JPS5827302A - Chip element including resistor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-type element including a resistor such as a resistor chip or an OR composite element chip, and particularly relates to improvements in improving the reliability of a resistor against the environment.

FIG. 1 is a perspective view of a conventional resistor chip.

A pair of electrodes 2 are formed on the alumina substrate 1, and a resistor 3 is formed partially overlapping the electrodes 2.

In a resistor chip having such a structure, since the resistor 3 is exposed on the surface, it is very sensitive to the environment. For this reason, moisture resistance is particularly poor, and reliability against humidity is extremely low.

In order to cover this problem, a maintenance layer is sometimes formed with a glaze so as to affect the resistor 3, but this is not preferable as it increases the cost. In particular, resistor chips are traded at lower prices than other element chips, so
It is preferable to avoid cost increases due to such glazes as much as possible.

On the other hand, since the OR composite element chip includes a resistor and a capacitor in one element chip, it is convenient to handle and can be expected to have many uses. However, since the alumina substrate 1 is used to improve the resistor chip shown in FIG. 1 to form such an OR composite element chip, it is difficult to form a capacitor.

Therefore, the main object of the present invention is to provide a chip-type element including a highly reliable resistor at a low cost without exposing the resistor.

Another object of the present invention is to provide an OR composite element chip with improved reliability at a low cost, in which both the capacitance forming electrode and the resistor are not exposed.

In summary, this invention uses a ceramic layer lamination technique to form a resistor on 1III of a ceramic laminate,
This resistor extends only at both ends to the two end faces of the ceramic monolithic body, and has a structure in which first and second external electrodes are formed on each end face to be electrically connected to both ends of the resistor, respectively. It is a chip type element that includes a resistor.

Other objects and features of the present invention will become more apparent from the detailed description given below with reference to the drawings.

FIG. 2 is a cross-sectional structural diagram of an embodiment of the present invention. Third
The figure is an equivalent circuit diagram of the element shown in FIG. 2.

As is clear from FIG. 3, the element shown in FIG. 2 is a composite element chip in which CRs are connected in parallel.

In FIG. 2, the main body portion of the OR composite element chip 4 is composed of a ceramic laminate 6 composed of a plurality of ceramic layers 5. Since the ceramic layers 5 are sintered and integrated, the boundaries between the ceramic layers 5 are not particularly shown in FIG. 2. Each ceramic l! 5 is made of dielectric ceramic. A resistor 7, a first capacitor-forming internal electrode 8, and a second capacitor-forming internal electrode 9 are formed in each ceramic layer 5, respectively. The resistor 7 is formed to extend only at both ends to the two end surfaces 10 and 11 of the ceramic laminate 6, respectively. The first capacitance-forming internal electrode 8 is formed to extend to one end surface 10 of the ceramic laminate 6 .

The second capacitor-forming internal electrode 9 is formed to extend to the other end surface 11 of the ceramic laminate 6 . In addition, in the state of forming the resistor 7 and the capacitance forming internal electrode 8.9 just described, the two end faces 10.1 of the ceramic laminate 6
It should be pointed out that neither the resistor 7 nor the capacitance forming internal electrodes 8 and 9 are exposed on the end faces other than 1 (not shown). 1
1 includes first and second external electrodes 12 and 13, respectively.
is formed.

As a result, one end of the resistor 7 and the first capacitance forming internal electrode 8 are electrically connected to the first external electrode 12 . The second external electrode 13 is connected to the other end of the resistor 7 and the second external electrode 13.
It is electrically connected to the internal electrode 9 for forming a capacitance.

A specific method for manufacturing the OR composite element chip 4 shown in FIG. 2 will be explained. First, a dielectric ceramic material that is sintered at 850 to 1150°C is heated with a doctor blade for 20 minutes.
Mold to a thickness of ~100μ. A conductor for the capacitance forming internal electrode 8.9 and a resistor for the resistor 7 are screen printed on the molded ceramic green sheet,
Let it dry. Note that silver, palladium, or the like is used as a conductor for the internal electrode for forming a capacitance. Further, as the resistor, silver, palladium, palladium oxide, or the like is used. Silver and palladium can become resistors or conductors depending on the amount of glaze they contain. The ceramic green sheets dried as described above are laminated together, pressed, and cut appropriately. As a result, a green ceramic laminate is obtained. After firing this raw ceramic laminate, the external electrode 12.
13 conductors are provided. After that, this external electrode 1
2.13 is burned. In addition to being formed by applying silver as described above, the external electrode may be formed by nickel plating thereon, or by directly forming nickel by electroless plating. When direct electroless nickel plating is used, applying a resist makes it possible to form external electrodes only at desired locations.

FIG. 4 is a cross-sectional structural diagram of another embodiment of the present invention. FIG. 5 is an equivalent circuit diagram of the element shown in FIG. 4.

As is clear from FIG. 5, the element in FIG. 4 is a resistor chip 14.

The main body of this resistor chip 14 is also composed of a ceramic laminate 16 of laminated ceramic layers 15. A resistor 17 is formed in the area of the ceramic layer 15 . This resistor 17 also extends only at both ends to the two ends ff118, 19 of the ceramic laminate 16, respectively.

Each end face 18, 19 has a first and a second external voltage 1ii.
20.21 is formed. As a result, both ends of the resistor 17 are connected to the first and second external electrodes 20.2, respectively.
1 and is electrically connected. In addition, also in this example,
The resistor 17 is not exposed on the end faces except for the end faces 18° and 19.

114Fj! The resistor chip 14 shown at J is the OR of FIG.
It can be manufactured using techniques for manufacturing multi-element chips. Note that since this resistance chip 14 does not include an internal electrode for forming a capacitance, the ceramic layer 15
The ceramic material constituting the material does not necessarily have galvanic properties.

In this way, since the resistor is formed between the ceramic layer surfaces and not exposed to the outside, the resistance value iim of the resistor becomes a problem. However, the resistance value is generally adjusted by forming a resistor to a slightly smaller value in advance and then cutting it off. Therefore, it is desirable that the element of the present invention be able to adjust the resistance value in this way as well. FIG. 6 is a partial cross-sectional view of the element showing a method of adjusting the resistance value of the resistor. 6th
Some of the elements shown in the figure are the OR composite element chip 4 of FIG.
It will be explained as a part of. The outermost ceramic layer 5 on one side of the ceramic laminate 6 on which the resistor 7 is formed is scraped away, and the hole 22 formed there ends up scraping the resistor 7. by this,
The amount of resistor 7 is adjusted, and the resistance value can be adjusted accordingly. If it is not desired that a portion of the resistor 7 be exposed through the hole 22, only the hole 22 may be filled with glaze. Note that when considering such a method of adjusting the resistance value, it is preferable that the resistor is formed immediately inside the outermost ceramic layer.

As described above, according to the present invention, since the resistor is encapsulated in the ceramic layer, reliability of the resistor with respect to the environment can be improved.

Furthermore, since no glaze is used as a protective film, a chip-type element including an inexpensive resistor can be obtained. Furthermore, when this invention is applied to an OR composite element chip, the OR composite element can be obtained with the same effort as conventional multilayer capacitors, which is efficient. Further, according to the obtained OR composite element chip, the number of parts is reduced, and labor saving can be achieved.

In addition, in this invention, if a low m sintered ceramic material is used as the ceramic material constituting the ceramic layer, the resistor, the internal electrode for capacitance formation, and the external electrode can be formed at the same time as the ceramic is fired, which increases efficiency. It is true.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional resistor chip. FIG. 2 is a cross-sectional structural diagram of an embodiment of the present invention. 354 is an equivalent circuit diagram of the element shown in FIG. 2; 14
The figure is a cross-sectional structural diagram of another embodiment of the present invention. FIG. 5 is an equivalent circuit diagram of the element shown in FIG. 4. FIG. 6 is a partial cross-sectional view of the element showing a method of adjusting the resistance value of the resistor. In the figure, 4 is an OR composite element chip, 5 and 15 are ceramic layers, 6.16 is a ceramic laminate, 7.17 is a resistor, 8.9 is an internal electrode for forming a capacitance, and 10.11.18
．． 19 is the end surface, 12.13.20.21 is the external electrode, 1
4 is a resistor chip.

Claims (2)

[Claims] (1) A resistor is formed in the base of the ceramic laminate, which is constructed by laminating the first and second ceramic layers, and the resistor extends to the two end faces of the ceramic laminate only at both ends. A chip-shaped element including a resistor that extends and has first and second external electrodes formed on each end face thereof and electrically connected to both ends of a resistor. (2) At least one of the first and second ceramics 1 includes a plurality of contaminated dielectric ceramic layers, and the dielectric ceramic layer is electrically connected to the first external electrode. a first capacitance forming internal electrode extending to one end surface of the ceramic body 11 so as to
A second capacitance-forming internal electrode is formed which is paired with the capacitance-forming internal electrode and extends between the other ends of the ceramic body 11 so as to be electrically connected to the second external electrode. A chip-type element comprising a resistor according to item 1.