JPS5864153A - Liquid treatment of work - Google Patents

Abstract

PURPOSE:To make it possible to carry out good liquid treatment of a work always at a high speed, by a method wherein a plate like cover extending to a position below the work is attached to a support member hanging and supporting the work, and an oxidized film or the like formed on the liquid surface of a treating liquid is partially removed by said cover. CONSTITUTION:To a support member 5 hanging and supporting a work 8, a plate like cover 11 extending to a position below the work 8 is attached and, after the cover 11 is inserted into a treating liquid 13 at first toward a direction pushing aside the predetermined area part of the surface of the treating liquid by inclining the cover to the surface of the treating liquid 13, the work 8 is immersed in the treating liquid from the cover part inserted to the surface of the treating liquid. That is, thin film such as an oxidized film or a dry film on the liquid surface of the treating liquid, which become a problem when the work is immersed, is removed by the cover moved together with the work just before the work is immersed and, because this removal can be carried out in a minimum necessary range of the work inserting part, good liquid treatment can be always carried out at a high speed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a liquid treatment method in solder dipping, resin dipping, etc. of workpieces such as electronic parts.

For example, the manufacturing process for solid electrolyte powder and laminated capacitors includes a process in which the capacitor body and leads are bonded for half a day, and a process in which the soldered capacitor body is bonded to the outer bag. Each of these steps is normally carried out by a dipping method in which a plurality of pieces are immersed in solder liquid or resin liquid at once. This Ushida immersion method is a method (static type) in which high-temperature solder is stored in a solder bath, and the workpiece such as the capacitor body is immersed in this solder liquid to a depth of about 100 mL. Generally, a method (jet type) is adopted in which a part of the liquid surface is bulged out by jetting from inside and the workpiece is immersed in this bulged part (jet type).In this latter jet type, the liquid level of the solder liquid is always kept constant. Since it is formed by the flowing solder liquid, the oxidation of the liquid surface has relatively little effect on the workpiece, but since the iI surface is always undulating, the height of the liquid level becomes unstable. It cannot be applied to solder immersion of solid electrolytic capacitors and other workpieces that require high accuracy in the immersion depth.On the other hand, the former stationary type stands still with the solder liquid level at a horizontal height, so the immersion depth is high. It is effective for immersing workpieces in solder, which requires high precision, but because the solder liquid is at a high temperature and the liquid level is stationary, a solder oxide film is formed on the liquid surface, and this solder oxide film is applied to the workpiece. 14. It adheres to the workpiece during dipping and impairs the solder properties, causing a fatal defect in the a product.
Therefore, in this static type, it is necessary to remove the solder metalized film formed on at least the part of the solder liquid surface where the work is immersed before the work is immersed.

Conventional examples of this solder oxide film removal means are shown in Figures 1 to 3.
To explain the solder dipping method for solid electrolytic capacitors shown in the figure, there are 113 track-shaped parts, 11 is a solder tank, and (3) is a solder tank containing leaked solder liquid.

(4) is a solder bath heating section. One lead (@i (@l...
- % multiple capacitor elements 1ll at the bent end of the
(8) The anode lead protruding from the other lead (11 (11)...
Tip it < t capacitor element (ml (ml *
A portion of the fist was brought into contact. This solder immersion of the band-shaped component Tll is carried out by simultaneously immersing a plurality of capacitors in the solder solution (3) of a melting plate. A scraping plate (to) is installed to prevent the solder liquid (11 from filling up) when the solder tank is full. The solder oxide film formed on the liquid surface is excited parallel to the liquid surface on the other side of the liquid surface.
The solder film (f) at the center of the liquid surface is removed. Then, the band-shaped part (11 conson deniremen) 18118) from the center of the solder liquid rU...the fist is filled with solder liquid.
The capacitor element is immersed in
... and leads (7) (1) s... are soldered.

By the way, the solder oxide film removing means using the scraping plate Uα has the following problems.

(&)% Since the length a-l of seven parallel movements between the scraping plates requires a length that is sufficiently larger than @d of the capacitor element fil (a)..., this long a)
-94t, during INJ, conson deniremen) 1
B) +8)... Yuno Handa l! ! 1 work index deteriorates due to the inability to perform accurate movements.

(t)), l)) +1, so the solder liquid (1
) It is not necessary to remove the solder oxide film in the g direction (
The area of the part with width l-a) (diagonal part 1 in Figure J) becomes larger, and if the solder oxide m in this part is removed every seven solder immersion operations, a new solder oxide film is formed each time it is removed. is generated. In other words, the more the amount of solder oxide film removed in the 7th cycle is greater, the more solder fluid will be consumed.

(0), Since a special drive mechanism and control mechanism are required for operations such as parallel movement of the i-shaped plate (50), the overall structure becomes complicated and large, resulting in a high iBK.

Hon f! In view of the problems with AF1 and above, 8f was added to t□
Attach a cover that extends below the workpiece to the belt-like support member that supports the workpiece such as condensate V, and the support member including the clamping jig, and use the long cover to partially remove a thin film such as an oxide film on the surface of the processing liquid. To provide a method for removing vacuoles from a workpiece, and immersing the workpiece in a treatment liquid from the removed portion.

Hereinafter, the present invention will be explained using an example in which the present invention is applied, for example, to the solder paste of the above-mentioned integral electrolytic pad.

In the solder immersion of the strip component +11 shown in the WII diagram,
As shown in Figs. D and 3, the wood cover 8A is attached to the next band-like support member (6), and this cover has a length t that is approximately the same as the support member ti+. The upper end (lla) is integrally formed on one side of the support member +li) or is removably fixed by means such as screwing, and the middle part (llb) is each one)' ts+ +s+
..., +? )ff)...extends downward 2 parallel to the fist,
Lower 4 [(110)t! The capacitor element fil (81...), which serves as a liquid treatment work, is inclined inward at a predetermined obtuse angle so as to protrude vertically downward.
υ is made of heat-resistant and oxidation-resistant materials such as stainless steel.
L, and at least the front and back surfaces Fi of the lower sloped end (llo)
The beak is treated with thiamin (thiamin processing, etc.).

Next, the above-mentioned cover 111t-attached band-shaped part clr
The soaking method for cows will be explained with reference to the figures. In this case, the entire strip part if t! 11. Stand the solder paddle upright and lower it one step toward the level of the solder liquid I in the soldering paddle. Then, first, the inclined lower end (lla) of the car 1111 is inserted at an angle of 9 with respect to the surface of the solder liquid aS, and then the capacitor element i81181.e. inserted within. When this force I (-) is inserted, solder oxidation II1 is applied to the liquid level of solder liquid (1j).
．． A4 is formed.

The solder oxidation l1il14 is first broken at the part that corresponds to the lower edge of the cover lower end (1ie), and the
As the damaged surface expands as xo) descends, the broken solder oxide film 141' is exposed to the tilted Mi surface t-i of the lower end (11), and the cover circle is inserted to a certain depth. At this point, it gathers on the surface of the cover middle part n1b), and
By inserting the cover flll, the solder oxide film J4 other than the diagonal part in FIG. 1 is partially and self-removed, resulting in solder oxidation A! A long window is formed at 41114, and this length '4'
+51 is set to approximately the size of the compensation required for soldering the capacitor element +81 [81...]. -Also, since the solder liquid I1m exposed on the long window cap is a fresh surface with no oxide film, since it is immediately after the solder is completed and removed, the condenser element) (Ill
181... are inserted all at once to ensure good solder immersion.

When the solder dipping is completed, #-shaped part m'2 is vertically raised as it is, and 1J71. From inside the window ilυ, pull the capacitor element f81181*...f force Δ-fil+tI
Remove the solder immersion for the next part from the same long window cap part II.
This is done in the same way as above, but at this time, a new solder oxide film is formed in the window area over time, and this is removed with the cover 1111 along with the old solder oxide film that is slightly lowered in the long window area. is done. Therefore, the solder oxide film a4f on the outside of the window 1161 remains as it is without being removed.
This residual solder oxide film O/ prevents the oxidation of the solder fluid IIm underneath, thereby keeping the cost of soldering agent +JI 1/k to a minimum.

Figures 9 and 10 show a flat cover (111i1C1) of the support member (5) in place of the cover 111) above.
The lower end of this cover US, shown as a 1-digit band-shaped part or 2, also extends upward from the capacitor elements +81 +81-... to □1 7.
As shown in Figure 2 and Figure 1, the entire cover must be slightly bent so that the lower end of the cover is inclined to the surface of the solder liquid a. Insert it into the hole, and then insert it to the specified depth and stand it upright afterward or while inserting it.In this way, the solder fluid will
Only the central part of the solder oxidation d14 on the liquid surface is separated by the cutter 4-1et, and as a result, the 1F! 4 is also good solder dipping or soldering.

Note that the present invention is not limited to soldering of workpieces.

For example, it can be applied to the case where a workpiece such as a capacitor element coated with solder is dipped in resin and then covered with resin. In this case, it can be applied at the time of pre-sheathing of the main sheathing method of pre-sheathing with low viscosity v'hM dry resin and then wrapping with low-viscosity omelette hrj. In other words, the quick-drying resin liquid has a g
A thin dry film is formed on the surface, and this adheres to the workpiece when it is immersed, impairing the resin sealability, so it is necessary to remove the dry age from the liquid surface before the workpiece is immersed.

Therefore, if a cover similar to the above is attached to the support member of the workpiece and the workpiece is inserted into the resin liquid at the same time, only the portion of the dry film necessary for workpiece immersion is removed, and good resin immersion is achieved.

In addition, resin consumption is reduced. In addition, the tenjin member may be made of a plate material that suspends and supports the workpiece, or may be made of a jig that holds the workpiece. Furthermore, when the cover is applied to a resin liquid, heat resistance and oxidation resistance are not required.

As explained above, according to the present invention, the thin film such as the dry film in the oxide film on the surface of the processing liquid, which is a problem when immersing the workpiece, is removed together with the workpiece using the auxiliary cover immediately before the workpiece is immersed.
Moreover, since this removal can be carried out within the minimum necessary range of the workpiece insertion area, it is possible to always perform good liquid processing at high speed, improve the index, and reduce the amount of processing liquid. Is it possible to reduce the cost of the product? Furthermore,
By integrating the cover serving as a means for removing a thin film of processing liquid and the workpiece for liquid-liquid processing, the drive control mechanism is simplified and the processing apparatus can be made smaller.

[Brief explanation of drawings]

Figures 1 and g6- are the ninth work liquid that explains the conventional work *a Rimanketsu! Schematic front and side views of the 61fM device, Figure 3 is the processing solution in Figure 7! 1, 4I and 5 of the tank are schematic front and side views showing an example of the apparatus for implementing the method of the present invention, and FIGS. 4 and 2 are schematic views of FIGS. A partially cross-sectional front view and a side view of the liquid liquid ant, Fig. 5 is a plan view of the spoon-liquid altar shown in Fig. 4, and Fig. 2 and @/θ diagram are modifications of the cover used in the method of the present invention. Front view and side view of workpiece attachment parts, 5g/7 diagram and @/ for explaining examples.
, 2CgJ are prayer images of each assistant poem of the t & processing device for explaining examples of assistant poems of the present invention. (5)...Supporting member, (8)...Work (2ndende element), 1111 @ @ Force z4-1ase"i
mg (Handa Ken), tl131...Kasso-0 Special performance person New Nippon Electric Co., Ltd. Representative Irie Kei Ministry 吾l゛ E Kite Hidedai 4 Kyou ξ 1 @ 5 Kyou 1 @ 6 Figure @ 7 Figure ← //C Figure 8 Figure 19 Figure s11 Figure 12 Figure 110

Claims (1)

[Claims] 111 Attach a plate-like force t4- which decreases to the lower iml of the workpiece to the supporting member that suspends and supports the workpiece, and first tilt the cover with respect to the treatment liquid surface and place it in the treatment liquid at a predetermined level O A workpiece 0 characterized in that the workpiece is inserted in a direction in which the surface area is swept aside, and then the workpiece is immersed into the T-Mori case from the cover insertion part on the surface of the processing liquid.
IIljI&RIKA decision.