JPS5858716A - Laminated ceramic condenser - Google Patents
Laminated ceramic condenserInfo
- Publication number
- JPS5858716A JPS5858716A JP15835981A JP15835981A JPS5858716A JP S5858716 A JPS5858716 A JP S5858716A JP 15835981 A JP15835981 A JP 15835981A JP 15835981 A JP15835981 A JP 15835981A JP S5858716 A JPS5858716 A JP S5858716A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- capacitor
- silver
- internal
- palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は積層セラミックコンデンサに関し、特にコンデ
ンサチップの端面に露呈する内部′g極の消失の防+h
IF関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multilayer ceramic capacitor, and in particular to a method for preventing the disappearance of internal 'g' electrodes exposed on the end faces of capacitor chips.
It is related to IF.
一般に、この種積層セラミックコンデンサにおいて、そ
の内部電極はパラジウムを主体とする導電部材にて構成
さtているのであるが、近時、コンデンサコストの低減
を目的として、パラジウムと銀とを混合し、かつそれに
占める銀の割合を例えば70重Iit%程度に高めた導
電部材が使用されている。Generally, the internal electrodes of this type of multilayer ceramic capacitor are made of a conductive material mainly made of palladium, but recently, with the aim of reducing capacitor costs, palladium and silver have been mixed together. In addition, a conductive member is used in which the proportion of silver in the conductive member is increased to, for example, about 70% by weight.
このコンデンサによれば、コストを大巾に低減でき、好
ましいものであるが、コンデンサチップの焼成時に、そ
の焼成条件によっては例えば焼成が過度に行われたりす
ると、内部電極のコンデンサチップ端面に露呈する部分
の電気的性質が損なわれるという問題がある。According to this capacitor, the cost can be greatly reduced and it is preferable, but depending on the firing conditions when firing the capacitor chip, for example, if the firing is performed excessively, the internal electrodes may be exposed on the end face of the capacitor chip. There is a problem that the electrical properties of the parts are impaired.
−
そして、このような現象は誘電体層を構成するセラミッ
ク粉末に多くのビスマスが含まれているものほど顕著に
現わnる傾向にある。 。- Such a phenomenon tends to be more pronounced as the ceramic powder constituting the dielectric layer contains more bismuth. .
この原因については充分に解明さtていないで、内部電
極の構成部材のうち、銀が蒸発、拡散などによつ1消失
するためと考えられる。Although the cause of this has not been fully elucidated, it is thought that silver among the constituent members of the internal electrodes is lost due to evaporation, diffusion, etc.
一旦、電気的特性の損なわれた内部電極はコンデンサチ
ップ端面の電極引出し層との電気的接続がオーブンの状
態になってしまうために、セラミツク層間に内部電極が
位置するにも拘わらず、静電容量が著しく減少し、コン
デンサ本来の機能を期待し得がくなる。Once the internal electrodes have lost their electrical characteristics, the electrical connection with the electrode extraction layer on the end face of the capacitor chip becomes like an oven, so even though the internal electrodes are located between the ceramic layers, static The capacitance is significantly reduced, and the original function of the capacitor is expected to be improved.
例、tば+’/7’サイズ(LXWXT )が3.2×
22−5XL5で静電容量が0.01μFの積層セラミ
ックコンデンサにおいて、内部電極を、銀、パラジウム
を含み、導電部材に占める銀の割合を70重量%に設定
した導電部材にて形成したものにあっては過度の焼成に
よって静電容量が0゜002μFに減少してしまう。こ
のコンデンサを解析した処、内部電極の80%程度に銀
の消失現象が認められた。For example, t+'/7' size (LXWXT) is 3.2×
22-5XL5 multilayer ceramic capacitor with a capacitance of 0.01 μF, the internal electrodes of which are formed from a conductive material containing silver and palladium, with the proportion of silver in the conductive material set to 70% by weight. In this case, excessive firing reduces the capacitance to 0°002 μF. When this capacitor was analyzed, it was found that silver disappeared from about 80% of the internal electrodes.
従って、このような問題をパラジウムの導電部材に対す
る混合比率を高めることなく解決できれば、貴重なパラ
ジウムの有効活用を計ることができる上、コンデンサ本
来の特性が得られ、かつコストをも有効に低減できるも
のである。Therefore, if such problems can be solved without increasing the mixing ratio of palladium to conductive materials, valuable palladium can be used effectively, the original characteristics of capacitors can be obtained, and costs can be effectively reduced. It is something.
本発明はこのような点に鑑み、簡単な構成によって内部
電極の電極引出し層に対する電気的接続性を充分に確保
でき、かつコストをも有効に低減できる積層セラミック
コンデンサを提供するもので、以下実施例について説明
する。In view of these points, the present invention provides a multilayer ceramic capacitor that can sufficiently ensure electrical connectivity of the internal electrodes to the electrode extraction layer with a simple configuration and that can also effectively reduce costs. Let's discuss an example.
図において、1はコンデンサチップであって、例えば複
数のセラミック層2と、セラミック層間に互い違い状に
位置し、かつ銀、パラジウムを含む導電部材にて形成さ
れた内部電極3とから構成されている。そして、内部電
極3のコンデンサチップlの端面に露呈する側の端部3
aは中央部分の厚みの1.2〜2,0倍に設定されてい
る。これは列えば内部電極3の端部3aのみスクリーン
印刷を複数回行うことによつ又容易に得られる。4はコ
ンデンサチップ1の端面に形成された電極引出し層であ
って、内部電極3のそれぞれの端部に電気的に接続され
ている。In the figure, 1 is a capacitor chip, which is composed of, for example, a plurality of ceramic layers 2 and internal electrodes 3 which are arranged alternately between the ceramic layers and are made of a conductive material containing silver and palladium. . The end portion 3 of the internal electrode 3 is exposed to the end surface of the capacitor chip l.
a is set to 1.2 to 2.0 times the thickness of the central portion. This can also be easily obtained by performing screen printing multiple times only on the end portion 3a of the internal electrode 3. Reference numeral 4 denotes an electrode extension layer formed on the end surface of the capacitor chip 1, and is electrically connected to each end of the internal electrode 3.
このように内部電極3はコンデンサチップ端面に露呈す
る側の端部3aが中央部分の厚さの1.2〜2,0倍と
なるように構成されているので、仮にコンデンサチップ
1の焼成が過度に行われ、端部3aに含まれる銀に消失
現象が生じても、焼成中 。In this way, the internal electrode 3 is configured such that the end portion 3a exposed to the end surface of the capacitor chip is 1.2 to 2.0 times as thick as the central portion. Even if the firing is carried out excessively and a disappearance phenomenon occurs in the silver contained in the end portion 3a, the firing process will continue.
に完全に消失することはない。このために、内部電極3
の電極引出し層4に対する電気的接続性を充分に確保で
き、静電容量の減少を防止できる。will not completely disappear. For this purpose, the internal electrode 3
Electrical connectivity to the electrode extraction layer 4 can be sufficiently ensured, and a decrease in capacitance can be prevented.
又、内部電極3は銀、パラジウムを含む導電部材にて構
成されているのであるが、上述のように端部3aの電極
引出し層4に対する電気的接続性を充分に確保できる関
係で、銀の導電部材に対する混合比率を高めることがで
きる。このために、コンデンサのコストを有効に低減で
きる。In addition, the internal electrode 3 is made of a conductive material containing silver and palladium, but as mentioned above, in order to ensure sufficient electrical connectivity to the electrode lead layer 4 of the end portion 3a, silver is used. The mixing ratio to the conductive member can be increased. Therefore, the cost of the capacitor can be effectively reduced.
次に具体的実施例について説明する。チップサイズが3
.2 X 2.5 X 1.5詣で、かつ静電容量が0
.01μFの積層セラミックコンデンサにおいて、銀、
パラジウムを含み、銀の導電部材に占める割合を70重
量%に設定した導電部材にて構成された内部電極の端部
(コンデンサチップ端面から0.2錦の範囲)の厚みを
中央部分に比し1.0〜3.5倍の範囲で変えて静電容
量、セラミック層と内部電極との剥離状況を測定、観察
した処、下表に示す結果が得られた。Next, specific examples will be described. Chip size is 3
.. 2 x 2.5 x 1.5 pilgrims and capacitance is 0
.. In a 01 μF multilayer ceramic capacitor, silver,
The thickness of the end portion (within a range of 0.2 brocades from the end surface of the capacitor chip) of the internal electrode, which is made of a conductive material containing palladium and in which the proportion of silver in the conductive material is set to 70% by weight, is compared to the center portion. The electrostatic capacitance and the state of peeling between the ceramic layer and the internal electrode were measured and observed while varying the ratio by a factor of 1.0 to 3.5 times, and the results shown in the table below were obtained.
上表より明らかなように、内部電極の端部(電極引出し
層側)の厚みが中央部分の1.2倍以上において、静電
容量の減少が少なくなっており、特[1,5倍以上では
全く減少していない。一方、セラミック層と内部電極端
部との剥%Iiは厚みが厚くなる程、顕著に現わns
2”0倍を越える範囲において発生している。従って、
端部の厚みは1,2〜20倍の範囲において実用上支障
なく利用できるが、1.5〜2.0倍の範囲が望ましい
。As is clear from the table above, when the thickness of the end portion (electrode extraction layer side) of the internal electrode is 1.2 times or more that of the central portion, the decrease in capacitance is small, and especially when the thickness is 1.2 times or more than the center portion, It hasn't decreased at all. On the other hand, the peeling %Ii between the ceramic layer and the end of the internal electrode becomes more pronounced as the thickness increases.
It occurs in a range exceeding 2"0 times. Therefore,
The thickness of the end portion can be used in the range of 1.2 to 20 times without any practical problem, but it is preferably in the range of 1.5 to 2.0 times.
尚、本発明において、銀、パラジウムを含も導電部材に
占める銀の割合は70重量%に制約されることなく、適
宜に増減できる。又、内部電極において、厚みを厚くす
る端部のチップ端面からの巾はチップサイズによって適
宜に変更でき、実施例の0.2 mに制約されない。In the present invention, the proportion of silver in the conductive member, including silver and palladium, is not limited to 70% by weight and can be increased or decreased as appropriate. Further, in the internal electrode, the width from the chip end surface of the thickened end portion can be changed as appropriate depending on the chip size, and is not limited to 0.2 m as in the embodiment.
以上のように本発明によれば、簡単な構成によって内部
電極の電極引出し層に対する電気的接続性を充分に確保
でき、かつコストをも有効に低減できる。As described above, according to the present invention, it is possible to sufficiently ensure the electrical connectivity of the internal electrodes to the electrode extraction layer with a simple configuration, and it is also possible to effectively reduce costs.
図は本発明の一実施例を示す側断面図である。
図中、1はコンデンサチップ、2はセラミック層、3は
内部電極、3aは端部、4は電極引出し層である。
2
3 2 づQThe figure is a side sectional view showing one embodiment of the present invention. In the figure, 1 is a capacitor chip, 2 is a ceramic layer, 3 is an internal electrode, 3a is an end portion, and 4 is an electrode extension layer. 2 3 2 zuQ
Claims (1)
よりなる内部電極が互い違い状に位置し、かつ内部電極
の露呈する端面に電極引出し層を形成したものにおいて
、上記内部電極の電極引出し層に接続さnる側の端部の
厚みを中央部分の1.2〜2.0倍に設定したことを特
徴とする積層セラミックコンデンサ。Internal electrodes made of a conductive material containing silver and palladium are arranged alternately between a plurality of ceramic layers, and an electrode extension layer is formed on the exposed end surface of the internal electrode, and the electrode extension layer of the internal electrode is connected to the electrode extension layer. A multilayer ceramic capacitor characterized in that the thickness of the end portion on the n side is set to be 1.2 to 2.0 times the thickness of the central portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15835981A JPS5858716A (en) | 1981-10-05 | 1981-10-05 | Laminated ceramic condenser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15835981A JPS5858716A (en) | 1981-10-05 | 1981-10-05 | Laminated ceramic condenser |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5858716A true JPS5858716A (en) | 1983-04-07 |
Family
ID=15669941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15835981A Pending JPS5858716A (en) | 1981-10-05 | 1981-10-05 | Laminated ceramic condenser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5858716A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049621U (en) * | 1983-09-14 | 1985-04-08 | 松下電器産業株式会社 | multilayer ceramic capacitor |
JPH0375623U (en) * | 1989-11-27 | 1991-07-30 | ||
JPH03120119U (en) * | 1990-03-19 | 1991-12-10 | ||
WO2012114784A1 (en) * | 2011-02-24 | 2012-08-30 | 株式会社村田製作所 | Laminated ceramic electronic part, and method of manufacturing thereof |
-
1981
- 1981-10-05 JP JP15835981A patent/JPS5858716A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049621U (en) * | 1983-09-14 | 1985-04-08 | 松下電器産業株式会社 | multilayer ceramic capacitor |
JPH0375623U (en) * | 1989-11-27 | 1991-07-30 | ||
JPH03120119U (en) * | 1990-03-19 | 1991-12-10 | ||
WO2012114784A1 (en) * | 2011-02-24 | 2012-08-30 | 株式会社村田製作所 | Laminated ceramic electronic part, and method of manufacturing thereof |
JPWO2012114784A1 (en) * | 2011-02-24 | 2014-07-07 | 株式会社村田製作所 | Multilayer ceramic electronic component and manufacturing method thereof |
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