can be set arbitrarily. That is, when the radar processing has not been performed yet, the BO value is O and the value X of the calculation result is also 0. The condition judgment of this comparison circuit 18 is that when x<y, N
If the signal from the comparator circuit 18 is NO, the radar trigger control circuit 19 is turned on from the normal OFF state.
9, a /4 Lusslede light t1t is oscillated from the jlIl pulse Raded oscillator 1 via a Raded power supply 2t to perform Raded processing. Then, when the radar processing progresses and X≧y, and the signal from the comparator circuit 18 becomes YES, a stop signal is obtained from the strag signal emitter 2o and input to the radar trigger control circuit J9. Next, this radar trigger control circuit 111FiO
When the switch changes from N to OFF, radar oscillation stops. In this way, the radar machining cycle is continued until the machined hole 6a of the workpiece 6 reaches a predetermined hole diameter, and when the hole diameter reaches the set value or more, the radar oscillation is stopped and the radar By completing the machining, it is possible to obtain a machined hole 61'' with no variation in hole diameter.

FIG. 2 shows variations in hole diameter between conventional machining and machining according to the present invention, with the horizontal axis representing the large diameter and the vertical axis representing the number of holes. In the case of conventional machining, as shown by the broken line, under certain appropriate conditions, a Gaussian distribution is formed in which the target hole diameter (9mm #f30μmm) is the most common. However, in the case of the processing according to the present invention, as shown by the solid line, the narrow distribution, that is, the dimensional variation can be significantly reduced.

In addition, if scattered objects generated during processing adhere to the processing optical system, especially the S-glass, and the light intensity of the rainbow measurement light is attenuated, the apparent hole diameter will decrease, making it difficult to judge the abnormal hole diameter. However, in this invention, since the total light amount value M is divided by the measured light amount value B, if the total light amount value M is attenuated by 10% at -XIO, the measured value B will also be It can be seen that it is attenuated by 10 cm, and the other party's attenuation ratio is exactly the same. In order to minimize the impact on the hole diameter measurement due to temporal fluctuations in the measurement light and the adhesion of scattered objects to the optical system, precision machining is performed.
, the hole diameter can be determined automatically. In addition, by delaying the time of judgment in the comparison circuit from the time of Rade oscillation, stable machining and hole diameter measurement can be achieved because the large diameter is less susceptible to the effects of scattered objects after machining or changes in the molten part of the machined hole. can be done.

As explained above, according to the present invention, the pulse oscillation of the pulse slave oscillator for processing is controlled by a signal obtained by calculating the total light amount value of the radar light for measurement and the value of the light amount □ that has passed through the processing hole. Therefore, it is possible to automatically perform accurate radar machining with little variation in hole diameter.

[Brief explanation of the drawing]

FIG. 1g1 is a schematic diagram of a RADE machining apparatus showing an embodiment of the present invention, and FIG. 2 is a graph diagram showing the distribution of machined hole diameters between the conventional method and the present invention. DESCRIPTION OF SYMBOLS 1... First / arm Slade oscillator, 6... Workpiece, 6a... Machining hole, 8... Second measurement Rade oscillator, JJ-... Senna (light receiving section), 14...control device. Applicant's agent Patent attorney Takehiko Suzue Figure 1, 2m! ! 1

Claims (2)

[Claims] (1) Jllll's pulsed oscillator for drilling the workpiece, and the 20th column arranged coaxially with the optical axis of the 1st o/f Ruthlede oscillator for measuring the hole diameter of the machined hole in the workpiece. The standard radar oscillator and this 20th
In a Rade processing device equipped with a light receiving unit that receives light outputted from a measurement Rade oscillator and passed through a processing hole in the Rade, the total light amount value of the 9 Rade light output from the 112 measurement Rade oscillator and the processing hole are determined. A Raded processing apparatus comprising: a control device for controlling pulse oscillation of the pulse Raded oscillator of j[1 by a signal calculated from a value of the amount of light passing through the Raded oscillator. (2) The Raded processing apparatus according to claim 1, characterized in that the control device is synchronized with the first pulsed Raded oscillator and delayed by an arbitrary amount of time.