JPS5861655A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5861655A
JPS5861655A JP56160602A JP16060281A JPS5861655A JP S5861655 A JPS5861655 A JP S5861655A JP 56160602 A JP56160602 A JP 56160602A JP 16060281 A JP16060281 A JP 16060281A JP S5861655 A JPS5861655 A JP S5861655A
Authority
JP
Japan
Prior art keywords
wiring
metallic wiring
input
metal wiring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56160602A
Other languages
English (en)
Japanese (ja)
Other versions
JPS64824B2 (enrdf_load_stackoverflow
Inventor
Teruyoshi Mihara
輝儀 三原
Tamotsu Tominaga
富永　保
Hideo Muro
室　英夫
Masami Takeuchi
武内　正巳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP56160602A priority Critical patent/JPS5861655A/ja
Publication of JPS5861655A publication Critical patent/JPS5861655A/ja
Publication of JPS64824B2 publication Critical patent/JPS64824B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05541—Structure
    • H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP56160602A 1981-10-08 1981-10-08 半導体装置 Granted JPS5861655A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56160602A JPS5861655A (ja) 1981-10-08 1981-10-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56160602A JPS5861655A (ja) 1981-10-08 1981-10-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS5861655A true JPS5861655A (ja) 1983-04-12
JPS64824B2 JPS64824B2 (enrdf_load_stackoverflow) 1989-01-09

Family

ID=15718484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56160602A Granted JPS5861655A (ja) 1981-10-08 1981-10-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS5861655A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61170048A (ja) * 1985-01-23 1986-07-31 Nec Corp 半導体装置
JPS63142666A (ja) * 1986-12-04 1988-06-15 Mitsubishi Electric Corp 半導体集積回路装置
JPH02216870A (ja) * 1989-02-16 1990-08-29 Mitsubishi Electric Corp 薄膜トランジスタ
JP2010509108A (ja) * 2006-11-14 2010-03-25 コロン グロテック，インコーポレイテッド 発熱ファブリックおよびその製造方法
US10734745B2 (en) 2015-12-25 2020-08-04 Autonetworks Technologies, Ltd. Connector

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61170048A (ja) * 1985-01-23 1986-07-31 Nec Corp 半導体装置
JPS63142666A (ja) * 1986-12-04 1988-06-15 Mitsubishi Electric Corp 半導体集積回路装置
JPH02216870A (ja) * 1989-02-16 1990-08-29 Mitsubishi Electric Corp 薄膜トランジスタ
JP2010509108A (ja) * 2006-11-14 2010-03-25 コロン グロテック，インコーポレイテッド 発熱ファブリックおよびその製造方法
US10734745B2 (en) 2015-12-25 2020-08-04 Autonetworks Technologies, Ltd. Connector
US11309651B2 (en) 2015-12-25 2022-04-19 Autonetworks Technologies, Ltd Connector with a housing and a terminal having a conductive case, a conductive member in the case and a coil spring biasing the conductive member toward a meeting terminal

Also Published As

Publication number Publication date
JPS64824B2 (enrdf_load_stackoverflow) 1989-01-09

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