JPS5858770B2 - Baking and forming method for insulated conductors - Google Patents

Baking and forming method for insulated conductors

Info

Publication number
JPS5858770B2
JPS5858770B2 JP9784577A JP9784577A JPS5858770B2 JP S5858770 B2 JPS5858770 B2 JP S5858770B2 JP 9784577 A JP9784577 A JP 9784577A JP 9784577 A JP9784577 A JP 9784577A JP S5858770 B2 JPS5858770 B2 JP S5858770B2
Authority
JP
Japan
Prior art keywords
conductor
heat
spacer
baking
insulated conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9784577A
Other languages
Japanese (ja)
Other versions
JPS5432788A (en
Inventor
秀雄 大友
健司 保月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9784577A priority Critical patent/JPS5858770B2/en
Publication of JPS5432788A publication Critical patent/JPS5432788A/en
Publication of JPS5858770B2 publication Critical patent/JPS5858770B2/en
Expired legal-status Critical Current

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  • Insulated Conductors (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)

Description

【発明の詳細な説明】 本発明は、絶縁導体の焼付は成形方法に係り、電気機器
用絶縁導体の外周に熱収縮体を被覆し、該熱収縮体を加
熱することにより絶縁導体を加圧成形する焼付は成形方
法に関するものである。
Detailed Description of the Invention The present invention relates to a molding method for baking an insulated conductor, in which the outer periphery of an insulated conductor for electrical equipment is coated with a heat-shrinkable material, and the insulated conductor is pressurized by heating the heat-shrinkable material. Baking to form is related to the forming method.

従来、電気機器用導体絶縁として未硬化あるいは半硬化
の状態の熱硬化性樹脂を、導体の周囲にこれを包むべく
施した絶縁導体を加熱、加圧して焼付は硬化させる方法
として、導体とこれを包む熱硬化性樹脂絶縁層とからな
る絶縁導体に熱伝導体を介してその外周に面状発熱体と
密閉されたスペーサを配設して最外周に合成樹脂からな
る熱収縮体を巻き、該発熱体の加熱により絶縁導体の焼
付けと熱収縮体の収縮力による成形とを行なう絶縁導体
の焼付は成形方法が行なわれている。
Conventionally, as conductor insulation for electrical equipment, an uncured or semi-cured thermosetting resin is wrapped around the conductor, and the insulated conductor is heated and pressurized to harden the conductor. A sheet heating element and a sealed spacer are arranged on the outer periphery of an insulated conductor consisting of a thermosetting resin insulating layer surrounding the insulated conductor through a thermal conductor, and a heat shrinkable body made of synthetic resin is wrapped around the outermost periphery. A molding method is used for baking the insulated conductor, in which the insulated conductor is baked by heating the heating element and the insulated conductor is shaped by the contraction force of the heat-shrinkable body.

この従来方法による絶縁導体の構成を第1図に示す。The structure of an insulated conductor produced by this conventional method is shown in FIG.

第1図において導体1は熱硬化性樹脂からなる絶縁層2
で包まれ、その上に金属からなる熱伝導体3を尚て絶縁
層2を加熱硬化させるための面状発熱体4を配置し、さ
らにスペーサ5および6を当接させ、その最外周に熱可
塑性樹脂からなる熱収導体7を巻きつけている。
In FIG. 1, a conductor 1 is an insulating layer 2 made of thermosetting resin.
A heat conductor 3 made of metal is placed on top of the heat conductor 3, and a planar heating element 4 for heating and hardening the insulating layer 2 is placed thereon, and spacers 5 and 6 are brought into contact with the heat conductor 3, and the outermost periphery of the heat conductor 3 is placed. A heat absorber 7 made of plastic resin is wound around it.

この絶縁導体は加熱炉中に置かれるか、または熱風等に
より外部から加熱すると同時に面状発熱体4に通電する
ことによって加熱される方法である。
This insulated conductor is heated by placing it in a heating furnace, or by heating it from the outside with hot air or the like, and simultaneously by energizing the planar heating element 4.

上記従来方法においては電気絶縁導体の外層の熱収縮体
7の加熱収縮と内部の絶縁層2の焼付けを最適な条件下
で行うことができるが導体1の絶縁層2の成分である熱
硬化性樹脂を硬化させる面状発熱体4と外層の熱収縮体
1を加熱収縮させる2種類の熱源を必要としていた。
In the conventional method described above, the heat-shrinking body 7 of the outer layer of the electrically insulated conductor and the baking of the inner insulating layer 2 can be performed under optimal conditions. Two types of heat sources were required, one for heating and shrinking the sheet heating element 4 for curing the resin and the other for heating and shrinking the outer heat-shrinkable body 1.

また面状発熱体4を配置するため、製品の製造工程がか
かる欠点がある。
Furthermore, since the planar heating element 4 is arranged, there is a drawback that the manufacturing process of the product is required.

本発明の目的は上記欠点を改良し、電気絶縁導体におい
て、外層の熱収縮体の加熱収縮と、内部の導体絶縁層の
焼付を一種の熱源で行なうことができる絶縁導体の焼付
は成形方法を提供することにある。
The purpose of the present invention is to improve the above-mentioned drawbacks, and to provide an electrically insulated conductor in which the heat shrinkage of the outer heat shrinkable layer and the baking of the internal conductor insulation layer can be performed using a single heat source. It is about providing.

上記の目的のために、本発明は、導体とこれを含む熱硬
化性樹脂絶縁層とからなる絶縁導体に熱伝導体を介して
その外周に熱風を通過できる空間をもたせた通気スペー
サを配設しその上にスペーサ及び熱収縮体を巻き付ける
ようにしたものである。
For the above purpose, the present invention provides an insulated conductor consisting of a conductor and a thermosetting resin insulating layer including the conductor, and a ventilation spacer having a space through which hot air can pass through the outer periphery of the insulated conductor via a thermal conductor. A spacer and a heat-shrinkable material are wrapped around the shiso.

焼付けはこの通気スペーサ内に熱風を通過させると同時
に熱収縮体の外周を加熱して熱収縮体を収縮させ、該収
縮力により絶縁導体の焼付は成形を行なう方法である。
Baking is a method in which hot air is passed through the ventilation spacer and at the same time the outer periphery of the heat-shrinkable body is heated to shrink the heat-shrinkable body, and the insulated conductor is baked and shaped by the contraction force.

以下本発明の実施例を第2図および第3図により説明す
る。
Embodiments of the present invention will be described below with reference to FIGS. 2 and 3.

導体1には熱硬化性樹脂からなる絶縁層2が被覆され、
さらにその外層に熱伝導体3を介して、空隙9をもつ通
気スペーサ8が配設される。
The conductor 1 is coated with an insulating layer 2 made of thermosetting resin,
Further, a ventilation spacer 8 having a void 9 is provided on the outer layer with a heat conductor 3 interposed therebetween.

該通気スペーサ8の上にさらに当接するスペーサ6を設
け、該スペーサ8の外周に熱収縮体7が被覆されている
A spacer 6 is provided above and in contact with the ventilation spacer 8, and the outer periphery of the spacer 8 is covered with a heat-shrinkable body 7.

導体1の外側を被覆する絶縁層2としては、エポキシ樹
脂等の熱硬化性樹脂が用いられる。
As the insulating layer 2 covering the outside of the conductor 1, thermosetting resin such as epoxy resin is used.

該熱硬化性樹脂は、焼付は成形前においては未硬化また
は半硬化の状態で導体1に被覆される。
The thermosetting resin is coated on the conductor 1 in an uncured or semi-cured state before baking.

絶縁層2の外側に設けられる熱伝導体3としては、一般
に金属類の鉄板、銅板、アルミニウム板等が用いられる
As the thermal conductor 3 provided outside the insulating layer 2, metals such as iron plates, copper plates, aluminum plates, etc. are generally used.

また上記空間をもった通気スペーサ8は、通気スペーサ
8内部を通過する熱風の熱を吸収し熱伝導体3に平均化
して伝導する。
Further, the ventilation spacer 8 having the space described above absorbs the heat of the hot air passing through the ventilation spacer 8 and conducts it to the heat conductor 3 in an average manner.

該スペーサ8は鉄、銅、アルミニウム等が用いられる。The spacer 8 is made of iron, copper, aluminum, or the like.

該空隙9を有する通気スペーサ8は、長手方向(導体の
軸方向)に分割され必要に応じて、複数個の通気スペー
サ8が絶縁層2の外周に配置される。
The ventilation spacer 8 having the void 9 is divided in the longitudinal direction (the axial direction of the conductor), and a plurality of ventilation spacers 8 are arranged around the outer periphery of the insulating layer 2 as necessary.

該通気スペーサ8内を通過する熱風は長手方向、および
幅方向に自由に移動することができる。
The hot air passing through the ventilation spacer 8 can move freely in the longitudinal direction and the width direction.

第3図において最外周に被覆される熱収縮体7は通気ス
ペーサ8内部に熱風が容易に通過し得るよう、該通気ス
ペーサ8の一部が露出するように、長手方向に一定の間
隔をおいて被覆される。
In FIG. 3, the heat-shrinkable body 7 covering the outermost periphery is spaced at a certain interval in the longitudinal direction so that a part of the ventilation spacer 8 is exposed so that hot air can easily pass through the ventilation spacer 8. covered.

熱伝導体3は、通気スペーサ8内部を通過する熱風の温
度を更に均一化して絶縁層2を加熱する。
The thermal conductor 3 further equalizes the temperature of the hot air passing through the ventilation spacer 8 and heats the insulating layer 2 .

スペーサ6としては、比較的熱漬導度の小さいゴム、木
材等が好ましく用いられ、金属類等からなる熱伝導体で
も断熱材を介在することによって用いることができる。
As the spacer 6, rubber, wood, or the like, which has a relatively low thermal conductivity, is preferably used, and a heat conductor made of metal or the like can also be used by interposing a heat insulating material.

スペーサ6の形状は外周に被覆される熱収縮体7が焼付
は成形時のその収縮力により、導体1に被覆される絶縁
層2を均一に加圧できるように、適宜定められる。
The shape of the spacer 6 is appropriately determined so that the heat-shrinkable body 7 covering the outer periphery can uniformly press the insulating layer 2 covering the conductor 1 by its shrinking force during baking and molding.

外周に被覆される熱収縮体7としては、ポリエステル、
ポリプロピレン等のような熱可塑性樹脂からなるテープ
等が用いられている。
The heat-shrinkable body 7 coated on the outer periphery is made of polyester,
Tapes made of thermoplastic resin such as polypropylene are used.

以上のように構成された絶縁導体焼付は成形の設備は、
その焼付は成形時、熱媒体の熱が通気スペーサ8から熱
伝導体3を経て導体絶縁層2に伝えられるので、従来の
ように熱伝導体3の外側に当接する面状発熱体等の熱源
を要せず、一種の熱源において適正な硬化温度を得るこ
とができ、かつスペーサの軽量化が図れる。
The insulated conductor baking and forming equipment configured as above is
During molding, the heat of the heat medium is transferred from the ventilation spacer 8 to the conductor insulating layer 2 via the heat conductor 3, so that unlike conventional heat sources such as sheet heating elements that contact the outside of the heat conductor 3, An appropriate curing temperature can be obtained using one type of heat source without the need for a heat source, and the weight of the spacer can be reduced.

上記実施例において熱伝導体3、通気スペーサ8、およ
びスペーサ6は、導体1の絶縁層2に順次被覆してもよ
いが、焼付は成形前に予め一体として構成しておき、こ
れを絶縁層2の上に配置して、さらにその上を熱収縮体
7で被覆してもよい。
In the above embodiment, the thermal conductor 3, the ventilation spacer 8, and the spacer 6 may be sequentially coated on the insulating layer 2 of the conductor 1. 2, and further may be covered with a heat shrinkable body 7.

このようにして製造工程、および面状発熱体等の節減を
図ることができる。
In this way, it is possible to reduce the manufacturing process and the number of planar heating elements.

以上、本発明によれば、絶縁導体の最外層に被覆される
熱収縮体の適正な収縮力を得られると同時に導体に被覆
される絶縁層の適正な加熱温度を一種の熱源から得るこ
とができる。
As described above, according to the present invention, it is possible to obtain an appropriate shrinkage force of the heat-shrinkable body coated on the outermost layer of an insulated conductor, and at the same time obtain an appropriate heating temperature of the insulating layer coated on the conductor from a type of heat source. can.

また面状発熱体による熱硬化樹脂からなる絶縁層の加熱
法など特別な加熱制御装置を用いることなく、絶縁導体
の外層、および内層の加熱温度を適正に保持することが
できる。
Further, the heating temperature of the outer layer and the inner layer of the insulated conductor can be maintained appropriately without using a special heating control device such as a method of heating an insulating layer made of a thermosetting resin using a planar heating element.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の焼付は成形方法を説明するための断面図
、第2図は本発明の実施例の絶縁導体の焼付は成形方法
を示す断面図、第3図は第2図の側面図である。 1・・・・・・導体、2・・・・・・絶縁層、3・・・
・・・熱伝導体、6・・・・・・スペーサ、7・・・・
・・熱収縮体、8・・・・・・通気スペーサ、9・・・
・・・通気スペーサの空隙。
Fig. 1 is a cross-sectional view to explain the conventional baking and forming method, Fig. 2 is a cross-sectional view showing the forming method of the insulated conductor according to the embodiment of the present invention, and Fig. 3 is a side view of Fig. 2. It is. 1... Conductor, 2... Insulating layer, 3...
...Thermal conductor, 6...Spacer, 7...
・・Heat shrinkable body, 8・・Ventilation spacer, 9・・・・
...Gap in ventilation spacer.

Claims (1)

【特許請求の範囲】[Claims] 1 導体とこれを包む熱硬化性樹脂絶縁層とからなる絶
縁導体に、熱伝導体並びにスペーサを介してその外周に
熱収縮体を設け、熱収縮体を加熱収縮させ、絶縁導体を
外側から加圧焼付成形する方法において、前記スペーサ
の内側に、内部に空間を有する通気スペーサを配し、こ
の通気スペーサの空間に熱媒体を流通せしめるようにし
たことを特徴とする絶縁導体の焼付は成形方法・
1. A heat shrinkable body is provided on the outer periphery of an insulated conductor consisting of a conductor and a thermosetting resin insulating layer surrounding the conductor through a heat conductor and a spacer, the heat shrinkable body is heated and contracted, and the insulated conductor is applied from the outside. A method of pressing and molding an insulated conductor, characterized in that a ventilation spacer having an internal space is disposed inside the spacer, and a heat medium is allowed to flow through the space of the ventilation spacer.・
JP9784577A 1977-08-17 1977-08-17 Baking and forming method for insulated conductors Expired JPS5858770B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9784577A JPS5858770B2 (en) 1977-08-17 1977-08-17 Baking and forming method for insulated conductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9784577A JPS5858770B2 (en) 1977-08-17 1977-08-17 Baking and forming method for insulated conductors

Publications (2)

Publication Number Publication Date
JPS5432788A JPS5432788A (en) 1979-03-10
JPS5858770B2 true JPS5858770B2 (en) 1983-12-27

Family

ID=14203052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9784577A Expired JPS5858770B2 (en) 1977-08-17 1977-08-17 Baking and forming method for insulated conductors

Country Status (1)

Country Link
JP (1) JPS5858770B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3014270U (en) * 1994-06-24 1995-08-08 パイマージャパン株式会社 Bedspread

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3014270U (en) * 1994-06-24 1995-08-08 パイマージャパン株式会社 Bedspread

Also Published As

Publication number Publication date
JPS5432788A (en) 1979-03-10

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