JPS63108980A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPS63108980A
JPS63108980A JP61252940A JP25294086A JPS63108980A JP S63108980 A JPS63108980 A JP S63108980A JP 61252940 A JP61252940 A JP 61252940A JP 25294086 A JP25294086 A JP 25294086A JP S63108980 A JPS63108980 A JP S63108980A
Authority
JP
Japan
Prior art keywords
laser
workpiece
laser beam
piercing
machined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61252940A
Other languages
Japanese (ja)
Inventor
Shigehiro Yoshiyasu
吉安 重宏
Masaru Kaneoka
優 金岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61252940A priority Critical patent/JPS63108980A/en
Publication of JPS63108980A publication Critical patent/JPS63108980A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To perform the certain laser beam machining by detecting photodetected light at the same time when the piercing of an object to be machined is finished by an optical sensor provided to the lower part to be machined of the object to be machined and controlling the irradiation of laser light based on this result. CONSTITUTION:When the laser light 21 is penetrated through the object 7 to be machined, the optical sensor 5 detects it. An RS flip-flop 6 is made in a reset state and the piercing time is automatically adjusted and the object to be machined is progressed to a next machining step by a detected signal from the optical sensor 5. The certain machining can be performed and a melting loss of a machining table can be prevented by the machine with this constitution.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は被加工物をレーザ光にて切断加工するレーザ
加工装置に関し、特に被加工物のピアッシング終了によ
る貫通したレーザ光を検知することができるレーザ加工
装置に関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a laser processing device that cuts a workpiece with a laser beam, and in particular is capable of detecting the laser beam that penetrates the workpiece when piercing is completed. This article relates to laser processing equipment that can be used.

〔従来の技術〕[Conventional technology]

この種の従来のレーザ加工装置として第2図に概略構成
図として示すものがあった。同図において従来レーザ加
工装置はレーザ加工を数値データにて制御する数値制御
部(1)と、該数値制御部(1)の数値制御動作に基づ
いてレーザ光(21)を発振するレーザ発振部(2)と
、該レーザ発振部(2)にて発振されたレーザ光(21
)を所定の方向に屈折して導く反射ミラー(3)と、該
反射ミラー(3)の屈折導出動作によるレーザ光(21
)が導入され、該レーザ光を被加工物(7)上に集光調
整する加工ヘッド(4)と、該加工ヘッド(4)にて集
光されたレーザ光(21)にて加工される被加工物(7
)を載置する加工テーブル(8)とを備える構成である
As a conventional laser processing apparatus of this type, there is one shown as a schematic configuration diagram in FIG. In the figure, a conventional laser processing device includes a numerical control section (1) that controls laser processing using numerical data, and a laser oscillation section that oscillates a laser beam (21) based on the numerical control operation of the numerical control section (1). (2) and the laser beam (21
) is refracted and guided in a predetermined direction, and a laser beam (21
) is introduced, a processing head (4) adjusts the focusing of the laser beam onto the workpiece (7), and processing is performed using the laser beam (21) focused by the processing head (4). Workpiece (7
) on which the processing table (8) is placed.

上記構成に基づ〈従来装置の動作について説明する。ま
ず数値制御部(1)の数値データに基づいてレーザ発振
部(2)のレーザ光(21)を発振する。
Based on the above configuration, the operation of the conventional device will be explained. First, the laser beam (21) of the laser oscillation section (2) is oscillated based on the numerical data of the numerical control section (1).

このレーザ発振部(2)から出たレーザ光(21)は、
反射ミラー(3)で折り返されて加工ヘッド(4)内の
加工レンズ(41)まで伝送する。そして加工レンズ(
41)によってレーザ光(21)を集光させる。
The laser light (21) emitted from this laser oscillation unit (2) is
It is reflected by a reflecting mirror (3) and transmitted to a processing lens (41) in a processing head (4). And processed lenses (
41) to focus the laser beam (21).

一方、加工テーブル(8)に設けられた剣山ビン(81
)上に被加工物(ワーク)(7)をtiして、上記加工
レンズ(41)によって集光されたレーザ光(21)の
焦点を被加工物(7)の表面に合わせかつ、補助ガス(
42)を供給することによって被加工物(7)の加工を
行う。
On the other hand, the Kenzan bottle (81) installed on the processing table (8)
) on the workpiece (7), the focus of the laser beam (21) focused by the processing lens (41) is focused on the surface of the workpiece (7), and the auxiliary gas is (
42), the workpiece (7) is processed.

ここで、被加工物(7)を切断加工する場合、まず加工
レンズ(41)によって集光されたレーザ光(21)が
被加工物(7)を貫通しなければならない。
Here, when cutting the workpiece (7), the laser beam (21) focused by the processing lens (41) must first penetrate the workpiece (7).

そこでレーザ光(21)が被加工物(7)を貫通するの
に要する時間、即ちピアッシング時間を予め数値制井部
(1)に入力して、この入力されて指定されたビアフシ
ング時間を経て、加工ヘッド(4)あるいは加工テーブ
ル(7)を移動させることによって切断加工をすること
ができる。
Therefore, the time required for the laser beam (21) to penetrate the workpiece (7), that is, the piercing time, is input in advance into the numerical control well section (1), and after the input and designated via-fusing time, Cutting can be performed by moving the processing head (4) or processing table (7).

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のレーザ加工装置は以上のように構成されていたの
で、被加工物の板厚・材質等を考慮してピアッシング時
間を予め設定して数値制御部に入力する必要があり、特
にピアッシング時間の設定誤りにより加工テーブルの底
板を溶かしてしまい、また被加工物を貫通しないで実加
工を開始すると被加工物のバーニング(爆発)が生じる
等の問題点を有していた。
Conventional laser processing equipment was configured as described above, so it was necessary to set the piercing time in advance, taking into account the thickness and material of the workpiece, and input it to the numerical control unit. There have been problems such as melting of the bottom plate of the processing table due to incorrect settings, and burning (explosion) of the workpiece if actual processing is started without penetrating the workpiece.

この発明は上記問題点を解消するためになされたもので
、予め被加工物に応じたピアッシング時間を設定するこ
となく確実にピアッシングを行なうことができるレーザ
加工装置を得ることを目的とする。
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a laser processing device that can reliably perform piercing without setting a piercing time according to the workpiece in advance.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るレーザ加工装置は、被加工物のピアッシ
ング加工終了にてレーザ光の透過を検知する検知手段を
有し、該検知手段の検知結果に基づいてレーザ光の照射
を制御する構成である。
The laser processing apparatus according to the present invention has a detection means for detecting the transmission of laser light at the end of the piercing process of the workpiece, and is configured to control the irradiation of the laser light based on the detection result of the detection means. .

〔作用〕[Effect]

この発明における検知手段はピアッシング終了にて生じ
るレーザ光の透過を検知してピアッシング時間を自動的
に調整する。
The detection means in this invention detects the transmission of laser light that occurs when piercing ends, and automatically adjusts the piercing time.

〔実施例〕〔Example〕

以下この発明の一実施例を第1図に基づいて説明する。 An embodiment of the present invention will be described below with reference to FIG.

この第1図に本実施例装置の概略回路ブロック図を示し
、同図において本実施例に係るレーザ加工装置は、レー
ザ加工を数値データにて制御する数値制御部(1)と、
該数値制御部(1)の数値制御動作に基づいてレーザ光
(21)を発振するレーザ発振部(2)と、該レーザ発
振部(2)にて発振されたレーザ光(21)を所定の方
向に屈折して導く反射ミラー(3)と、該反射ミラー(
3)の屈折導出動作によるレーザ光(21)が導入され
、該レーザ光を被加工物(7)上に集光調整する加工ヘ
ッド(4)と、該加工ヘッド(4)にて集光調整された
レーザ光(21)が被加工物(7)を貫通加工してピア
ッシング加工が終了したことをレーザ光(21)の透過
により検知する光検知センサ(5)と、該光検知センサ
(5)の検知信号をリセット信号として入力し、上記数
値制御部(1)のレーザ発振指令信号をセット信号とし
て入力してレーザ発振部(2)の発振動作を制御するR
Sフリップフロップ(6)と、上記加工ヘッド(4)に
て集光されたレーザ光(21)にて加工される被加工物
(7)を載置する加工テーブル(8)とを備える構成で
ある。
FIG. 1 shows a schematic circuit block diagram of the apparatus of this embodiment, and in the figure, the laser processing apparatus according to this embodiment includes a numerical control section (1) that controls laser processing using numerical data;
A laser oscillation section (2) that oscillates a laser beam (21) based on the numerical control operation of the numerical control section (1); a reflecting mirror (3) that refracts and guides in the direction;
The laser beam (21) resulting from the refraction deriving operation of 3) is introduced, and the processing head (4) adjusts the focusing of the laser beam onto the workpiece (7), and the processing head (4) adjusts the focusing. a light detection sensor (5) that detects by the transmission of the laser light (21) that the piercing process is completed by penetrating the workpiece (7) with the laser light (21); ) is input as a reset signal, and the laser oscillation command signal of the numerical control section (1) is input as a set signal to control the oscillation operation of the laser oscillation section (2).
It is configured to include an S flip-flop (6) and a processing table (8) on which a workpiece (7) to be processed with the laser beam (21) focused by the processing head (4) is placed. be.

次に上記構成に基づく本実施例の動作について説明する
。まず、数値制御部(1)のレーザ発振指令に基づいて
レーザ発振部(2)がレーザ光(21)を発振し、この
レーザ光(21)が反射ミラー(3)を介して加工ヘッ
ド(4)内に導入される。この加工ヘッド(21)の加
工レンズ(5)で集光されたレーザ光(21)は、その
焦点を被加工物(7)表面に合わせ、かつ補助ガス(4
2)を供給することによって、被加工物(7)を溶融、
醸化させて、加工の第一歩としての被加工物(7)の貫
通を行なう。
Next, the operation of this embodiment based on the above configuration will be explained. First, a laser oscillation unit (2) oscillates a laser beam (21) based on a laser oscillation command from a numerical control unit (1), and this laser beam (21) passes through a reflecting mirror (3) to a processing head (4). ) is introduced within. The laser beam (21) focused by the processing lens (5) of this processing head (21) is focused on the surface of the workpiece (7), and the auxiliary gas (4)
2) melting the workpiece (7) by supplying;
Then, the workpiece (7) is penetrated as the first step of processing.

この光検知センサ(5)がレーザ光(21)を検知しな
い場合は、まだレーザ光(21)が被加工物(7)を貫
通していないことを示しているので、この場合はそのま
まレーザ光(21)を照射し続ける。
If this light detection sensor (5) does not detect the laser beam (21), it means that the laser beam (21) has not yet penetrated the workpiece (7), so in this case, the laser beam (21) is not detected. Continue to irradiate (21).

この結果、被加工物(7)をレーザ光(21)が貫通し
たら、前記光検知センサ(5)がこの貫通光を信号とし
て検知することができる。この光検知センサ(5)から
の検知信号によって、数値制御部(1)のレーザ発振指
令信号にてセット状態にあるRSフリップフロップ(6
)をリセット状態とし、ピアッシング時間を自動的に調
整して、次に加ニステップへ進むことができる。
As a result, when the laser beam (21) penetrates the workpiece (7), the light detection sensor (5) can detect this penetrating light as a signal. The detection signal from this light detection sensor (5) causes the RS flip-flop (6
), the piercing time can be automatically adjusted, and you can proceed to the next step.

上記光検知センサ(5)は、サーミスタ、熱電対、フォ
トダイオード等を使用することができる。
A thermistor, thermocouple, photodiode, etc. can be used as the light detection sensor (5).

なお、上記実施例においては被加工物(7)の下部に光
検知センサ(5)を直接設ける構成としたが、被加工物
(7)と光検知センサ(5)との間にレーザ光を透過す
るか、もしくは被加工物(7)のピアッシングによる温
度の上昇を容易に伝導する防護板(防護膜)設ける構成
とすることもでき、この場合には被加工物のピアッシン
グに伴なうスパッタによる光検知センサ(5)の誤動作
を防止することができる。
Note that in the above embodiment, the light detection sensor (5) is directly provided under the workpiece (7), but it is also possible to insert a laser beam between the workpiece (7) and the light detection sensor (5). It is also possible to provide a protective plate (protective film) that transmits or easily conducts the temperature rise due to piercing of the workpiece (7), and in this case, spatter caused by piercing of the workpiece (7) can be provided. It is possible to prevent malfunction of the light detection sensor (5) due to

なお、上記実施例においては光検知センサ(5)を被加
工物(7)の下部に固定的に投首する構成としたが、レ
ーザヘッド(4)の移動に伴ない各部分のピアッシング
動作時に連動して移動する構成とすることもできる。
In the above embodiment, the light detection sensor (5) was configured to be fixedly projected at the bottom of the workpiece (7), but when the laser head (4) moves and the piercing operation of each part It can also be configured to move in conjunction with each other.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明に係るレーザ加工装置は被加工物
のピアッシング加工終了にてレーザ光の透過を検知する
検知手段を有し、該検知手段の検知結果に基づいてレー
ザ光の照射を制御する構成を採ったことから、ピアッシ
ング終了にて生じるレーザ光の透過を検知してピアッシ
ング時間を自動的に調整できることとなり、加工テーブ
ル底板の溶融を防止し、被加工物のバーニングを防止し
て確実なピアッシングを行なうことができる効果を奏す
る。この確実なピアッシングにより加工時間が短縮でき
ることとなる。
As described above, the laser processing apparatus according to the present invention has a detection means for detecting the transmission of laser light at the end of the piercing process of the workpiece, and controls the irradiation of the laser light based on the detection result of the detection means. With this configuration, it is possible to automatically adjust the piercing time by detecting the transmission of laser light that occurs at the end of piercing, which prevents the bottom plate of the processing table from melting, prevents burning of the workpiece, and ensures reliable operation. It has the effect of being able to perform piercing. This reliable piercing reduces machining time.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例に係るレーザ加工装置の概
略回路ブロック図、第2図は従来装置の概略構成図を示
す。 (1)二数値制御部 (2):レーザ発振部、 (3):反射ミラー、 (4):加工ヘッド、 (5):光検知センサ、 (6) :RSフリップフロップ。 なお、図中同一符号は同−又は相当部分を示す。 代理人  大  岩  増  雄 第1図 第2図 フ1 手続補正書(自発) 昭和  年  月  日 し2(J d
FIG. 1 is a schematic circuit block diagram of a laser processing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic block diagram of a conventional apparatus. (1) Two-numeric control unit (2): Laser oscillation unit, (3): Reflection mirror, (4): Processing head, (5): Photodetection sensor, (6): RS flip-flop. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent Masuo Oiwa Figure 1 Figure 2 F1 Procedural amendment (voluntary) Showa year Month Date 2 (J d

Claims (4)

【特許請求の範囲】[Claims] (1)被加工物をレーザ光にて加工するレーザ加工装置
において、上記被加工物の加工下部に設置され、被加工
物のピアッシング加工終了にてレーザ光の透過を検知す
る検知手段を有し、該光検知手段の検知結果に基いてレ
ーザ光の照射を制御する構成としたことを特徴とするレ
ーザ加工装置。
(1) A laser processing device that processes a workpiece with a laser beam, which includes a detection means that is installed at the lower part of the workpiece and detects the transmission of the laser beam when the piercing process of the workpiece is completed. , A laser processing apparatus characterized in that it is configured to control the irradiation of laser light based on the detection result of the light detection means.
(2)上記検知手段は被加工物との間にレーザ光を透過
する防護板を介してピアッシング加工終了によるレーザ
光を検出する構成としたことを特徴とする特許請求の範
囲第1項記載のレーザ加工装置。
(2) The detecting means is configured to detect the laser light generated when the piercing process is completed through a protective plate that transmits the laser light between the detecting means and the workpiece. Laser processing equipment.
(3)上記検知手段は光センサにて構成したことを特徴
とする特許請求の範囲第1項又は第2項記載のレーザ加
工装置。
(3) The laser processing apparatus according to claim 1 or 2, wherein the detection means is constituted by an optical sensor.
(4)上記検知手段は温度センサにて構成したことを特
徴とする特許請求の範囲第1項又は第2項記載のレーザ
加工装置。
(4) The laser processing apparatus according to claim 1 or 2, wherein the detection means is constituted by a temperature sensor.
JP61252940A 1986-10-24 1986-10-24 Laser beam machine Pending JPS63108980A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61252940A JPS63108980A (en) 1986-10-24 1986-10-24 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61252940A JPS63108980A (en) 1986-10-24 1986-10-24 Laser beam machine

Publications (1)

Publication Number Publication Date
JPS63108980A true JPS63108980A (en) 1988-05-13

Family

ID=17244273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61252940A Pending JPS63108980A (en) 1986-10-24 1986-10-24 Laser beam machine

Country Status (1)

Country Link
JP (1) JPS63108980A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63280480A (en) * 1987-05-12 1988-11-17 Amada Co Ltd Nc control method for laser oscillator
WO1990008619A1 (en) * 1989-02-03 1990-08-09 Fanuc Ltd Laser machining apparatus
WO2004071704A1 (en) * 2003-02-13 2004-08-26 Robert Bosch Gmbh Method for securing a drilling process
WO2008151838A1 (en) 2007-06-14 2008-12-18 Trumpf Werkzeugmaschinen Gmbh + Co.Kg Method for detecting a process light during a separation process in sheet material and device for carrying out the method
US7767930B2 (en) * 2005-10-03 2010-08-03 Aradigm Corporation Method and system for LASER machining
EP2908978A4 (en) * 2012-10-19 2016-07-13 Ipg Photonics Corp Robotic laser seam stepper
EP2908979A4 (en) * 2012-10-19 2016-07-27 Ipg Photonics Corp Hand maneuverable laser welding gun

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63280480A (en) * 1987-05-12 1988-11-17 Amada Co Ltd Nc control method for laser oscillator
WO1990008619A1 (en) * 1989-02-03 1990-08-09 Fanuc Ltd Laser machining apparatus
WO2004071704A1 (en) * 2003-02-13 2004-08-26 Robert Bosch Gmbh Method for securing a drilling process
US7767930B2 (en) * 2005-10-03 2010-08-03 Aradigm Corporation Method and system for LASER machining
WO2008151838A1 (en) 2007-06-14 2008-12-18 Trumpf Werkzeugmaschinen Gmbh + Co.Kg Method for detecting a process light during a separation process in sheet material and device for carrying out the method
CN101715379A (en) * 2007-06-14 2010-05-26 通快机床两合公司 Be used for during the board-like material cutting procedure, surveying the method for process light and the device that is used to implement this method
EP2908978A4 (en) * 2012-10-19 2016-07-13 Ipg Photonics Corp Robotic laser seam stepper
EP2908979A4 (en) * 2012-10-19 2016-07-27 Ipg Photonics Corp Hand maneuverable laser welding gun

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